Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, the utility model is described in further detail.
Embodiment mono-:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, and flexible base, board 1, described flexible base, board 1 is polyethylene terephthalate (PET, polyethylene terephthalate); Top electrode 3, described top electrode 3 is gold (Au) or copper (Cu) metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Au or Cu metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is chromium (Cr) or titanium (Ti) metallic film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface at described PET flexible base, board forms on Cr or Ti metallic film and connects rete by the method for magnetron sputtering or electron beam evaporation, described Cr or Ti thickness of metal film are 50~100nm, be preferably 50nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by chemical solution etching method etching.
The upper surface sputter Au of articulamentum or Cu metallic film form top electrode rete on described, described Au or Cu thickness of metal film are 100~500nm, be preferably 200nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by chemical solution etching method etching.
By the method for magnetron sputtering or electron beam evaporation, form lower connection rete at the lower surface of described flexible base, board, described lower connection rete is made up of Cr or Ti metallic film, described Cr or Ti thickness of metal film are 50~100nm, be preferably 50nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by chemical solution etching method etching.
Lower surface sputter Au or Cu metallic film at described lower articulamentum are prepared bottom electrode rete, described Au or Cu thickness of metal film are 100~500nm, be preferably 200nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by chemical solution etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment bis-:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is polyimide (PI, polyimide); Top electrode 3, described top electrode 3 is Au or Cu metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Au or Cu metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is Cr or Ti metallic film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface at described PI flexible base, board forms on Cr or Ti metallic film and connects rete by the method for magnetron sputtering or electron beam evaporation, described Cr or Ti thickness of metal film are 200~300nm, be preferably 200nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by physical dry etching method etching.
The upper surface sputter Au of articulamentum or Cu metallic film form top electrode rete on described, described Au or Cu thickness of metal film are 800~1300nm, be preferably 1000nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by physical dry etching method etching.
By the method for magnetron sputtering or electron beam evaporation, form lower connection rete at the lower surface of described flexible base, board, described lower connection rete is made up of Cr or Ti metallic film, described Cr or Ti thickness of metal film are 200~300nm, be preferably 200nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by physical dry etching method etching.
Lower surface sputter Au or Cu metallic film at described lower articulamentum are prepared bottom electrode rete, described Au or Cu thickness of metal film are 800~1300nm, be preferably 1000nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by physical dry etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment tri-:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is dimethyl silicone polymer (PDMS); Top electrode 3, described top electrode 3 is Au or Cu metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Au or Cu metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is Cr or Ti metallic film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface at described PDMS flexible base, board forms on Cr or Ti metallic film and connects rete by the method for magnetron sputtering or electron beam evaporation, described Cr or Ti thickness of metal film are 200~300nm, be preferably 200nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by physical dry etching method etching.
The upper surface sputter Au of articulamentum or Cu metallic film form top electrode rete on described, described Au or Cu thickness of metal film are 800~1300nm, be preferably 1000nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by physical dry etching method etching.
By the method for magnetron sputtering or electron beam evaporation, form lower connection rete at the lower surface of described flexible base, board, described lower connection rete is made up of Cr or Ti metallic film, described Cr or Ti thickness of metal film are 400~500nm, be preferably 500nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by physical dry etching method etching.
Lower surface sputter Au or Cu metallic film at described lower articulamentum are prepared bottom electrode rete, described Au or Cu thickness of metal film are 1500~2000nm, be preferably 2000nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by physical dry etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment tetra-:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is PET; Top electrode 3, described top electrode 3 is platinum (Pt) or silver (Ag) metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Pt or Ag metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is Cu or tungsten (W) metallic film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface at described PET flexible base, board forms on Cu or W metallic film and connects rete by the method for magnetron sputtering or electron beam evaporation, described Cu or W thickness of metal film are 50~200nm, be preferably 150nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by chemical solution etching method etching.
The upper surface sputter Pt of articulamentum or Ag metallic film form top electrode rete on described, described Pt or Ag thickness of metal film are 100~800nm, be preferably 400nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by chemical solution etching method etching.
By the method for magnetron sputtering or electron beam evaporation, form lower connection rete at the lower surface of described flexible base, board, described lower connection rete is made up of Cu or W metallic film, described Cu or W thickness of metal film are 50~200nm, be preferably 150nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by chemical solution etching method etching.
Lower surface sputter Pt or Ag metallic film at described lower articulamentum are prepared bottom electrode rete, described Pt or Ag thickness of metal film are 100~800nm, be preferably 400nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by chemical solution etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment five:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is PI; Top electrode 3, described top electrode 3 is Pt or Ag metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Pt or Ag metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is Cu or W metallic film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface at described PI flexible base, board forms on Cu or W metallic film and connects rete by the method for magnetron sputtering or electron beam evaporation, described Cu or W thickness of metal film are 300~500nm, be preferably 400nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by chemical solution etching method etching.
The upper surface sputter Pt of articulamentum or Ag metallic film form top electrode rete on described, described Pt or Ag thickness of metal film are 1000~2000nm, be preferably 1500nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by chemical solution etching method etching.
By the method for magnetron sputtering or electron beam evaporation, form lower connection rete at the lower surface of described flexible base, board, described lower connection rete is made up of Cu or W metallic film, described Cu or W thickness of metal film are 300~500nm, be preferably 400nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by chemical solution etching method etching.
Lower surface sputter Pt or Ag metallic film at described lower articulamentum are prepared bottom electrode rete, described Pt or Ag thickness of metal film are 1000~2000nm, be preferably 1500nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by chemical solution etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment six:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is PI; Top electrode 3, described top electrode 3 is Pt or Au metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Pt or Au metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is PDMS or polymethylmethacrylate (PMMA, polymethylmethacrylate) organic thin film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface high speed spin coating PDMS or PMMA organic thin film at described PI flexible base, board form top electrode rete, to keep the organic homogeneity of described PI flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 100~200nm, be preferably 100nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by physical dry etching method etching.
The upper surface sputter Pt of articulamentum or Au metallic film form top electrode rete on described, described Pt or Au thickness of metal film are 200~600nm, be preferably 300nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by physical dry etching method etching.
Lower surface high speed spin coating PDMS or PMMA organic thin film formation top electrode rete with spin-coating method at described flexible base, board, to keep the organic homogeneity of described PI flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 100~200nm, be preferably 100nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by physical dry etching method etching.
Lower surface sputter Pt or Au metallic film at described lower articulamentum are prepared bottom electrode rete, described Pt or Au thickness of metal film are 200~600nm, be preferably 300nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by physical dry etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment seven:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is PDMS; Top electrode 3, described top electrode 3 is Pt or Au metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Pt or Au metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is PDMS or PMMA organic thin film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface high speed spin coating PDMS or PMMA organic thin film at described PDMS flexible base, board form top electrode rete, to keep the organic homogeneity of described PDMS flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 250~350nm, be preferably 300nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by physical dry etching method etching.
The upper surface sputter Pt of articulamentum or Au metallic film form top electrode rete on described, described Pt or Au thickness of metal film are 900~1400nm, be preferably 1200nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by physical dry etching method etching
Lower surface high speed spin coating PDMS or PMMA organic thin film formation top electrode rete with spin-coating method at described flexible base, board, to keep the organic homogeneity of described PDMS flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 250~350nm, be preferably 300nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by physical dry etching method etching.
Lower surface sputter Pt or Au metallic film at described lower articulamentum are prepared bottom electrode rete, described Pt or Au thickness of metal film are 900~1400nm, be preferably 1200nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by physical dry etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Embodiment eight:
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the utility model flexible capacitance type acceleration transducer, as shown in Figure 2, flexible base, board 1, described flexible base, board 1 is PET; Top electrode 3, described top electrode 3 is Pt or Au metallic film, is located at the upper surface of described flexible base, board 1; Bottom electrode 5, described bottom electrode 5 is Pt or Au metallic film, is located at the lower surface of described flexible base, board 1; Articulamentum, described articulamentum is PDMS or PMMA organic thin film, it comprises articulamentum 2 and lower articulamentum 4, described upper articulamentum 2 is located between described flexible base, board 1 and top electrode 3 and is connected described flexible base, board 1 and top electrode 3, and described lower articulamentum 4 is located between described flexible base, board 1 and bottom electrode 5 and is connected described flexible base, board 1 and bottom electrode 5.
Wherein, Fig. 3 is the vertical view of flexible capacitance type acceleration transducer of the present utility model, as shown in Figure 3, described top electrode 3 is provided with pin part 6, described bottom electrode 5 is also correspondingly provided with pin part (this part is not shown, but corresponding with top electrode pin part 6), and described pin part forms by upper and lower electrode being carried out respectively to gold thread binding, described pin part is connected with peripheral circuit and is encapsulated on circuit board, draw for signal.
Upper surface high speed spin coating PDMS or PMMA organic thin film at described PET flexible base, board form top electrode rete, to keep the organic homogeneity of described PET flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 350~500nm, be preferably 500nm, then described upper connection rete is made into upper articulamentum by litho pattern metallization processes, then removes unnecessary upper articulamentum material by physical dry etching method etching.
The upper surface sputter Pt of articulamentum or Au metallic film form top electrode rete on described, described Pt or Au thickness of metal film are 1600~2000nm, be preferably 2000nm, and described top electrode rete is made into top electrode by litho pattern metallization processes, then remove unnecessary upper electrode material by physical dry etching method etching.
Lower surface high speed spin coating PDMS or PMMA organic thin film formation top electrode rete with spin-coating method at described flexible base, board, to keep the organic homogeneity of described PET flexible base, board surface institute spin coating, described PDMS or PMMA organic thin film thickness are 350~500nm, be preferably 500nm, then described lower connection rete is made into lower articulamentum by litho pattern metallization processes, then removes unnecessary lower articulamentum material by physical dry etching method etching.
Lower surface sputter Pt or Au metallic film at described lower articulamentum are prepared bottom electrode rete, described Pt or Au thickness of metal film are 1600~2000nm, be preferably 2000nm, and described bottom electrode rete is made into bottom electrode by litho pattern metallization processes, then remove unnecessary lower electrode material by physical dry etching method etching.
In the time having extraneous acceleration force to put on the flexible capacitance type acceleration transducer of the utility model embodiment, flexible base, board 1 can receive this acceleration force, make flexible base, board 1 that deformation occur, thereby the relative position of top electrode 3 and bottom electrode 5 changes, and then the area that causes capacitor element changes, capacitance in polar-plate-type electric capacity is changed thereupon, pin part by upper and lower electrode is connected with external circuit, utilize electronic component that the capacitance variation amount receiving is carried out to signal processing, to obtain the size of acceleration force to be measured.
Flexible capacitance type acceleration transducer in above embodiment is that MEMS device is directly produced on flexible base, board, technique and simple in structure, cost is lower, the acceleration transducer of manufacturing can be applied on the body surface of any type, shape and size, articulamentum of the present utility model is selected the material excellent with flexible base, board cohesiveness performance in addition, electrode and flexible base, board are bondd preferably, solved at present a lot of component failures and be all and the poor technical matters of the direct adhesion of substrate.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.