CN203784683U - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
CN203784683U
CN203784683U CN201420094038.5U CN201420094038U CN203784683U CN 203784683 U CN203784683 U CN 203784683U CN 201420094038 U CN201420094038 U CN 201420094038U CN 203784683 U CN203784683 U CN 203784683U
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CN
China
Prior art keywords
led
substrate
light fixture
led chip
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420094038.5U
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Chinese (zh)
Inventor
胡新荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xinyichang Technology Co Ltd
Original Assignee
SHENZHEN XINYICHANG AUTOMATIC EQUIPMENT CO Ltd
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Filing date
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Application filed by SHENZHEN XINYICHANG AUTOMATIC EQUIPMENT CO Ltd filed Critical SHENZHEN XINYICHANG AUTOMATIC EQUIPMENT CO Ltd
Priority to CN201420094038.5U priority Critical patent/CN203784683U/en
Application granted granted Critical
Publication of CN203784683U publication Critical patent/CN203784683U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The utility model discloses an LED lamp which comprises a connector and an LED luminescent lamp wick, wherein the LED luminescent lamp wick comprises a radiator, an LED drive power supply and an LED luminescent assembly; the LED luminescent assembly comprises LED chips and a substrate provided with a circuit electrically connected with the LED chips; the radiator, the LED drive power supply and the substrate are assembled to form a firmware structure; the part, where the LED chips are arranged, of the substrate is bulged out of the firmware structure; the substrate is provided with at least one mounting surface where the LED chips are fixed; and a fluorescent cover is arranged outside the LED chips in a covered manner and coated with fluorescent powder. Therefore, a certain distance is reserved between the fluorescent cover and the LED chips, actual heating is greatly reduced, accordingly, the service life of a lamp product is prolonged, failures of chip displacement, pulling apart of a gold wire and the like due to the fact that the LED chips are lightened and generate heat and expansion coefficients of a pouring sealant and the substrate are different can be prevented, and the quality and the service life of the LED lamp are guaranteed.

Description

LED light fixture
Technical field
The application relates to light emitting diode field, relates in particular to a kind of LED light fixture.
Background technology
Light emitting diode (Light Emitting Diode, LED) be a kind of semiconductor devices that converts electrical energy into luminous energy, it,, due to the advantage such as high luminous efficacy, long service life, energy-saving and environmental protection, volume be little, safe, is widely used in the fields such as demonstration, illumination.
Main integrated power type LED element or the adopting surface mounted LED element of adopting in existing LED bulb lamp; LED element is welded in aluminum-based circuit board; the heat that LED element produces conducts by aluminum-based circuit board and aluminium shell; thereby reach the object of heat radiation; aluminium shell had both become protecting sheathing, was again radiating element.Based on this structure, at least there are the following problems for existing LED bulb lamp: first, LED element is directly attached in aluminum-based circuit board, make under high-power requirement, aluminum-based circuit board, also in requisition for increase, in order to meet heat radiation requirement, has increased aluminium material cost, make LED bulb lamp volume larger, be unfavorable for saving space, second, the light that the LED element of directional lighting sends directly shines out by lampshade, does not improve the luminous intensity distribution design of light utilization, and light utilization efficiency is low, and light beam illumination is too strong, cannot meet the requirement of uniform-illumination in lighting quality, comfortable Luminance Distribution, the 3rd, LED driving power is to be generally together arranged in aluminum-based circuit board with LED element, the heat that LED driving power and LED element produce is by aluminum-based circuit board, to be transmitted on aluminium shell and to be dispelled the heat simultaneously, make heat conduction too concentrated, when caloric value is larger, heat is difficult to leave in time, and thermal-arrest effect easily causes LED lamp life to reduce, light efficiency decay is fast, and fault rate is high, the 4th, traditional LED fluorescent powder packaging is after LED sapphire chip is fixed on support or substrate, after mixing with a certain proportion of LED fluorescent material and casting glue, be enclosed on sapphire chip, specifically comprise a glue or spraying method, to realize exciting through fluorescent material after sapphire chip energising, send different colours, this traditional mode, encapsulation process is complicated, packaging cost is high, and LED chip is lighted adstante febre, because casting glue is shifted from the different chips that cause of the coefficient of expansion of substrate, pulling apart gold thread etc. affects the problem in LED light fitting quality and life-span.
Summary of the invention
The application provides a kind of LED light fixture, to meet high-power and volume is little, cost is low, space availability ratio is high, illumination performance is good, perfect heat-dissipating and the high requirement of quality.
The application provides a kind of LED light fixture, comprise: joint, and the luminous wick of LED, the luminous wick of this LED comprises: radiator, LED driving power, and LED luminescence component, this LED luminescence component comprises: LED chip, and the substrate that is provided with the circuit being electrically connected to this LED chip, described radiator, LED driving power and substrate mounting form firmware structure, the part that described substrate is provided with described LED chip protrudes from this firmware structure setting, described substrate has at least one installed surface that is fixed with described LED chip, described LED chip outer cup is provided with a fluorescence cover, between this fluorescence cover and described LED chip, be provided with interval.
Further, described LED chip stretches out and bearing of trend and described substrate place plane parallel from described substrate one side.
Further, described substrate is simultaneously fixed with described radiator, and described LED driving power is fixed on described radiator, or described substrate is simultaneously fixed with described radiator, and another side is fixed with described LED driving power.
Further, simultaneously to extend the bearing of trend of described LED chip and described LED chip vertical with described substrate for described substrate.
Further, described substrate another side is fixed with described radiator and LED driving power, or described substrate another side is fixed with described radiator, and described LED driving power is fixed on described radiator.
Further; this LED light fixture also comprises: protecting sheathing; and the diffuser that is arranged at this protecting sheathing and the relative one end of described joint; described firmware structure is placed in the first cavity that described protecting sheathing limits, and the part that described substrate is provided with described LED chip is placed in the second cavity that described diffuser limits.
Further, a side of close described diffuser on described protecting sheathing, and/or the side near described protecting sheathing on described diffuser is provided with reflector, offers the through hole running through for described LED chip on this reflector.
Further, described reflector caves in to described joint direction; Described reflector is reflective mirror, or reflective membrane or be coated with reflectorized material has been sticked on the reflective surface relative with described joint on described reflector.
Further, described substrate has two, three or four installed surfaces that are fixed with described LED chip; The cover body of described fluorescence cover adopts clear glass or plastic cement material.
Further; described substrate is aluminum-based circuit board; described substrate is rectangle, square, polygon or irregular shape; described protecting sheathing assembles mutually with described diffuser bolt connection type, plug-in or buckle-type; described protecting sheathing adopts heat-resistant fireproof material, and/or, on the cover body of described fluorescence cover, be coated with fluorescent material; or described fluorescence cover is the structure by fluorescent colloid curing molding.
The application's beneficial effect is:
By a kind of LED light fixture is provided, comprise: joint, and the luminous wick of LED, the luminous wick of this LED comprises: radiator, LED driving power, and LED luminescence component, this LED luminescence component comprises: LED chip, and the substrate that is provided with the circuit being electrically connected to this LED chip, described radiator, LED driving power and substrate mounting form firmware structure, the part that described substrate is provided with described LED chip protrudes from this firmware structure setting, described substrate has at least one installed surface that is fixed with described LED chip, described LED chip outer cup is provided with a fluorescence cover, on the cover body of this fluorescence cover, be coated with fluorescent material.Like this, LED chip and the design of substrate discrete, under high-power requirement, substrate volume, without increasing and increase along with LED chip, has reduced materials, has reduced cost, makes light fixture volume small and exquisite, has saved space.In addition, due to a side of close diffuser on protecting sheathing, and/or the side near protecting sheathing on diffuser is provided with reflector, and the light that LED chip sends can reflect by reflector, and secondary optical design has improved light utilization efficiency; Adopt diffuser, the light that makes to send can meet the requirement of uniform-illumination, comfortable Luminance Distribution; The heat that LED driving power and LED luminescence component produce directly dispels the heat by radiator, has strengthened the heat dispersion of light fixture, has guaranteed the service life of light fixture; Because fluorescent cover has certain distance from LED chip, actual being heated can be reduced greatly, thereby improved the service life of light fixture product, and can avoid lighting heating because of LED chip, the coefficient of expansion of casting glue and substrate is different and cause chip displacement, pull apart the faults such as gold thread, ensures quality and the service life of LED light fixture.
Accompanying drawing explanation
Fig. 1 is the perspective view of the LED light fixture of the embodiment of the present application one.
Fig. 2 is the cross-sectional view of the LED light fixture of the embodiment of the present application one.
Fig. 3 is the structural representation of LED luminescence component in the embodiment of the present application one.
The specific embodiment
Below by the specific embodiment, by reference to the accompanying drawings the application is described in further detail.
Embodiment mono-:
Please refer to Fig. 1-3, the present embodiment provides the LED light fixture of the luminous wick of a kind of LED of being provided with, and mainly comprises: protecting sheathing 1, be arranged at this protecting sheathing 1 one end joint 2, be arranged at the diffuser 3 of protecting sheathing 1 other end and the luminous wick of LED.Wherein the luminous wick of LED comprises: radiator 4, LED driving power 5, and LED luminescence component 6.Wherein, this LED luminescence component 6 comprises: LED chip 62, and the substrate 63 that is provided with the circuit being electrically connected to joint 2 and this LED chip 62 respectively.Radiator 4, LED driving power 5 and substrate 63 assemblings form a firmware structure being placed in the first cavity that protecting sheathing 1 limits, and substrate 63 is provided with the part of LED chip 62 and protrudes from this firmware structure setting and be placed in the second cavity that diffuser 3 limits.Substrate 63 has at least two installed surfaces that are fixed with LED chip 62, LED chip 62 outer cup are provided with a fluorescence cover 61, on the cover body of this fluorescence cover 61, be coated with fluorescent material, and and be provided with spacing distance between LED chip 62, four installed surfaces have been shown in Fig. 4 and have been laid with LED chip 62, but substrate 63 has the embodiment of the installed surface of the quantity such as two, three, five, also can be used as replacement scheme.Certainly, the layout of LED chip 62 on installed surface can be selected with reference to actual conditions, such as density comparatively dense or sparse etc.Like this, LED chip and the design of substrate discrete, under high-power requirement, substrate volume, without increasing and increase along with LED chip, has reduced materials, has reduced cost, makes light fixture volume small and exquisite, has saved space.
Above-mentioned fluorescence cover 61 adopts clear glass or plastic cement material, and its inwall and LED chip 62 keep at a certain distance away.Like this, actual being heated of fluorescence cover can be reduced greatly, thus the service life of having improved light fixture product, and can avoid lighting heating because of LED chip, the coefficient of expansion of casting glue and substrate is different and cause chip displacement, pull apart the faults such as gold thread, ensures quality and the service life of LED light fixture.In addition, fluorescence cover can be closed cover body or open cover body (adopting the means such as perforate to realize), and open cover body can make the circulation of air in the realization of cover body inner space and extraneous space, further strengthens heat radiation.
LED chip 62 stretches out and bearing of trend and substrate 63 place plane parallel from substrate 63 1 sides.Substrate 63 one sides are fixed with radiator 4, and LED driving power 5 is fixed on radiator 4.
A side near diffuser 3 on protecting sheathing 1 is provided with reflector 11, offers the through hole running through for LED chip 62 on this reflector 11.Like this, the light that LED chip sends can reflect by reflector, and secondary optical design has improved light utilization efficiency, has improved illumination and brightness.Reflector 11 is to joint 2 direction depressions, thereby an arc surfaced reflective surface of formation has further improved light utilization efficiency.
Substrate 63 is aluminum-based circuit board, and substrate 63 is rectangle.
Protecting sheathing 1 can adopt bolt connection type, plug-in or buckle-type to assemble mutually with diffuser 3, can carry out easily light fixture demolition and maintenance, for example, when adopting bolt connection type assembling, can adopt the modes such as screw thread or screw to install.Protecting sheathing 1 can adopt heat-resistant fireproof material, has guaranteed that protecting sheathing 1 can not be out of shape because being heated or damage.
Embodiment bis-:
The present embodiment and above-described embodiment difference are mainly: substrate is simultaneously fixed with radiator, and another side is fixed with LED driving power.
Embodiment tri-:
The present embodiment is mainly with above-described embodiment difference: the bearing of trend that substrate simultaneously extends LED chip and LED chip is vertical with substrate.Substrate another side is fixed with radiator and LED driving power, or substrate another side is fixed with radiator, and LED driving power is fixed on described radiator.
Embodiment tetra-:
The present embodiment and above-described embodiment difference are mainly: the side near protecting sheathing on diffuser is provided with reflector.
Embodiment five:
The difference of the present embodiment and above-described embodiment is mainly: the reflective membrane or be coated with reflectorized material of being sticked on the reflective surface relative with joint on reflector, can realize equally the effect of light reflection.
Embodiment six:
The present embodiment and above-described embodiment difference are mainly: substrate can be square, polygon or irregular shape etc., as multiple replacement scheme.
Embodiment seven:
The present embodiment and above-described embodiment difference are mainly: fluorescence cover can also be the structure by fluorescent colloid curing molding.
In addition, in actual applications, watt level that the length of substrate can be is with the need different and change, and does not increase the diameter of light fixture own.
Above content is the further description of the application being done in conjunction with concrete embodiment, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.

