CN204160831U - The high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate - Google Patents
The high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate Download PDFInfo
- Publication number
- CN204160831U CN204160831U CN201420513187.0U CN201420513187U CN204160831U CN 204160831 U CN204160831 U CN 204160831U CN 201420513187 U CN201420513187 U CN 201420513187U CN 204160831 U CN204160831 U CN 204160831U
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- China
- Prior art keywords
- glass fabric
- paper
- resistance
- leakage current
- current index
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Abstract
The utility model relates to a kind of high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, it comprises refill, the upper and lower surface of refill is all laminating layer of glass cloth (1), the outer surface of layer glass fiber cloth (1) is all laminating Copper Foil (2), it is characterized in that described refill is composited by four layers of wood-fibred paper insulation paper (3), described wood-fibred paper insulation paper (3) comprises first of middle the first Dilvar zone (3.1) and both sides, front and back and to drip district (3.2), glass fabric (1) comprises second of middle the second Dilvar zone (1.1) and both sides, front and back and to drip district (1.2), the glass fabric (1) of described second Dilvar zone (1.1) is impregnated with the high epoxy resin of resistance to leakage current index.The utility model high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, good flame retardation effect, mechanical performance, dimensional stability, impact resistance, moisture resistance properties are high.
Description
Technical field
The utility model relates to a kind of high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, the main substrate being used as electronics printed circuit board.
Background technology
Copper-clad plate is the common used material of the substrate of electronics printed circuit board, but as making the substrate of outdoor electronic equipment printed circuit board (PCB), its needs have stronger fire-retardant ageing-resistant performance and moisture-proof humidity resistance.Conventional copper-clad plate is all phenolic aldehyde paper-based copper-coated boards, and its anti humility performance is poor and intensity is low, inflammable easily aging, thus makes components and parts easily aging, and service life shortens.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides that a kind of flame retardant type is good, moisture resistance properties is good, intensity is high, the height epoxy glass fabric of the resistance to leakage current index paper substrate composite copper-clad plate of good mechanical property.
The purpose of this utility model is achieved in that
A kind of high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, it comprises refill, the upper and lower surface of refill is all laminating layer of glass cloth, the outer surface of layer glass fiber cloth is all laminating Copper Foil, it is characterized in that described refill is composited by four layers of wood-fibred paper insulation paper, the upper and lower surface of described wood-fibred paper insulation paper is the first alligatoring face, described wood-fibred paper insulation paper bag is drawn together first of the first middle Dilvar zone and both sides, front and back and to be dripped district, the wood-fibred paper insulation paper of described first Dilvar zone is impregnated with novolac epoxy resin, the described first wood-fibred paper insulation paper dripping district is impregnated with clear water, the upper and lower surface of described glass fabric is the second alligatoring face, glass fabric comprises second of the second middle Dilvar zone and both sides, front and back and to drip district, the glass fabric of described second Dilvar zone is impregnated with the high epoxy resin of resistance to leakage current index, described second glass fabric dripping district is impregnated with clear water.
Compared with prior art, the beneficial effects of the utility model are:
The utility model high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, good flame retardation effect, mechanical performance, dimensional stability, impact resistance, moisture resistance properties are high.Its excellent electrical properties, operating temperature is higher, and performance own is affected by environment little, uses field extensive, is particularly suited for outdoor use.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model epoxy glass fabric paper substrate composite copper-clad plate.
Fig. 2 is the explosive view of Fig. 1.
Wherein:
Glass fabric 1, second Dilvar zone 1.1, second drips district 1.2
Copper Foil 2
Wood-fibred paper insulation paper 3, first Dilvar zone 3.1, first drips district 3.2.
Detailed description of the invention
See Fig. 1 and Fig. 2, the one that the utility model the relates to high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, it comprises refill, and the upper and lower surface of refill is all laminating glass fabric 1, and the outer surface of glass fabric 1 is laminating Copper Foil 2.Described refill is composited by delta wood fibrous paper insulating paper 3, refill shown in figure is that four layers of wood-fibred paper insulation paper 3 are composited, the upper and lower surface of described wood-fibred paper insulation paper 3 is the first alligatoring face, described wood-fibred paper insulation paper 3 comprises first of the first middle Dilvar zone 3.1 and both sides and to drip district 3.2, the wood-fibred paper insulation paper 3 of described first Dilvar zone 3.1 is impregnated with novolac epoxy resin, and the described first wood-fibred paper insulation paper 3 dripping district 3.2 is impregnated with clear water.
The upper and lower surface of described glass fabric 1 is the second alligatoring face, glass fabric 1 comprises second of the second middle Dilvar zone 1.1 and both sides and to drip district 1.2, the glass fabric 1 of described second Dilvar zone 1.1 is impregnated with the high epoxy resin of resistance to leakage current index, and the described second glass fabric 1 dripping district 1.2 is impregnated with clear water.
Claims (1)
1. the one kind high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate, it comprises refill, the upper and lower surface of refill is all laminating layer of glass cloth (1), the outer surface of layer glass fiber cloth (1) is all laminating Copper Foil (2), it is characterized in that described refill is composited by four layers of wood-fibred paper insulation paper (3), the upper and lower surface of described wood-fibred paper insulation paper (3) is the first alligatoring face, described wood-fibred paper insulation paper (3) comprises first of middle the first Dilvar zone (3.1) and both sides, front and back and to drip district (3.2), the wood-fibred paper insulation paper (3) of described first Dilvar zone (3.1) is impregnated with novolac epoxy resin, the described first wood-fibred paper insulation paper (3) dripping district (3.2) is impregnated with clear water, the upper and lower surface of described glass fabric (1) is the second alligatoring face, glass fabric (1) comprises second of middle the second Dilvar zone (1.1) and both sides, front and back and to drip district (1.2), the glass fabric (1) of described second Dilvar zone (1.1) is impregnated with the high epoxy resin of resistance to leakage current index, described second glass fabric (1) dripping district (1.2) is impregnated with clear water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420513187.0U CN204160831U (en) | 2014-09-09 | 2014-09-09 | The high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420513187.0U CN204160831U (en) | 2014-09-09 | 2014-09-09 | The high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204160831U true CN204160831U (en) | 2015-02-18 |
Family
ID=52534553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420513187.0U Expired - Fee Related CN204160831U (en) | 2014-09-09 | 2014-09-09 | The high epoxy glass fabric of resistance to leakage current index paper substrate composite copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204160831U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172807A (en) * | 2017-06-09 | 2017-09-15 | 深圳中富电路有限公司 | A kind of printed circuit board |
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
-
2014
- 2014-09-09 CN CN201420513187.0U patent/CN204160831U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172807A (en) * | 2017-06-09 | 2017-09-15 | 深圳中富电路有限公司 | A kind of printed circuit board |
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20190909 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |