CN203773016U - Apparatus for testing thermal resistance of SMD-0.5 packaging power semiconductor device - Google Patents
Apparatus for testing thermal resistance of SMD-0.5 packaging power semiconductor device Download PDFInfo
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- CN203773016U CN203773016U CN201420107215.9U CN201420107215U CN203773016U CN 203773016 U CN203773016 U CN 203773016U CN 201420107215 U CN201420107215 U CN 201420107215U CN 203773016 U CN203773016 U CN 203773016U
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- thermocouple
- smd
- power semiconductor
- square column
- heat
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- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 239000012774 insulation material Substances 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000006185 dispersion Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012806 monitoring device Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Abstract
The utility model discloses an apparatus for testing thermal resistance of a SMD-0.5 packaging power semiconductor device and belongs to the testing technology field of a semiconductor device. The apparatus comprises a heat dissipation substrate, high temperature resistance insulation glass tubes, a thermal couple and a thermal couple socket. The heat dissipation substrate is formed by rectangular cylinders identical in thickness, cylinders including square cylinders and a rectangular cylinder. Multiple screw holes are disposed on the edge of each of the square cylinders and the rectangular cylinder, and one high temperature resistance insulation glass tube is placed in each screw hole. Each square cylinder is equipped with a screw binding post and the rectangular cylinder is also equipped with a screw binding post. The thermal couple is embedded into the rectangular couple, the thermal couple socket is disposed opposite to the thermal couple, and the thermal couple is electrically connected with the thermal couple socket through a thermal couple wire. Heat conduction insulating material is arranged on a crossed interface between the square cylinders and the rectangular cylinder, and heat conduction insulating material is also arranged at the bottom of each square cylinders and the rectangular cylinder. The apparatus for testing thermal resistance can accurately test a junction-to-case thermal resistance value of a SMD-0.5 packaging power semiconductor device.
Description
Technical field
The utility model relates to semiconducter device testing technical field, particularly a kind of SMD-0.5 package power semiconductor devices heat resistance test apparatus.
Background technology
Flourish along with the widespread use of semiconductor power device and encapsulation industry, power semiconductor device increasingly towards high-power, small size, more fast and the better future development that dispels the heat.Diminishing of the raising of device power and package dimension proposed stricter test to its heat dispersion, and the quality of heat-sinking capability directly affects reliability and the serviceable life of device, and improve the most important approach of heat dispersion, is to reduce product thermal resistance.Thermal resistance is a basic parameter that characterizes power semiconductor device package cooling ability, and this parameter is particularly important for design, manufacture and the use of power semiconductor device.
SMD-0.5(Surface Mount Devices, surface mount device) encapsulation is as the more conventional encapsulated type in power device field, and its shell structure is as shown in Figure 1.When test SMD-0.5 package power semiconductor devices crust thermal resistance, need to apply power by three electrode pair devices of shell, also will use the tube shell bottom temperature below thermocouple monitoring device chip, this crosses range request heat along one-dimensional square to the conduction of the tube shell bottom below chip from chip simultaneously.The lead-in wire electrode of SMD-0.5 encapsulating package and shell temperature test point are in same plane, and the thermo-resistance measurement that this special construction is device has brought larger difficulty.In prior art, generally device is upside down on controllable temperature cooling platform during thermo-resistance measurement, by the inner thermocouple monitoring device package upper surface temperature embedding of cooling platform, device pin is connected to device is applied to power with thermal resistance tester simultaneously, and then the crust thermal resistance value of test component.But there is following shortcoming in the realization of this process: 1) existing method of testing can cause heat conduction path to change, causing heat is not along one-dimensional square to conducting to tube shell bottom from chip, thereby making thermocouple monitoring point is not shell maximum temperature point, the case temperature value testing out is more on the low side than actual temperature value, causes the thermal resistance value of calculating higher.2) using the shell temperature of thermocouple test is device package upper surface temperature, and not tube shell bottom temperature below device chip, does not meet correlation standard.
