CN204311008U - 一种耐高温胶带 - Google Patents

一种耐高温胶带 Download PDF

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Publication number
CN204311008U
CN204311008U CN201420784243.4U CN201420784243U CN204311008U CN 204311008 U CN204311008 U CN 204311008U CN 201420784243 U CN201420784243 U CN 201420784243U CN 204311008 U CN204311008 U CN 204311008U
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high temperature
layer
sensitive adhesive
substrate layer
adhesive tape
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潘成诚
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ANHUI MINGXUN NEW MATERIAL TECHNOLOGY CO., LTD.
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SUZHOU BANLID NEW MATERIAL Co Ltd
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Abstract

本实用新型公开一种耐高温胶带,包括:基材层、增强带层以及压敏胶层,所述增强带层涂覆在所述基材层的一侧表面,所述压敏胶层涂覆在所述基材层的另一侧表面;所述基材层为聚酰亚胺薄膜层;所述增强带层为耐高温美纹纸带;所述压敏胶层为硅酮胶层。本实用新型所述耐高温胶带,具有理想的耐高温性能,在高温下使用时不收缩、不变形,且柔软服帖,可撕性好。

Description

一种耐高温胶带
技术领域
本实用新型涉及粘性保护膜领域,具体为一种耐高温胶带。
背景技术
目前,高温加工流程中,需要使用各种胶带作为遮蔽件的保护,现有的高温胶带由基材薄膜层上涂覆压敏层而成,这种结构的胶带基材为单层结构,使用这类胶带粘附于印刷电路板的小孔上作为遮蔽保护,并将印刷电路板送入过锡炉波峰焊时,容易出现收缩和脱落现象,会导致印刷电路板上的小孔裸露,从而导致印刷电路板的报废。
实用新型内容
针对上述技术问题,本实用新型公开一种耐高温胶带,包括:基材层、增强带层以及压敏胶层,所述增强带层涂覆在所述基材层的一侧表面,所述压敏胶层涂覆在所述基材层的另一侧表面;所述基材层为聚酰亚胺薄膜层;所述增强带层为耐高温美纹纸带;所述压敏胶层为硅酮胶层。
优选地,所述压敏胶层的厚度为0.04-0.0.06mm。
本实用新型的有益效果是所述耐高温胶带,具有理想的耐高温性能,在高温下使用时不收缩、不变形,且柔软服帖,可撕性好。
 附图说明
图1是本实用新型所述自剥离耐高温胶带的剖面结构示意图。
图中,1-基材层;2-增强带层;3-压敏胶层。
具体实施方式
下面结合附图对本实用新型做进一步的详细说明,以令本领域技术人员参照说明书文字能够据以实施。
如图所示,本实用新型公开一种耐高温胶带,包括:基材层1、增强带层2以及压敏胶层3,所述增强带层2涂覆在所述基材层1的一侧表面,所述压敏胶层3涂覆在所述基材层1的另一侧表面;所述基材层1为聚酰亚胺薄膜层;所述增强带层2为耐高温美纹纸带;所述压敏胶层3为硅酮胶层。所述压敏胶层3的厚度为0.04-0.0.06mm。所述耐高温胶带,具有理想的耐高温性能,在高温下使用时不收缩、不变形,且柔软服帖,可撕性好。
尽管本实用新型的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用,它完全可以被适用于各种适合本实用新型的领域,对于熟悉本领域的人员而言,可容易地实现另外的修改,因此在不背离权利要求及等同范围所限定的一般概念下,本实用新型并不限于特定的细节和这里示出与描述的图例。

Claims (2)

1.一种耐高温胶带,其特征在于,包括:基材层、增强带层以及压敏胶层,所述增强带层涂覆在所述基材层的一侧表面,所述压敏胶层涂覆在所述基材层的另一侧表面;所述基材层为聚酰亚胺薄膜层;所述增强带层为耐高温美纹纸带;所述压敏胶层为硅酮胶层。
2.根据权利要求1所述的耐高温胶带,其特征在于:所述压敏胶层的厚度为0.04-0.0.06mm。
CN201420784243.4U 2014-12-15 2014-12-15 一种耐高温胶带 Active CN204311008U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114206030A (zh) * 2021-12-06 2022-03-18 博罗县精汇电子科技有限公司 一种薄型软硬结合板的生产工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114206030A (zh) * 2021-12-06 2022-03-18 博罗县精汇电子科技有限公司 一种薄型软硬结合板的生产工艺

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Address before: Suzhou City, Jiangsu province 215000 Wuzhong District town of Lotus Village Du Village

Patentee before: SUZHOU BANLID NEW MATERIAL CO., LTD.