CN203930531U - Solder(ing) paste storage ambient intelligence temperature adjustment terminal - Google Patents
Solder(ing) paste storage ambient intelligence temperature adjustment terminal Download PDFInfo
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- CN203930531U CN203930531U CN201420259162.2U CN201420259162U CN203930531U CN 203930531 U CN203930531 U CN 203930531U CN 201420259162 U CN201420259162 U CN 201420259162U CN 203930531 U CN203930531 U CN 203930531U
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Abstract
A kind of solder(ing) paste storage ambient intelligence temperature adjustment terminal, comprises cortexm3 kernel SOC single-chip microcomputer, solder(ing) paste storage chamber, warming forwarder, intelligent temperature control unit, photoelectric bar-code recognizer and with Zigbee communication module; Solder(ing) paste is stored, is freezed and rises again processing in described solder(ing) paste storage chamber; Warming forwarder is placed in solder(ing) paste storage chamber, and described temperature sensor is for the temperature in Real-Time Monitoring solder(ing) paste storage chamber, temperature information is delivered to the temperature transmitter of connected cortexm3 kernel SOC single-chip microcomputer; Described intelligent temperature control unit, is connected respectively with high frequency heating machine and swirl type cold machine; High frequency heating machine two ends connect respectively intensification air channel and heat dissipation channel, and described intensification air channel is communicated with solder(ing) paste storage chamber; Swirl type cold machine is connected with cooling air channel, and described cooling air channel is communicated with solder(ing) paste storeroom; The utility model has used cortexm3 kernel SOC single-chip microcomputer and the Zigbee communication module of existing market main flow, can realize the high efficiency self-regulation of solder(ing) paste storage environment temperature.
Description
Technical field
The utility model relates to a kind of temperature adjustment terminal, relates in particular to a kind of solder(ing) paste storage ambient intelligence temperature adjustment terminal.
Background technology
Solder(ing) paste is to be accompanied by a kind of Novel welding material that SMT arises at the historic moment, and its Management and usage whether science is directly connected to the quality of product, formulates a set of scientific and rational solder(ing) paste management particularly important with using method, solder(ing) paste need refrigerate processing to it in the time not using, and temperature general control, 1-10 DEG C of left and right, can effectively reduce solder(ing) paste activity like this, extends the shelf-life of solder(ing) paste, and solder(ing) paste carries out before presswork taking out from reefer, the solder(ing) paste temperature that reefer takes out is lower than room temperature, if directly use very easily allows moisture content enter tin cream, when reflow, glass putty splashes, form tin sweat(ing), therefore, the solder(ing) paste processing of need to rising again that reefer takes out, temperature General Requirements goes back up to (25 ± 2 DEG C) in environment for use temperature, to recover solder(ing) paste activity, reach the welded condition of solder(ing) paste the best, in addition, tin cream viscosity after rising again is controlled, the possibility of biting when printing is little, if without rising again processing, the possibility that solder(ing) paste is bitten in the time of printing is very big.
Utility model content
The above-mentioned requirements that uses and deposit based on solder(ing) paste, the utility model has designed a kind of solder(ing) paste storage ambient intelligence temperature adjustment terminal, the temperature of more intelligentized control solder(ing) paste temperature environment and manage its status information, thus management, the operating cost of factory reduced.
For achieving the above object, the utility model adopts following technical scheme: a kind of solder(ing) paste storage ambient intelligence temperature adjustment terminal, comprises cortexm3 kernel SOC single-chip microcomputer, solder(ing) paste storage chamber, warming forwarder, intelligent temperature control unit, photoelectric bar-code recognizer and Zigbee communication module;
Solder(ing) paste is stored, is freezed and rises again processing in described solder(ing) paste storage chamber;
Warming forwarder is placed in solder(ing) paste storage chamber, and described warming forwarder is for the temperature in Real-Time Monitoring solder(ing) paste storage chamber, temperature information is delivered to the temperature transmitter of connected cortexm3 kernel SOC single-chip microcomputer;
Described intelligent temperature control unit, is connected respectively with high frequency heating machine and swirl type cold machine; High frequency heating machine connects respectively intensification air channel and heat dissipation channel, and described intensification air channel is communicated with solder(ing) paste storage chamber; Swirl type cold machine is connected with cooling air channel, and described cooling air channel is communicated with solder(ing) paste storeroom;
Described cortexm3 kernel SOC single-chip microcomputer is also connected with photoelectric bar-code recognizer, Zigbee communication module and electromagnetism gate inhibition respectively, and described cortexm3 kernel SOC single-chip microcomputer is provided with touch screen.
Main Function of the present utility model: this device has used cortexm3 kernel SOC single-chip microcomputer and the Zigbee communication module of existing market main flow, so this device can be realized the high efficiency self-regulation of solder(ing) paste storage environment temperature, make temperature self-inductance measurement, monitoring certainly in solder(ing) paste storage environment, greatly improved the automatization level of solder(ing) paste storage.
Brief description of the drawings
Fig. 1 is structured flowchart of the present utility model.
Embodiment
By reference to the accompanying drawings and embodiment the utility model is described:
Embodiment
A kind of solder(ing) paste storage ambient intelligence temperature adjustment terminal as shown in Figure 1, comprises cortexm3 kernel SOC single-chip microcomputer, solder(ing) paste storage chamber, warming forwarder, intelligent temperature control unit, photoelectric bar-code recognizer and Zigbee communication module;
Solder(ing) paste is stored, is freezed and rises again processing in described solder(ing) paste storage chamber;
Warming forwarder is placed in solder(ing) paste storage chamber, and described warming forwarder is for detecting in real time the temperature in solder(ing) paste storage chamber, temperature information is delivered to the temperature transmitter of connected cortexm3 kernel SOC single-chip microcomputer;
Described intelligent temperature control unit, is connected respectively with high frequency heating machine and swirl type cold machine; High frequency heating machine connects respectively intensification air channel and heat dissipation channel, and described intensification air channel is communicated with solder(ing) paste storage chamber; Swirl type cold machine is connected with cooling air channel, and described cooling air channel is communicated with solder(ing) paste storeroom;
Described cortexm3 kernel SOC single-chip microcomputer is connected with the photoelectric bar-code recognizer for recording solder(ing) paste ID, recognizer sends to the cortexm3 kernel SOC single-chip microcomputer described in cortexm3 kernel SOC single-chip microcomputer to be also connected with Zigbee communication module the solder(ing) paste bar code information of scanning, by Zigbee communication module and intelligent management system server interaction information, intelligent management system server is formulated solder(ing) paste status information according to Production requirement, and status information is sent to cortexm3 kernel SOC single-chip microcomputer by Zigbee communication module, cortexm3 kernel SOC single-chip microcomputer receiving status information, intelligent temperature control unit to the residing solder(ing) paste reefer of solder(ing) paste that has this ID rises, cooling is processed, control high frequency heating machine or swirl type cold machine and regulate solder(ing) paste temperature environment, the utility model only relates to the solder(ing) paste storage ambient intelligence temperature adjustment terminal mutual with intelligent management system server info, be that the utility model is as detecting and topworks, realizing intelligent temperature regulates, the each chip wherein relating to and module are integrated chip or the circuit of ripe application in prior art, for those skilled in the art's common practise, the utility model combines and connects, realize the high efficiency self-regulation of solder(ing) paste storage environment temperature, make temperature self-inductance measurement in solder(ing) paste storage environment, from monitoring, greatly improve the automatization level of solder(ing) paste storage.
Further, solder(ing) paste storage ambient intelligence temperature adjustment terminal, also comprises electromagnetism gate inhibition, and electromagnetism gate inhibition is connected with cortexm3 kernel SOC single-chip microcomputer, can effectively forbid that non-authority user enters storage chamber.
Further, solder(ing) paste storage ambient intelligence temperature adjustment terminal, also comprise cortexm3 kernel SOC single-chip microcomputer touch screen, described touch screen is connected with cortexm3 kernel SOC single-chip microcomputer, and authority user can set solder(ing) paste status information by touch screen, check solder(ing) paste information.
Further, described status information, comprises refrigeration information and the information of rising again.
Claims (1)
1. a solder(ing) paste storage ambient intelligence temperature adjustment terminal, is characterized in that: comprise cortexm3 kernel SOC single-chip microcomputer, solder(ing) paste storage chamber, warming forwarder, intelligent temperature control unit, photoelectric bar-code recognizer and Zigbee communication module;
Solder(ing) paste is stored in solder(ing) paste storage chamber;
Warming forwarder is arranged in solder(ing) paste storage chamber, and described warming forwarder is for the temperature in Real-Time Monitoring solder(ing) paste storage chamber, temperature information is delivered to the temperature transmitter of connected cortexm3 kernel SOC single-chip microcomputer;
Described intelligent temperature control unit, is connected respectively with high frequency heating machine and swirl type cold machine; High frequency heating machine connects respectively intensification air channel and heat dissipation channel, and described intensification air channel is communicated with solder(ing) paste storage chamber; Swirl type cold machine is connected with cooling air channel, and described cooling air channel is communicated with solder(ing) paste storeroom;
Described cortexm3 kernel SOC single-chip microcomputer is also connected with photoelectric bar-code recognizer, Zigbee communication module and electromagnetism gate inhibition respectively, and described cortexm3 kernel SOC single-chip microcomputer is provided with touch screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420259162.2U CN203930531U (en) | 2014-05-20 | 2014-05-20 | Solder(ing) paste storage ambient intelligence temperature adjustment terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420259162.2U CN203930531U (en) | 2014-05-20 | 2014-05-20 | Solder(ing) paste storage ambient intelligence temperature adjustment terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203930531U true CN203930531U (en) | 2014-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420259162.2U Expired - Fee Related CN203930531U (en) | 2014-05-20 | 2014-05-20 | Solder(ing) paste storage ambient intelligence temperature adjustment terminal |
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| CN (1) | CN203930531U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105137864A (en) * | 2015-07-31 | 2015-12-09 | 上海卫星工程研究所 | Lower computer coordinative control SoC chip for spacecraft |
-
2014
- 2014-05-20 CN CN201420259162.2U patent/CN203930531U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105137864A (en) * | 2015-07-31 | 2015-12-09 | 上海卫星工程研究所 | Lower computer coordinative control SoC chip for spacecraft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 110117 17-5 Wen Shu street, Hunnan District, Shenyang, Liaoning (1-2-1) Patentee after: Shenyang almice Technology Co., Ltd. Address before: 110164 123-4 Hui Shan Street, Shenbei New Area, Shenyang, Liaoning. Patentee before: SHENYANG RIJIA ELECTRONICS CO., LTD. |
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| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20210520 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |