CN203934097U - A kind of electromagnetic shielding film with barriers function - Google Patents
A kind of electromagnetic shielding film with barriers function Download PDFInfo
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- CN203934097U CN203934097U CN201420314285.1U CN201420314285U CN203934097U CN 203934097 U CN203934097 U CN 203934097U CN 201420314285 U CN201420314285 U CN 201420314285U CN 203934097 U CN203934097 U CN 203934097U
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- electromagnetic shielding
- shielding film
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- thickness
- barriers function
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Abstract
The utility model relates to a kind of electromagnetic shielding film for flexible printed wiring board; a kind of electromagnetic shielding film with barriers function specifically; the film carrier, coloured insulating barrier, compound barrier layer, conductive layer, bonding conductive adhesive layer and the protective layer that comprise stack successively; this structure can significantly improve screening effectiveness; and there is excellent bending, endurance energy; improve timeliness, cost-saving.
Description
Technical field
The utility model relates to a kind of electromagnetic shielding film for flexible printed wiring board, specifically a kind of electromagnetic shielding film with barriers function.
Background technology
The continuous progress of information, communication industry has driven the high speed development of microelectronics industry, and flexible printed wiring board (FPCB) has obtained application more widely at numerous areas such as cell phone, notebook computer, LCDs.The difference of flexible printed wiring board and rigid printed circuit (PCB) is that the former adopts coverlay protection; not only there is welding resistance, prevent copper wire oxidation and make FPC not be subject to the effects such as dust, moisture, chemicals erosion; but also there is the impact that reduces stress in BENDING PROCESS, improve the folding resistance to deflection energy of flexible printed wiring board.
Along with the development of Communication Equipment towards directions such as multi-functional, intellectuality and high-frequency high-speeds, inside and outside electromagnetic interference problem are become to be highlighted day by day, at present the traditional method of head it off is for posting electromagnetic shielding film making the wiring board skin that posts coverlay again, patent announcement number directly plates layer of metal or metal alloy for CN201571254U adopts the mode of evaporation on coverlay surface, to reach the effect of anti-electromagnetic interference, but the coating of this structure is directly outside exposed, and anti-soil and anti-oxidant texts are poor.Notification number is that the Metal Substrate coverlay of CN201491371U is to be then pressed together on outside wiring board and with this, to replace traditional coverlay, same anti-soil and folding resistance to deflection energy deviation in the glutinous agent of the surface coating of metal forming.
Coloured insulating barrier itself is felt drug resistance, the resistance to deflection of folding, flame-retardant and many other advantage, but the development along with telecommunications industry, basement membrane itself has attenuate trend, keeps away the defects such as unavoidable pin hole, striped in processing procedure, has weakened to a certain extent the insulated barriers function of coloured insulating barrier.
Utility model content
The utility model, for the deficiencies in the prior art, provides a kind of electromagnetic shielding film for flexible printed wiring board, specifically a kind of electromagnetic shielding film with barriers function.
In order to achieve the above object, a kind of electromagnetic shielding film with barriers function of the utility model, comprises the film carrier, coloured insulating barrier, compound barrier layer, conductive layer, bonding conductive adhesive layer and the protective layer that superpose successively.
Described film carrier refers to that one side is through processing such as corona, coating release agents, there is certain release function, film carrier is a kind of in PETG (PET) film, polyethylene naphthalate (PEN) film, polyimide film, thickness is 30-100 μ m (micron), preferred thickness is 50-75 μ m, and off-type force is 5-500g/25cm.
Described coloured insulating barrier refers to the coating with insulation function, described " coloured " refers to except containing conventional black and two kinds of colors of white, also comprise the stack of the colors such as red, orange, yellow, green, blue, blue, purple or two or more colors, to reach the effect of good color recognition.
Described compound barrier layer has high barrier, it forms the barrier layer of one deck even compact on the surface of coloured insulating basement membrane by physical gas-phase deposite method, the medium of this compound barrier layer comprises one or more inorganic compositions such as silicon dioxide, alundum (Al2O3), zirconia, the characteristic with high-barrier, significantly improves insulating properties.
It is electrical that described conductive layer has conducting, it forms on the surface of compound barrier layer the conductive layer that one deck is even, stable, powered is good by one or more methods such as physical vapour deposition (PVD), silk-screen, spraying or coatings, and the conducting medium of this conductive layer comprises one or more alloys such as gold, silver, copper, Nie, Chrome, aluminium, titanium.
Described bonding conductive adhesive layer, refers to that epoxy resin binding agent, the saturated polyester with good peel strength, anti-flammability, thermal endurance, good electric conductivity and resistance to bending performance etc. are one or more compositions in binding agent, esters of acrylic acid binding agent or improved composition wherein.And protective layer refers in order to protect a kind of in the release film of adhesive layer and release liners.
Preferably, the thickness of described coloured insulating barrier is between 50 μ m, to reach good covering property, resistance to bending and insulating properties at 5 μ m.
As the further improvement of such scheme, the thickness of described coloured insulating barrier is between 25 μ m, further to reach good covering property, resistance to bending and insulating properties at 7 μ m.
Preferably, the thickness of described compound barrier layer is between 5 μ m at 0.1 μ m.
As the further improvement of such scheme, the optimum thickness of described compound barrier layer is between 0.5 μ m at 0.15 μ m.
Preferably, the thickness of described conductive layer is between 5 μ m at 0.1 μ m.
As the further improvement of such scheme, the optimum thickness of described conductive layer is between 0.5 μ m at 0.15 μ m.
Preferably, described bonding conductive adhesive layer is that epoxy resin binding agent, saturated polyester are a kind of in binding agent, esters of acrylic acid binding agent, or epoxy resin binding agent, saturated polyester are binding agent, the esters of acrylic acid binding agent composition between mutually, or epoxy resin binding agent, saturated polyester are the improved composition of binding agent, esters of acrylic acid binding agent.
Preferably, the thickness of described bonding conductive adhesive layer is between 35 μ m at 5 μ m.
As the further improvement of such scheme, the thickness of described bonding conductive adhesive layer is between 25 μ m at 7 μ m.
Preferably, described protective layer is a kind of in the two of release film and release liners.
The beneficial effects of the utility model are that with respect to prior art, compound barrier layer can increase substantially the barrier of conductive layer and extraneous medium, improves effectiveness, simplifies flexible printed wiring board processing procedure, improves timeliness, cost-saving.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present utility model.
Wherein, 1 is film carrier, and 2 is coloured insulating barrier, and 3 is compound barrier layer, and 4 is conductive layer, and 5 is bonding conductive adhesive layer, and 6 is protective layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Embodiment 1
With reference to Fig. 1, as can be seen from Figure 1, a kind of electromagnetic shielding film with barriers function of the utility model embodiment, comprises the film carrier 1, coloured insulating barrier 2, compound barrier layer 3, conductive layer 4, bonding conductive adhesive layer 5, the protective layer 6 that superpose successively.
Described film carrier 1 refers to that one side, through processing such as coronas, coating release agent, has certain release function, and film carrier is a kind of in PETG (PET) film, polyethylene naphthalate (PEN) film, polyimide film.
Described coloured insulating barrier 2 refers to the coating with insulation function, described " coloured " refers to except containing conventional black and two kinds of colors of white, also comprise red, orange, yellow, green, blue or green, blue, the stack of the colors such as purple or two or more colors, to reach the effect of good color recognition, release the uniform insulating coating of formation one deck by coating method at film carrier 1, thickness is 5～50 μ m, its optimum thickness is 7～25 μ m, described compound barrier layer 3 has high barrier, it forms the barrier layer of one deck even compact on the surface of coloured insulating barrier 2 by physical gas-phase deposite method, the medium of this compound barrier layer 3 comprises silicon dioxide, alundum (Al2O3), one or more inorganic compositions such as zirconia, the characteristic with high-barrier, significantly improve insulating properties, the thickness of compound barrier layer 3 is 0.1～5 μ m, its optimum thickness is 0.15～0.5 μ m.It is electrical that described conductive layer 4 has conducting, it forms on the surface of compound barrier layer 3 conductive layer 4 that one deck is even, stable, powered is good by one or more methods such as physical vapour deposition (PVD), silk-screen, spraying or coatings, the conducting medium of this conductive layer 4 comprises one or more alloys such as gold, silver, copper, Nie, Chrome, aluminium, titanium, the thickness of described conductive layer 4 is 0.1～5 μ m, and its optimum thickness is 0.15～0.5 μ m.Described bonding conductive adhesive layer 5, refer to that epoxy resin binding agent, the saturated polyester with good peel strength, anti-flammability, thermal endurance, good electric conductivity and resistance to bending performance etc. are one or more compositions in binding agent, esters of acrylic acid binding agent or improved composition wherein, the uniform conductive adhesive layer 5 of surface-coated one deck at conductive layer 4, thickness is 5～35 μ m, and its optimum thickness is 7～25 μ m.Protective layer 6 refers in order to protect a kind of in the release film of adhesive layer and release liners.
Embodiment 2
At film carrier 1 surface-coated insulating black ink, with the speed of a motor vehicle of 12m/min, pass through baking oven, make black insulating barrier 2,
Surface at black insulating barrier 2 adopts the vacuum magnetic-control sputtering method in physical gas-phase deposite method, and at the even alundum (Al2O3) layer of 0.2 micron of black insulating barrier 2 surface deposition one deck, this alundum (Al2O3) layer is compound barrier layer 3.
In the process of making at conductive layer 4, be to adopt the vacuum magnetic-control sputtering method in physical gas-phase deposite method on the surface of having made, at the uniform copper metal level of 0.2 micron of compound barrier layer 3 surface deposition one deck, this copper metal layer is conductive layer 4.
And the making of bonding conductive adhesive layer 5 is after above step completes, 4 of conductive layers, apply epoxy adhesive, with the speed of a motor vehicle of 12m/min, by baking oven, and by the press bonding roller release film 6 that 50 micron thickness, off-type force are 100g/25cm of fitting, dry glue thickness is 15 μ m.
This structure can significantly improve screening effectiveness, and has excellent bending, endurance energy, improves timeliness, cost-saving.
Below the utility model is described in detail, but apparent, those skilled in the art can carry out various changes and improvements, and does not deviate from the scope of the present utility model that appended claims limits.
Claims (10)
1. an electromagnetic shielding film with barriers function, is characterized in that: the film carrier, coloured insulating barrier, compound barrier layer, conductive layer, bonding conductive adhesive layer and the protective layer that comprise stack successively.
2. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: the thickness of described film carrier is between 100 μ m at 30 μ m.
3. a kind of electromagnetic shielding film with barriers function according to claim 2, is characterized in that: the thickness of described film carrier is between 75 μ m at 50 μ m.
4. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: the thickness of described coloured insulating barrier is between 50 μ m at 5 μ m.
5. a kind of electromagnetic shielding film with barriers function according to claim 4, is characterized in that: the thickness of described coloured insulating barrier is between 25 μ m at 7 μ m.
6. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: the material of described compound barrier layer is one or more compositions in these three kinds of inorganic matters of silicon dioxide, alundum (Al2O3) and zirconia.
7. according to a kind of electromagnetic shielding film with barriers function described in claim 1 or 6, it is characterized in that: the thickness of described compound barrier layer be at 0.1 μ m between 5 μ m, the optimum thickness of described compound barrier layer is between 0.5 μ m at 0.15 μ m.
8. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: the thickness of described conductive layer be at 0.1 μ m between 5 μ m, the optimum thickness of described conductive layer is between 0.5 μ m at 0.15 μ m.
9. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: the thickness of described bonding conductive adhesive layer is between 35 μ m at 5 μ m.
10. a kind of electromagnetic shielding film with barriers function according to claim 1, is characterized in that: described protective layer is a kind of in the two of release film and release liners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420314285.1U CN203934097U (en) | 2014-06-12 | 2014-06-12 | A kind of electromagnetic shielding film with barriers function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420314285.1U CN203934097U (en) | 2014-06-12 | 2014-06-12 | A kind of electromagnetic shielding film with barriers function |
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| Publication Number | Publication Date |
|---|---|
| CN203934097U true CN203934097U (en) | 2014-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420314285.1U Expired - Fee Related CN203934097U (en) | 2014-06-12 | 2014-06-12 | A kind of electromagnetic shielding film with barriers function |
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| Country | Link |
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| CN (1) | CN203934097U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734841A (en) * | 2017-09-28 | 2018-02-23 | 中山国安火炬科技发展有限公司 | A kind of insulation film for flexible PCB and preparation method thereof |
-
2014
- 2014-06-12 CN CN201420314285.1U patent/CN203934097U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734841A (en) * | 2017-09-28 | 2018-02-23 | 中山国安火炬科技发展有限公司 | A kind of insulation film for flexible PCB and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20150612 |
|
| EXPY | Termination of patent right or utility model |