Claims (10)

1. a LED light fixture, it is characterized in that, comprise: joint, and the luminous wick of LED, the luminous wick of this LED comprises: radiator, LED driving power, and LED luminescence component, this LED luminescence component comprises: LED chip, and the substrate that is provided with the circuit being electrically connected to this LED chip, described radiator, LED driving power and substrate mounting form firmware structure, the part that described substrate is provided with described LED chip protrudes from this firmware structure setting, described substrate has at least one installed surface that is fixed with described LED chip, described LED chip outer cup is provided with a fluorescence cover, between this fluorescence cover and described LED chip, be provided with interval.
2. LED light fixture as claimed in claim 1, is characterized in that, described LED chip stretches out and bearing of trend and described substrate place plane parallel from described substrate one side.
3. LED light fixture as claimed in claim 2, is characterized in that, described substrate is simultaneously fixed with described radiator, described LED driving power is fixed on described radiator, or described substrate is simultaneously fixed with described radiator, another side is fixed with described LED driving power.
4. LED light fixture as claimed in claim 1, is characterized in that, the bearing of trend that described substrate simultaneously extends described LED chip and described LED chip is vertical with described substrate.
5. LED light fixture as claimed in claim 4, is characterized in that, described substrate another side is fixed with described radiator and LED driving power, or described substrate another side is fixed with described radiator, and described LED driving power is fixed on described radiator.
6. LED light fixture as claimed in claim 1; it is characterized in that; this LED light fixture also comprises: protecting sheathing; and the diffuser that is arranged at this protecting sheathing and the relative one end of described joint; described firmware structure is placed in the first cavity that described protecting sheathing limits, and the part that described substrate is provided with described LED chip is placed in the second cavity that described diffuser limits.
7. LED light fixture as claimed in claim 6; it is characterized in that, a side of close described diffuser on described protecting sheathing, and/or; a side near described protecting sheathing on described diffuser is provided with reflector, offers the through hole running through for described LED chip on this reflector.
8. LED light fixture as claimed in claim 7, is characterized in that, described reflector caves in to described joint direction; Described reflector is reflective mirror, or reflective membrane or be coated with reflectorized material has been sticked on the reflective surface relative with described joint on described reflector.
9. LED light fixture as claimed in claim 1, is characterized in that, described substrate has two, three or four installed surfaces that are fixed with described LED chip; The cover body of described fluorescence cover adopts clear glass or plastic cement material.
10. LED light fixture as claimed in claim 6; it is characterized in that; described substrate is aluminum-based circuit board; described substrate is rectangle, square, polygon or irregular shape; described protecting sheathing assembles mutually with described diffuser bolt connection type, plug-in or buckle-type, and described protecting sheathing adopts heat-resistant fireproof material, on the cover body of described fluorescence cover, is coated with fluorescent material; or described fluorescence cover is the structure by fluorescent colloid curing molding.
CN201420094038.5U 2014-03-03 2014-03-03 Led lamp Expired - Lifetime CN203784683U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420094038.5U CN203784683U (en) 2014-03-03 2014-03-03 Led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420094038.5U CN203784683U (en) 2014-03-03 2014-03-03 Led lamp

Publications (1)

Publication Number Publication Date
CN203784683U true CN203784683U (en) 2014-08-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420094038.5U Expired - Lifetime CN203784683U (en) 2014-03-03 2014-03-03 Led lamp

Country Status (1)

Country Link
CN (1) CN203784683U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108343920A (en) * 2018-03-14 2018-07-31 清华大学 Lighting device and lighting system
CN109442232A (en) * 2018-11-02 2019-03-08 海宁市鑫诚电子有限公司 A kind of LED lamp panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108343920A (en) * 2018-03-14 2018-07-31 清华大学 Lighting device and lighting system
CN109442232A (en) * 2018-11-02 2019-03-08 海宁市鑫诚电子有限公司 A kind of LED lamp panel

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GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8

Patentee after: Shenzhen Xinyichang Science and Technology Co.,Ltd.

Address before: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8

Patentee before: SHENZHEN XINYICHANG AUTOMATIC EQUIPMENT Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140820