CN208962612U - A kind of high dielectric constant double side flexible copper coated board - Google Patents
A kind of high dielectric constant double side flexible copper coated board Download PDFInfo
- Publication number
- CN208962612U CN208962612U CN201821005718.XU CN201821005718U CN208962612U CN 208962612 U CN208962612 U CN 208962612U CN 201821005718 U CN201821005718 U CN 201821005718U CN 208962612 U CN208962612 U CN 208962612U
- Authority
- CN
- China
- Prior art keywords
- dielectric constant
- high dielectric
- layer
- copper
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 239000011889 copper foil Substances 0.000 claims abstract description 48
- 229920001721 polyimide Polymers 0.000 claims abstract description 34
- 239000004642 Polyimide Substances 0.000 claims abstract description 31
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 26
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 25
- 239000007800 oxidant agent Substances 0.000 claims abstract description 25
- 230000001590 oxidative effect Effects 0.000 claims abstract description 25
- 239000000945 filler Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229920006332 epoxy adhesive Polymers 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000003490 calendering Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 85
- 238000000034 method Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821005718.XU CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821005718.XU CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208962612U true CN208962612U (en) | 2019-06-11 |
Family
ID=66748228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821005718.XU Active CN208962612U (en) | 2018-06-26 | 2018-06-26 | A kind of high dielectric constant double side flexible copper coated board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208962612U (en) |
-
2018
- 2018-06-26 CN CN201821005718.XU patent/CN208962612U/en active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high dielectric constant double-sided flexible copper clad laminate Effective date of registration: 20211216 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230106 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A kind of double-sided flexible copper clad plate with high dielectric constant Effective date of registration: 20230109 Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high dielectric constant double-sided flexible copper clad plate Granted publication date: 20190611 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980007119 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |