CN203941949U - A kind of COB packaging system of LED lamp plate - Google Patents
A kind of COB packaging system of LED lamp plate Download PDFInfo
- Publication number
- CN203941949U CN203941949U CN201420255409.3U CN201420255409U CN203941949U CN 203941949 U CN203941949 U CN 203941949U CN 201420255409 U CN201420255409 U CN 201420255409U CN 203941949 U CN203941949 U CN 203941949U
- Authority
- CN
- China
- Prior art keywords
- copper
- pond
- radiating surface
- clad plate
- tube core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model relates to a kind of COB packaging system of LED lamp plate, which comprises at least substrate, on substrate, there are a plurality of sides to determine the substrate die bond platform of LED tube core, positive electrode and negative electrode, LED tube core bottom face is fixed on substrate die bond platform, it is characterized in that: each LED tube core is placed on a copper-clad plate being corroded and encloses in pond, and the positive pole side of LED tube core fixes on positive electrode, the negative pole side of LED tube core fixes on negative electrode, and fluorescent glue is infused in copper-clad plate and encloses in pond; Pond is enclosed in copper-clad plate opening, substrate die bond platform or positive electrode or negative electrode by lead-in wire, enclose pond with copper-clad plate outside radiating surface be separately electrically connected to, the heat that makes the generation of LED tube core is enclosed radiating surface outside pond to space radiation by copper-clad plate.The utlity model has the features such as thermal diffusivity is good, and cost is low.
Description
Technical field
The utility model relates to the COB packaging system of the COB lamp plate of a kind of LED, particularly a kind of LED lamp plate.
Background technology
The COB lamp plate of existing LED is by above binding a plurality of LED tube cores at a substrate (aluminium base, pcb board, copper base or ceramic substrate), integratedly go out a high-power LED lamp plate, its manufacturing process comprises: the led substrate of making required power size, on substrate, carry out box dam, make integrated LED tube core all put into box dam, on led substrate, bind all LED tube cores, in box dam, click and enter fluorescent glue, heating cure fluorescent glue.Substrate adopts aluminium base, copper base or ceramic substrate to be conducive to heat radiation.
This LED-COB lamp plate is due to fluorescent glue is filled in box dam, fluorescent glue is non-heat carrier, although COB lamp plate is simultaneously metallic object, there is heat-sinking capability, but the heat preservation property of another side greatly reduces the thermal diffusivity of COB lamp plate, make LED-COB lamp plate when making light fixture, need the radiator of significant volume, not only increased cost, lamp temperature is very high simultaneously, has affected the useful life of lamp body.
Fluorescent glue contains all LED tube core and space in box dam, and use amount is also large, has greatly increased the cost of LED-COB lamp plate.
Utility model content
It is good that the purpose of this utility model is to provide a kind of thermal diffusivity, the COB method for packing of the LED lamp plate that cost is low.
The purpose of this utility model is to realize like this, a kind of COB packaging system of LED lamp plate, which comprises at least substrate, the substrate die bond platform that has a plurality of binding LED tube cores on substrate, positive electrode and negative electrode, LED tube core bottom face is fixed on substrate die bond platform, it is characterized in that: each LED tube core is placed on a copper-clad plate being corroded and encloses in pond, the positive pole of LED tube core is bundled in positive electrode, and the negative pole of LED tube core is bundled on negative electrode, and fluorescent glue is infused in copper-clad plate and encloses in pond; Pond is enclosed in copper-clad plate opening, substrate die bond platform or positive electrode or negative electrode by lead-in wire, enclose pond with copper-clad plate outside radiating surface be separately electrically connected to, the heat that makes the generation of LED tube core is enclosed radiating surface outside pond to space radiation by copper-clad plate.
Described substrate die bond platform or positive electrode or negative electrode are guided copper-clad plate into by opening and are enclosed outside pond, and the width of opening is less than 1mm.
Described radiating surface is the conducting block outside pond is enclosed in copper-clad plate.
Described copper-clad plate is enclosed the thickness of copper-clad plate in pond between 35um-210um.
Described substrate is aluminium base, pcb board, copper base or ceramic substrate.
Described pcb board adopts double sided board, and LED tube core on-fixed face has radiating surface, substrate die bond platform or/and positive electrode or/and negative electrode by 1 above via hole, be connected with its conduction.
Described radiating surface comprises that negative electrode radiating surface, positive electrode radiating surface, positive and negative electrode radiating surface, substrate die bond platform radiating surface and the back side covers copper radiating surface.
The utility model has the advantages that: each LED tube core is placed on a copper-clad plate being corroded and encloses in pond, and the positive pole of LED tube core is bundled in positive electrode, and the negative pole of LED tube core is bundled on negative electrode, and fluorescent glue is infused in copper-clad plate and encloses in pond; Pond is enclosed in copper-clad plate opening, substrate die bond platform or and positive electrode or and negative electrode by lead-in wire, enclose pond with copper-clad plate outside radiating surface be separately electrically connected to, the heat that makes the generation of LED tube core is enclosed radiating surface outside pond to space radiation by copper-clad plate.Like this, the heat that has guaranteed each LED tube core generation can not only be passed through bottom heat radiation, also can dispel the heat by the radiating surface of upper surface simultaneously, the heat insulation that can LED tube core not produced by large-area fluorescent glue is in colloid, reduced the use amount of fluorescent glue simultaneously, provide cost savings, improved radiating effect.
Accompanying drawing explanation
Below in conjunction with embodiment accompanying drawing, the utility model is described in further detail:
Fig. 1 is the utility model embodiment 1 structural representation;
Fig. 2 is the utility model embodiment 2 structural representations;
Fig. 3 is the structural representation that pond is enclosed in the utility model copper-clad plate;
Fig. 4 is the structural representation of the utility model pcb board;
Fig. 5 is the structural representation after the utility model binding.
In figure, 1, substrate die bond platform radiating surface; 2, substrate; 3, pond is enclosed in copper-clad plate; 4, edge, pond is enclosed in copper-clad plate; 5, positive electrode; 6, substrate die bond platform; 7, negative electrode; 8, positive electrode radiating surface; 9, opening; 10, negative electrode radiating surface; 11, positive and negative electrode radiating surface; 12, coating; 13, via hole; 14, copper radiating surface is covered at the back side; 15, aluminum steel or gold thread; 16, fluorescent glue; 17, LED tube core.
Embodiment
Embodiment 1
As shown in Figure 1, a kind of COB packaging system of LED lamp plate, comprises substrate 2, has the substrate die bond platform 6 of a plurality of binding LED tube cores on substrate 2, positive electrode 5 and negative electrode 7, and LED tube core bottom face is fixed on substrate die bond platform 6.Each LED tube core 17 is placed on a copper-clad plate being corroded and encloses in pond 3, and the positive pole of LED tube core 17 is bundled in positive electrode 5, and the negative pole of LED tube core is bundled on negative electrode 7, and fluorescent glue 16 is infused in copper-clad plate and encloses in pond 3; See Fig. 5.Pond 3 is enclosed in copper-clad plate opening, substrate die bond platform 6 is or/and the heat that positive electrode 5 or/and negative electrode 7 encloses pond by lead-in wire and copper-clad plate is electrically connected to along outer radiating surface (substrate die bond platform radiating surface 1, negative electrode radiating surface 10, positive electrode radiating surface) separately, makes the generation of LED tube core is enclosed radiating surface outside pond 3 to space radiation by copper-clad plate.
Embodiment 2
As shown in Figure 2, substrate die bond platform 6 or/and positive electrode 5 or/and negative electrode 7 is guided copper-clad plate into by opening 9 encloses outside pond 3, when being connected in series between LED tube core 17, two LED tube cores, the 17 negative electrode radiating surfaces 10 of connection and positive electrode radiating surface 8 can be with positive and negative electrode radiating surfaces 11.Between LED tube core 17 substrate die bond platforms 6, also can be merged into a substrate die bond platform radiating surface 1, the width that the opening of pond along 4 enclosed in copper-clad plate is less than 1mm.Making to be like this infused in the fluorescent glue 16 that copper-clad plate encloses in pond 3 can not flow to outside pond.
Radiating surface comprises that negative electrode radiating surface 10, positive electrode radiating surface 8, positive and negative electrode radiating surface 11, substrate die bond platform radiating surface and the back side covers copper radiating surface.
