CN104142409B - A kind of flexible capacitance type acceleration transducer and its manufacture method - Google Patents
A kind of flexible capacitance type acceleration transducer and its manufacture method Download PDFInfo
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- CN104142409B CN104142409B CN201410345761.0A CN201410345761A CN104142409B CN 104142409 B CN104142409 B CN 104142409B CN 201410345761 A CN201410345761 A CN 201410345761A CN 104142409 B CN104142409 B CN 104142409B
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Abstract
The present invention relates to acceleration analysis technical field, discloses a kind of flexible capacitance type acceleration transducer, including：Flexible base board；Top electrode, arranged on the upper surface of the flexible base board；Bottom electrode, arranged on the lower surface of the flexible base board；Articulamentum, it includes articulamentum and lower articulamentum, the upper articulamentum is arranged between the flexible base board and top electrode and connects the flexible base board and top electrode, and the lower articulamentum is arranged between the flexible base board and bottom electrode and connects the flexible base board and bottom electrode.It is used to manufacture above-mentioned flexible capacitance type acceleration transducer method the invention also discloses one kind.The present invention directly makes MEMS device on flexible substrates, technique and simple in structure, and cost is relatively low, and obtained acceleration transducer can be applied on the body surface of any type, shape and size.
Description
Technical field
The present invention relates to acceleration analysis technical field, more particularly to a kind of height prepared based on MEMS micro-nano technologies technology
Sensitivity flexible capacitance type acceleration transducer.
Background technology
Acceleration transducer is a kind of electronic equipment that can measure acceleration, closely bound up with the life of the mankind.At present
The application field of acceleration transducer is more and more extensive, such as automotive safety (air bag, anti-lock braking system and pull-in control system),
Game control, image automatic turning and pedometer etc..From the rapid of eighties of last century the eighties MEMS (MEMS) technology
Development, more and more advanced technologies and equipment are appeared in all trades and professions, and with integrated circuit and semicon industry
Fast development, preparing micro-nano sensor using new technique also becomes one of global research hotspot.Utilize MEMS skill
Miniature acceleration sensor prepared by art has the advantages that small, low in energy consumption and light-weight, and cost is relatively low,
More fields especially consumer electronics field has wider application.
Acceleration transducer can be divided into following type according to operation principle：Piezoresistance type acceleration sensor, piezoelectric type
Acceleration transducer, resonant mode acceleration transducer and capacitance acceleration transducer.Wherein, capacitance acceleration transducer
Advantage is high sensitivity, low temperature effects and with power dissipation, has obtained substantial amounts of concern and research in recent years.Capacitance measurement
Gap between two surfaces of sensor-based a pair of electrodes changes, and the capacitance between the two surfaces depends on surface area
The distance between they.
Please refer to Fig.1, Fig. 1 is the diagrammatic cross-section of the existing condenser type acceleration sensor 30 based on MEMS.Such as Fig. 1 institutes
Showing, existing condenser type acceleration sensor 30 mainly has a non-monocrystalline silicon substrate 32, such as substrate of glass or a quartz substrate, and one
Cantilever beam texture 34, it has a polysilicon beam texture 36 and a polysilicon supporting member 38, polysilicon supporting member 38
In non-monocrystalline silicon substrate 32, for fixing polysilicon beam texture 36, and make polysilicon beam texture 36 and amorphous silicon substrate
There is a distance, and polysilicon beam texture 36 has a movable end, and a movable electrode is arranged with movable end between bottom 32
40, one, which fixes electrode 42, is arranged in the non-monocrystalline silicon substrate 32 of the lower section of movable electrode 40, and movable electrode 40 divides with fixed electrode 42
Yong Lai not be as the upper/lower electrode of a capacity plate antenna 44 of condenser type acceleration sensor 30, and a control circuit, such as film
Transistor (TFT, Thin Film Transistor) control circuit 46 is arranged in non-monocrystalline silicon substrate 32, and is electrically connected to cantilever
Beam texture 34 and capacity plate antenna 44, for receiving, handling and transmitting the signal that capacity plate antenna 44 is exported.
When the acceleration of vertical direction puts on existing condenser type acceleration sensor 30, arranged on polysilicon beam texture
The movable electrode 40 of 36 movable end can receive the power of vertical direction so that the movable end of polysilicon beam texture 36 produces curved
The vibration of bent pattern, and relative position change is produced between fixed electrode 42, also so that the capacitance in capacity plate antenna 44 therewith
Change, by TFT control circuits 46 using a differential amplifier or other electronic components by the capacitance variation amount received into
Row signal processing, to obtain the size of acceleration force to be measured.Further, since amorphous silicon base 32 can be made of quartz, and stone
English fusing point is higher, therefore the TFT control circuits 46 of existing invention can be a high temperature polysilicon TFT control circuits.
But existing condenser type acceleration sensor is produced in the rigid material substrate such as glass and quartz, the device of making
It is the rigid structure that cannot be folding or bending over, so that measurement of the MEMS sensor on curved face object surface is limited, and existing
Condenser type acceleration sensor, when substrate for quartz when, since quartzy fusing point is higher, it is desirable to which TFT control circuits are high temperature polysilicon
Silicon TFT control circuits, add manufacture cost, in addition, its processing technology and structure are relatively complicated.Therefore, how to manufacture
Go out a kind of technique and simple in structure, cost is relatively low and can be flexibly applied to the capacitance acceleration of different objects surface measurement sensing
Device is research topic important at present.
The content of the invention
The technical problems to be solved by the invention be how to overcome existing condenser type acceleration sensor cannot fold or
The defects of bending, manufacturing higher cost and processing technology and relatively complicated structure.
In order to solve the above technical problem, the present invention provides a kind of flexible capacitance type acceleration for being used to measure acceleration
Sensor, it includes：
Flexible base board；Top electrode, arranged on the upper surface of the flexible base board；Bottom electrode, under the flexible base board
Surface；Articulamentum, it includes articulamentum and lower articulamentum, and the upper articulamentum is arranged between the flexible base board and top electrode
And the flexible base board and top electrode are connected, the lower articulamentum is arranged between the flexible base board and bottom electrode and described in connection
Flexible base board and bottom electrode.
Wherein, the top electrode and bottom electrode are both provided with pin portions, and the pin portions are used to connect with peripheral circuit
Connect；The articulamentum is made of organic thin film or metallic film；The articulamentum is by the material excellent with flexible base board adhesive property
Material is made.
Preferably, the thickness of the upper articulamentum and lower articulamentum is 50~500nm.
Preferably, the top electrode and bottom electrode are formed by the metallic film that thickness is 100~2000nm.
Correspondingly, present invention also offers a kind of method for manufacturing the flexible capacitance type acceleration transducer, including with
Lower step：
S1, cleaned and dried to flexible base board；
S2, form in the upper surface of the flexible base board and connect film layer, and the upper connection film layer is fabricated to upper company
Connect layer；
S3, the upper surface of articulamentum forms top electrode film layer on described, and the top electrode film layer is fabricated to and is powered on
Pole；
S4, form lower connection film layer in the lower surface of the flexible base board, and the lower connection film layer is fabricated to lower company
Connect layer；
S5, prepare bottom electrode film layer in the lower surface of the lower articulamentum, and the bottom electrode film layer is fabricated to lower electricity
Pole.
Wherein, the pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, will described in
Pin portions are attached with peripheral circuit, and are encapsulated on circuit boards.Preferably, in the step S2 and S4, respectively soft
Property substrate upper and lower surface metallic film or organic thin film are formed by the way of physical deposition or spin coating, with formed
The upper connection film layer and lower connection film layer；The upper and lower electrode and articulamentum are led to by upper and lower electrode film layer and connection film layer
Cross MEMS patterning process and prepare gained.
Flexible capacitance type acceleration transducer of the present invention and preparation method thereof, has the advantages that：The present invention will
MEMS device directly makes on flexible substrates, has certain deformability, which can carry out a degree of folding
Folded or bending, its technique and simple in structure, cost is relatively low, and obtained acceleration transducer can be applied in any type, shape
On shape and the body surface of size, in addition articulamentum of the invention causes electrode preferably to be bonded with flexible base board, solves mesh
Preceding many component failures are all directly in conjunction with the poor technical problem of power with substrate.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of existing capacitance acceleration transducer；
Fig. 2 is the diagrammatic cross-section of the flexible capacitance type acceleration transducer of the present invention；
Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention.
In figure：30- semiconductor acceleration sensors, 32- non-monocrystalline silicon substrates, 34- cantilever beam textures, 36- polysilicon beams
Shape structure, 38- polysilicon supporting members, 40- movable electrodes, 42- fix electrode, 44- capacity plate antennas, 1- flexible base boards, on 2-
Articulamentum, 3- top electrodes, articulamentum under 4-, 5- bottom electrodes, 6- pin portions.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with attached drawing
It is described in detail on step ground.
Embodiment one：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is polyethylene terephthalate (PET, polyethylene
terephthalate)；Top electrode 3, the top electrode 3 is golden (Au) or copper (Cu) metallic film, arranged on the flexible base board 1
Upper surface；Bottom electrode 5, the bottom electrode 5 is Au or Cu metallic films, arranged on the lower surface of the flexible base board 1；Connection
Layer, the articulamentum is chromium (Cr) or titanium (Ti) metallic film, it includes articulamentum 2 and lower articulamentum 4, the upper connection
Layer 2 is arranged between the flexible base board 1 and top electrode 3 and connects the flexible base board 1 and top electrode 3, and the lower articulamentum 4 is set
Between the flexible base board 1 and bottom electrode 5 and connect the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PET flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, the PET flexible base boards upper surface magnetron sputtering or electron beam evaporation method formed Cr or Ti
Film layer is connected on metallic film, Cr the or Ti thickness of metal film is 50~100nm, be preferably 50nm, then will be described on
Connection film layer is fabricated to upper articulamentum by photolithography patterning technique, then removes unnecessary upper company with chemical solution etching method etching
Connect layer material；
S3, the upper surface sputtering Au or Cu metallic films of articulamentum form top electrode film layer, the Au or Cu on described
Thickness of metal film is 100~500nm, is preferably 200nm, and the top electrode film layer is made by photolithography patterning technique
Unnecessary upper electrode material is removed into top electrode, then with chemical solution etching method etching；
S4, the method with magnetron sputtering or electron beam evaporation, lower junctional membrane is formed in the lower surface of the flexible base board
Layer, the lower connection film layer are made of Cr or Ti metallic films, Cr the or Ti thickness of metal film is 50~100nm, preferably
For 50nm, the lower connection film layer is then fabricated to lower articulamentum by photolithography patterning technique, then etched with chemical solution
Method etching removes unnecessary lower connection layer material；
S5, in the lower surface of the lower articulamentum, sputtering Au or Cu metallic films prepare bottom electrode film layer, the Au or Cu
Thickness of metal film is 100~500nm, is preferably 200nm, and the bottom electrode film layer is made by photolithography patterning technique
Unnecessary lower electrode material is removed into bottom electrode, then with chemical solution etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment two：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is polyimides (PI, polyimide)；Top electrode 3, the top electrode 3 for Au or
Cu metallic films, arranged on the upper surface of the flexible base board 1；Bottom electrode 5, the bottom electrode 5 are Au or Cu metallic films, are arranged on
The lower surface of the flexible base board 1；Articulamentum, the articulamentum are Cr or Ti metallic films, it includes articulamentum 2 and lower company
Layer 4 is connect, the upper articulamentum 2 is arranged between the flexible base board 1 and top electrode 3 and connects the flexible base board 1 and top electrode
3, the lower articulamentum 4 is arranged between the flexible base board 1 and bottom electrode 5 and connects the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PI flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, the PI flexible base boards upper surface magnetron sputtering or electron beam evaporation method formed Cr or Ti gold
Belong to film on connect film layer, Cr the or Ti thickness of metal film be 200~300nm, preferably 200nm, then will be described on
Connection film layer is fabricated to upper articulamentum by photolithography patterning technique, then removes unnecessary upper company with physical dry etching method etching
Connect layer material；
S3, the upper surface sputtering Au or Cu metallic films of articulamentum form top electrode film layer, the Au or Cu on described
Thickness of metal film is 800~1300nm, is preferably 1000nm, and the top electrode film layer is passed through photolithography patterning technique system
Top electrode is made, then unnecessary upper electrode material is removed with physical dry etching method etching；
S4, the method with magnetron sputtering or electron beam evaporation, lower junctional membrane is formed in the lower surface of the flexible base board
Layer, the lower connection film layer are made of Cr or Ti metallic films, Cr the or Ti thickness of metal film is 200~300nm, preferably
For 200nm, the lower connection film layer is then fabricated to lower articulamentum by photolithography patterning technique, then etched with physical dry
Method etching removes unnecessary lower connection layer material；
S5, in the lower surface of the lower articulamentum, sputtering Au or Cu metallic films prepare bottom electrode film layer, the Au or Cu
Thickness of metal film is 800~1300nm, is preferably 1000nm, and the bottom electrode film layer is passed through photolithography patterning technique system
Bottom electrode is made, then unnecessary lower electrode material is removed with physical dry etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment three：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is dimethyl silicone polymer (PDMS)；Top electrode 3, the top electrode 3 are Au or Cu
Metallic film, arranged on the upper surface of the flexible base board 1；Bottom electrode 5, the bottom electrode 5 is Au or Cu metallic films, arranged on institute
State the lower surface of flexible base board 1；Articulamentum, the articulamentum are Cr or Ti metallic films, it includes articulamentum 2 and lower connection
Layer 4, the upper articulamentum 2 are arranged between the flexible base board 1 and top electrode 3 and connect the flexible base board 1 and top electrode 3,
The lower articulamentum 4 is arranged between the flexible base board 1 and bottom electrode 5 and connects the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PDMS flexible base boards, is generally cleaned, spent with isopropanol, acetone and EtOH Sonicate
Ionized water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, the PDMS flexible base boards upper surface magnetron sputtering or electron beam evaporation method formed Cr or Ti
Film layer is connected on metallic film, Cr the or Ti thickness of metal film is 200~300nm, is preferably 200nm, then by described in
Upper connection film layer is fabricated to upper articulamentum by photolithography patterning technique, then is removed with physical dry etching method etching unnecessary upper
Connect layer material；
S3, the upper surface sputtering Au or Cu metallic films of articulamentum form top electrode film layer, the Au or Cu on described
Thickness of metal film is 800~1300nm, is preferably 1000nm, and the top electrode film layer is passed through photolithography patterning technique system
Top electrode is made, then unnecessary upper electrode material is removed with physical dry etching method etching；
S4, the method with magnetron sputtering or electron beam evaporation, lower junctional membrane is formed in the lower surface of the flexible base board
Layer, the lower connection film layer are made of Cr or Ti metallic films, Cr the or Ti thickness of metal film is 400~500nm, preferably
For 500nm, the lower connection film layer is then fabricated to lower articulamentum by photolithography patterning technique, then etched with physical dry
Method etching removes unnecessary lower connection layer material；
S5, in the lower surface of the lower articulamentum, sputtering Au or Cu metallic films prepare bottom electrode film layer, the Au or Cu
Thickness of metal film is 1500~2000nm, is preferably 2000nm, and the bottom electrode film layer is passed through photolithography patterning technique
Bottom electrode is fabricated to, then unnecessary lower electrode material is removed with physical dry etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Example IV：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is PET；Top electrode 3, the top electrode 3 are platinum (Pt) or silver-colored (Ag) metallic film,
Arranged on the upper surface of the flexible base board 1；Bottom electrode 5, the bottom electrode 5 are Pt or Ag metallic films, arranged on the flexible base
The lower surface of plate 1；Articulamentum, the articulamentum are Cu or tungsten (W) metallic film, it includes articulamentum 2 and lower articulamentum 4,
The upper articulamentum 2 is arranged between the flexible base board 1 and top electrode 3 and connects the flexible base board 1 and top electrode 3, described
Lower articulamentum 4 is arranged between the flexible base board 1 and bottom electrode 5 and connects the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PET flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, the PET flexible base boards upper surface magnetron sputtering or electron beam evaporation method formed Cu or W gold
Belong to and connect film layer on film, Cu the or W thickness of metal film is 50~200nm, is preferably 150nm, then by the upper company
Connect film layer and upper articulamentum is fabricated to by photolithography patterning technique, then unnecessary upper connection is removed with chemical solution etching method etching
Layer material；
S3, the upper surface sputtering Pt or Ag metallic films of articulamentum form top electrode film layer, the Pt or Ag on described
Thickness of metal film is 100~800nm, is preferably 400nm, and the top electrode film layer is made by photolithography patterning technique
Unnecessary upper electrode material is removed into top electrode, then with chemical solution etching method etching；
S4, the method with magnetron sputtering or electron beam evaporation, lower junctional membrane is formed in the lower surface of the flexible base board
Layer, the lower connection film layer are made of Cu or W metallic films, Cu the or W thickness of metal film is 50~200nm, is preferably
150nm, is then fabricated to lower articulamentum by the lower connection film layer by photolithography patterning technique, then with chemical solution etching method
Etching removes unnecessary lower connection layer material；
S5, in the lower surface of the lower articulamentum, sputtering Pt or Ag metallic films prepare bottom electrode film layer, the Pt or Ag
Thickness of metal film is 100~800nm, is preferably 400nm, and the bottom electrode film layer is made by photolithography patterning technique
Unnecessary lower electrode material is removed into bottom electrode, then with chemical solution etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment five：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is PI；Top electrode 3, the top electrode 3 is Pt or Ag metallic films, arranged on described soft
The upper surface of property substrate 1；Bottom electrode 5, the bottom electrode 5 is Pt or Ag metallic films, arranged on the following table of the flexible base board 1
Face；Articulamentum, the articulamentum are Cu or W metallic films, it includes articulamentum 2 and lower articulamentum 4, the upper articulamentum
2 are arranged between the flexible base board 1 and top electrode 3 and connect the flexible base board 1 and top electrode 3, and the lower articulamentum 4 is arranged on
Between the flexible base board 1 and bottom electrode 5 and connect the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PI flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, the PI flexible base boards upper surface magnetron sputtering or electron beam evaporation method formed Cu or W gold
Belong to and connect film layer on film, Cu the or W thickness of metal film is 300~500nm, is preferably 400nm, then by the upper company
Connect film layer and upper articulamentum is fabricated to by photolithography patterning technique, then unnecessary upper connection is removed with chemical solution etching method etching
Layer material；
S3, the upper surface sputtering Pt or Ag metallic films of articulamentum form top electrode film layer, the Pt or Ag on described
Thickness of metal film is 1000~2000nm, is preferably 1500nm, and the top electrode film layer is passed through photolithography patterning technique
Top electrode is fabricated to, then unnecessary upper electrode material is removed with chemical solution etching method etching；
S4, the method with magnetron sputtering or electron beam evaporation, lower junctional membrane is formed in the lower surface of the flexible base board
Layer, the lower connection film layer are made of Cu or W metallic films, Cu the or W thickness of metal film is 300~500nm, is preferably
400nm, is then fabricated to lower articulamentum by the lower connection film layer by photolithography patterning technique, then with chemical solution etching method
Etching removes unnecessary lower connection layer material；
S5, in the lower surface of the lower articulamentum, sputtering Pt or Ag metallic films prepare bottom electrode film layer, the Pt or Ag
Thickness of metal film is 1000~2000nm, is preferably 1500nm, and the bottom electrode film layer is passed through photolithography patterning technique
Bottom electrode is fabricated to, then unnecessary lower electrode material is removed with chemical solution etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment six：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is PI；Top electrode 3, the top electrode 3 is Pt or Au metallic films, arranged on described soft
The upper surface of property substrate 1；Bottom electrode 5, the bottom electrode 5 is Pt or Au metallic films, arranged on the following table of the flexible base board 1
Face；Articulamentum, the articulamentum are that PDMS or polymethyl methacrylate (PMMA, polymethyl methacrylate) have
Machine thing film, it includes articulamentum 2 and lower articulamentum 4, the upper articulamentum 2 be arranged on the flexible base board 1 and top electrode 3 it
Between and connect the flexible base board 1 and top electrode 3, the lower articulamentum 4 is arranged between the flexible base board 1 and bottom electrode 5 simultaneously
Connect the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, and Fig. 3 is the flexible electrical of the present invention
The top view of appearance formula acceleration transducer, as shown in figure 3, the top electrode 3 is provided with pin portions 6, the bottom electrode 5 also phase
Should be provided with pin portions (not shown in this part figure, but corresponding with top electrode pin portions 6), the pin portions with it is outer
Enclose circuit to be attached, drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PI flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, upper surface high speed spin coating PDMS or PMMA organic thin film the formation upper electrode film in the PI flexible base boards
Layer, to keep the uniformity of the organic matter of PI flexible base boards surface institute spin coating, PDMS the or PMMA organic thin films are thick
Spend for 100~200nm, be preferably 100nm, the upper connection film layer is then fabricated to upper connection by photolithography patterning technique
Layer, then remove unnecessary upper connection layer material with physical dry etching method etching；
S3, the upper surface sputtering Pt or Au metallic films of articulamentum form top electrode film layer, the Pt or Au on described
Thickness of metal film is 200~600nm, is preferably 300nm, and the top electrode film layer is made by photolithography patterning technique
Unnecessary upper electrode material is removed into top electrode, then with physical dry etching method etching；
S4, formed in lower surface high speed spin coating PDMS or the PMMA organic thin film of the flexible base board with spin-coating method and power on
Pole film layer, to keep the uniformity of the organic matter of PI flexible base boards surface institute spin coating, PDMS the or PMMA organic matters are thin
Film thickness is 100~200nm, is preferably 100nm, is then fabricated to down the lower connection film layer by photolithography patterning technique
Articulamentum, then remove unnecessary lower connection layer material with physical dry etching method etching；
S5, in the lower surface of the lower articulamentum, sputtering Pt or Au metallic films prepare bottom electrode film layer, the Pt or Au
Thickness of metal film is 200~600nm, is preferably 300nm, and the bottom electrode film layer is made by photolithography patterning technique
Unnecessary lower electrode material is removed into bottom electrode, then with physical dry etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment seven：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is PDMS；Top electrode 3, the top electrode 3 is Pt or Au metallic films, arranged on described
The upper surface of flexible base board 1；Bottom electrode 5, the bottom electrode 5 is Pt or Au metallic films, arranged on the following table of the flexible base board 1
Face；Articulamentum, the articulamentum are PDMS or PMMA organic thin films, it includes articulamentum 2 and lower articulamentum 4, it is described on
Articulamentum 2 is arranged between the flexible base board 1 and top electrode 3 and connects the flexible base board 1 and top electrode 3, the lower connection
Layer 4 is arranged between the flexible base board 1 and bottom electrode 5 and connects the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PDMS flexible base boards, is generally cleaned, spent with isopropanol, acetone and EtOH Sonicate
Ionized water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, upper surface high speed spin coating PDMS or PMMA organic thin film the formation upper electrode film in the PDMS flexible base boards
Layer, to keep the uniformity of the organic matter of PDMS flexible base boards surface institute spin coating, PDMS the or PMMA organic thin films
Thickness is 250~350nm, is preferably 300nm, and the upper connection film layer then is fabricated to upper company by photolithography patterning technique
Layer is connect, then unnecessary upper connection layer material is removed with physical dry etching method etching；
S3, the upper surface sputtering Pt or Au metallic films of articulamentum form top electrode film layer, the Pt or Au on described
Thickness of metal film is 900~1400nm, is preferably 1200nm, and the top electrode film layer is passed through photolithography patterning technique system
Top electrode is made, then unnecessary upper electrode material is removed with physical dry etching method etching；
S4, formed in lower surface high speed spin coating PDMS or the PMMA organic thin film of the flexible base board with spin-coating method and power on
Pole film layer, to keep the uniformity of the organic matter of PDMS flexible base boards surface institute spin coating, PDMS the or PMMA organic matters
Film thickness is 250~350nm, is preferably 300nm, is then fabricated to the lower connection film layer by photolithography patterning technique
Lower articulamentum, then remove unnecessary lower connection layer material with physical dry etching method etching；