Embodiment 3
As shown in Figure 3, pond is enclosed in copper-clad plate has a difference in height along 4 with substrate 2, and pond is enclosed in copper-clad plate to be made with substrate 2 height of formations poorly along 4 thickness by thickness of copper-clad plate and coating 12 stacks, and difference in height is between 35um-210um.It is 35um that copper layer thickness is covered in the copper-clad plate of common 1A, and it is 70um that copper layer thickness is covered in the copper-clad plate of 2A.Cover the thicker price of copper layer higher, therefore, can form the copper coin that can keep fluorescent glue 16 here by printed circuit board process and enclose pond along 4.Coating 12 covers copper-clad plate and encloses pond along on 4.
Embodiment 4
As shown in Figure 4, substrate 2 substrates are aluminium base, pcb board, copper base or ceramic substrate.When selecting double-sided PCB board, LED tube core on-fixed face has the back side to cover copper radiating surface 14, and substrate die bond platform 6 or positive electrode 5 or negative electrode 7 are connected with its conduction by 1 above via hole 13.
As shown in Figure 5, LED tube core 17 is placed on substrate die bond platform 6, substrate die bond platform 6 encloses in pond 3 a copper-clad plate being corroded, the positive pole of LED tube core 17 is bundled in positive electrode 5 by aluminum steel or gold thread 15, the negative pole of LED tube core is bundled on negative electrode 7, and fluorescent glue 16 is infused in copper-clad plate and encloses in pond 3.
Claims (7)
1. the COB packaging system of a LED lamp plate, which comprises at least substrate, the substrate die bond platform that has a plurality of binding LED tube cores on substrate, positive electrode and negative electrode, LED tube core bottom face is fixed on substrate die bond platform, it is characterized in that: each LED tube core is placed on a copper-clad plate being corroded and encloses in pond, and the positive pole of LED tube core is bundled in positive electrode, the negative pole of LED tube core is bundled on negative electrode, and fluorescent glue is infused in copper-clad plate and encloses in pond; Pond is enclosed in copper-clad plate opening, substrate die bond platform or positive electrode or negative electrode by lead-in wire, enclose pond with copper-clad plate outside radiating surface be separately electrically connected to, the heat that makes the generation of LED tube core is enclosed radiating surface outside pond to space radiation by copper-clad plate.
2. the COB packaging system of a kind of LED lamp plate according to claim 1, is characterized in that: described substrate die bond platform or/and positive electrode or/and negative electrode is guided copper-clad plate into by opening encloses outside pond, the width of opening is less than 1mm.
3. the COB packaging system of a kind of LED lamp plate according to claim 1, is characterized in that: described radiating surface is the conducting block outside pond is enclosed in copper-clad plate.
4. the COB packaging system of a kind of LED lamp plate according to claim 1, is characterized in that: described copper-clad plate is enclosed the thickness of copper-clad plate in pond between 35um-210um.
5. the COB packaging system of a kind of LED lamp plate according to claim 1, is characterized in that: described substrate is aluminium base, pcb board, copper base or ceramic substrate.
6. the COB packaging system of a kind of LED lamp plate according to claim 5, is characterized in that: described pcb board adopts double sided board, and LED tube core on-fixed face has radiating surface, and substrate die bond platform or positive electrode or negative electrode are connected with its conduction by 1 above via hole.
7. the COB packaging system of a kind of LED lamp plate according to claim 1, is characterized in that: described radiating surface comprises that negative electrode radiating surface, positive electrode radiating surface, positive and negative electrode radiating surface, substrate die bond platform radiating surface and the back side covers copper radiating surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420255409.3U CN203941949U (en) | 2014-05-19 | 2014-05-19 | A kind of COB packaging system of LED lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420255409.3U CN203941949U (en) | 2014-05-19 | 2014-05-19 | A kind of COB packaging system of LED lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203941949U true CN203941949U (en) | 2014-11-12 |
Family
ID=51861243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420255409.3U Expired - Fee Related CN203941949U (en) | 2014-05-19 | 2014-05-19 | A kind of COB packaging system of LED lamp plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203941949U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037301B (en) * | 2014-05-19 | 2017-06-30 | 伊韦尔(深圳)光电科技有限公司 | A kind of cob method for packing of LED lamp panel |
-
2014
- 2014-05-19 CN CN201420255409.3U patent/CN203941949U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037301B (en) * | 2014-05-19 | 2017-06-30 | 伊韦尔(深圳)光电科技有限公司 | A kind of cob method for packing of LED lamp panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141112 Termination date: 20150519 |
|
| EXPY | Termination of patent right or utility model |