S5, in the lower surface of the lower articulamentum, sputtering Pt or Au metallic films prepare bottom electrode film layer, the Pt or Au
Thickness of metal film is 900~1400nm, is preferably 1200nm, and the bottom electrode film layer is passed through photolithography patterning technique system
Bottom electrode is made, then unnecessary lower electrode material is removed with physical dry etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Embodiment eight：
Please refer to Fig.2 and Fig. 3, Fig. 2 be flexible capacitance type acceleration transducer of the present invention diagrammatic cross-section, such as Fig. 2 institutes
Show, flexible base board 1, the flexible base board 1 is PET；Top electrode 3, the top electrode 3 is Pt or Au metallic films, arranged on described
The upper surface of flexible base board 1；Bottom electrode 5, the bottom electrode 5 is Pt or Au metallic films, arranged on the following table of the flexible base board 1
Face；Articulamentum, the articulamentum are PDMS or PMMA organic thin films, it includes articulamentum 2 and lower articulamentum 4, it is described on
Articulamentum 2 is arranged between the flexible base board 1 and top electrode 3 and connects the flexible base board 1 and top electrode 3, the lower connection
Layer 4 is arranged between the flexible base board 1 and bottom electrode 5 and connects the flexible base board 1 and bottom electrode 5.
Wherein, Fig. 3 is the top view of the flexible capacitance type acceleration transducer of the present invention, as shown in figure 3, the top electrode
3 are provided with pin portions 6, and the bottom electrode 5 is also correspondingly provided with pin portions (not shown in this part figure, but and top electrode
Pin portions 6 are corresponding), the pin portions are attached with peripheral circuit, are drawn for signal.
When the acceleration force for having the external world puts on the flexible capacitance type acceleration transducer of the embodiment of the present invention, flexible base
Plate 1 can receive the acceleration force so that flexible base board 1 deforms upon, so that top electrode 3 and the relative position of bottom electrode 5 hair
Changing, and then cause the area of capacitor element to change so that the capacitance in polar-plate-type capacitance changes correspondingly, and passes through
The pin portions of upper and lower electrode are connected with external circuit, are carried out the capacitance variation amount received at signal using electronic component
Reason, to obtain the size of acceleration force to be measured.
Correspondingly, the embodiment of the present invention additionally provides a kind of method for manufacturing the flexible capacitance type acceleration transducer,
Comprise the following steps：
S1, cleaned and dried to PET flexible base boards, is generally cleaned with isopropanol, acetone and EtOH Sonicate, spend from
Sub- water rinses repeatedly, is finally dried up or is dried with nitrogen；
S2, upper surface high speed spin coating PDMS or PMMA organic thin film the formation upper electrode film in the PET flexible base boards
Layer, to keep the uniformity of the organic matter of PET flexible base boards surface institute spin coating, PDMS the or PMMA organic thin films are thick
Spend for 350~500nm, be preferably 500nm, the upper connection film layer is then fabricated to upper connection by photolithography patterning technique
Layer, then remove unnecessary upper connection layer material with physical dry etching method etching；
S3, the upper surface sputtering Pt or Au metallic films of articulamentum form top electrode film layer, the Pt or Au on described
Thickness of metal film is 1600~2000nm, is preferably 2000nm, and the top electrode film layer is passed through photolithography patterning technique
Top electrode is fabricated to, then unnecessary upper electrode material is removed with physical dry etching method etching；
S4, formed in lower surface high speed spin coating PDMS or the PMMA organic thin film of the flexible base board with spin-coating method and power on
Pole film layer, to keep the uniformity of the organic matter of PET flexible base boards surface institute spin coating, PDMS the or PMMA organic matters are thin
Film thickness is 350~500nm, is preferably 500nm, is then fabricated to down the lower connection film layer by photolithography patterning technique
Articulamentum, then remove unnecessary lower connection layer material with physical dry etching method etching；
S5, in the lower surface of the lower articulamentum, sputtering Pt or Au metallic films prepare bottom electrode film layer, the Pt or Au
Thickness of metal film is 1600~2000nm, is preferably 2000nm, and the bottom electrode film layer is passed through photolithography patterning technique
Bottom electrode is fabricated to, then unnecessary lower electrode material is removed with physical dry etching method etching.
The pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin
Part is attached with peripheral circuit, and is encapsulated on circuit boards.
Flexible capacitance type acceleration transducer in above example is directly to make MEMS device on flexible substrates,
Technique and simple in structure, cost is relatively low, and obtained acceleration transducer can apply the thing in any type, shape and size
On body surface face, in addition articulamentum of the invention is selected and the excellent material of flexible base board caking property performance so that electrode and flexible base
Plate preferably bonds, and it is all directly in conjunction with the poor technical problem of power with substrate to solve many component failures at present.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
- A kind of 1. flexible capacitance type acceleration transducer, it is characterised in that including：Flexible base board (1)；Top electrode (3), arranged on the upper surface of the flexible base board (1)；Bottom electrode (5), arranged on the lower surface of the flexible base board (1)；Articulamentum, it includes articulamentum (2) and lower articulamentum (4), and the upper articulamentum (2) is arranged on the flexible base board (1) Between top electrode (3) and the flexible base board (1) and top electrode (3) are connected, the lower articulamentum (4) is arranged on the flexible base Between plate (1) and bottom electrode (5) and connect the flexible base board (1) and bottom electrode (5), the articulamentum by organic thin film or Metallic film is made；The upper and lower electrode (3,5) and articulamentum are to pass through MEMS patterning process systems by upper and lower electrode film layer and connection film layer Standby gained.
- 2. flexible capacitance type acceleration transducer as claimed in claim 1, it is characterised in that the top electrode (3) and lower electricity Pole (5) is both provided with pin portions, and the pin portions are used to be connected with peripheral circuit.
- 3. flexible capacitance type acceleration transducer as claimed in claim 1, it is characterised in that the upper articulamentum (2) and under The thickness of articulamentum (4) is 50~500nm.
- 4. the flexible capacitance type acceleration transducer as described in claim 1-3 any one, it is characterised in thatThe top electrode (3) and bottom electrode (5) are formed by the metallic film that thickness is 100~2000nm.
- 5. a kind of method for manufacturing the flexible capacitance type acceleration transducer as any one of claim 1-4, its feature It is, comprises the following steps：S1, cleaned and dried to flexible base board；S2, form in the upper surface of the flexible base board and connect film layer, and the upper connection film layer is fabricated to upper articulamentum；S3, the upper surface of articulamentum forms top electrode film layer on described, and the top electrode film layer is fabricated to top electrode；S4, form lower connection film layer in the lower surface of the flexible base board, and the lower connection film layer is fabricated to lower articulamentum；S5, prepare bottom electrode film layer in the lower surface of the lower articulamentum, and the bottom electrode film layer is fabricated to bottom electrode；Wherein, in the step S2 and S4, respectively in the upper surface of flexible base board with by the way of physical deposition or spin coating Surface forms metallic film or organic thin film, to form the upper connection film layer and lower connection film layer；The upper and lower electrode and articulamentum are to prepare institute by MEMS patterning process by upper and lower electrode film layer and connection film layer .
- 6. the method for manufacture flexible capacitance type acceleration transducer as claimed in claim 5, it is characterised in thatThe pin portions of the upper and lower electrode are bound by carrying out gold thread respectively to upper and lower electrode and are formed, by the pin portions with Peripheral circuit is attached, and is encapsulated on circuit boards.
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| CN111148000B (en) * | 2019-12-31 | 2021-10-22 | 瑞声科技（南京）有限公司 | MEMS microphone and array structure |
| CN111870251B (en) * | 2020-07-21 | 2022-05-13 | 福建工程学院 | Method and device for measuring tremor of internal arteriovenous fistula based on capacitance sensing principle |
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