Utility model content
For solve existing SMD-0.5 package power semiconductor devices thermo-resistance measurement method precision low, operate the problems such as lack of standardization, the utility model provides a kind of SMD-0.5 package power semiconductor devices heat resistance test apparatus, and this device comprises heat-radiating substrate, high-temperature insulation glass tube, thermocouple and thermocouple socket; Described heat-radiating substrate consists of the identical rectangular cylinder of polylith thickness, comprises square column and rectangle cylinder; The edge of described square column and rectangle cylinder is respectively arranged with a plurality of screw holes, and high-temperature insulation glass tube is housed in each screw hole; On described square column and rectangle cylinder, be separately installed with screw terminal; On described rectangle cylinder, be embedded with thermocouple, the opposite of described thermocouple is provided with thermocouple socket; Described thermocouple is electrically connected to thermocouple socket by thermocouple wire; The intersection interface of described square column and rectangle cylinder and separately bottom are provided with heat-conducting insulation material.
Described heat-radiating substrate consists of 3 identical rectangular cylinders of thickness, possesses and comprises the first square column, the second square column and the first rectangle cylinder; The edge of described first, second square column is respectively arranged with 2 screw holes, and the edge of described the first rectangle cylinder one side is provided with 4 screw holes; The center of described first, second square column is separately installed with screw terminal, and the first half of described the first rectangle cylinder is provided with screw terminal; Described the first rectangle cylinder opposite side edge is embedded with thermocouple, and the opposite of described thermocouple is provided with thermocouple socket.
The length breadth ratio of described the first rectangle cylinder is 2:1.
Described thermocouple is T-shaped thermocouple, and described thermocouple socket is T-shaped thermocouple socket.
Described thermocouple wire embeds described rectangle column body.
Described heat-conducting insulation material is heat conductive insulating adhesive tape.
SMD-0.5 package power semiconductor devices heat resistance test apparatus of the present utility model, clamping action by heat-radiating substrate to measured power device, met the assumed conditions of heat along one-dimensional square to downward conduction, therefore can test out scientificly, reasonably and accurately the crust thermal resistance value of SMD-0.5 package power semiconductor devices, not only can provide important parameter index for the heat dispersion of assessment device like this, and for being all significant reliability and the serviceable life of the design of optimizing power device, raising device.
Accompanying drawing explanation
Fig. 1 is prior art SMD-0.5 encapsulating package structural representation;
Fig. 2 is the structural representation of the utility model embodiment heat resistance test apparatus;
Fig. 3 is the application example schematic diagram of the utility model embodiment heat resistance test apparatus.
Embodiment
Below in conjunction with drawings and Examples, technical solutions of the utility model are further described.
Thermal resistance mainly reflects the heat dispersion of device package, and its main expression formula is as follows:
Wherein: T
jfor device junction temperature, T
cfor the tube shell bottom temperature below device chip, P
h(V
h* I
h) be heating power.In the process of test, thermal resistance tester provides heating voltage V for device
hwith heating current I
h(heating power), and carry out calculating device junction temperature T by the pressure drop of test component internal body diodes forward junction
j, with thermocouple, monitor the device package bottom temp T below semi-conductor chip simultaneously
c, then according to above-mentioned formula, calculate the crust thermal resistance value of device.
Referring to Fig. 2, the utility model embodiment provides a kind of SMD-0.5 package power semiconductor devices heat resistance test apparatus, comprises heat-radiating substrate, high-temperature insulation glass tube 8, T-shaped thermocouple 9 and T-shaped thermocouple socket 5.Wherein, heat-radiating substrate consists of 3 identical rectangular cylinders of thickness, specifically comprises two square column 1,2, and a rectangle cylinder 3 that length breadth ratio is 2:1, the edge of square column 1,2 is respectively arranged with a plurality of for fixing screw hole 7, in the square column 1,2 of the present embodiment, 2 screw holes 7 are respectively set, the quantity of screw hole 7 can be determined according to production engineering specifications, and in each screw hole 7, high-temperature insulation glass tube 8 is housed, insulating glass pipe 8 can guarantee each component part mutually insulated of heat-radiating substrate, the center of square column 1,2 is separately installed with screw terminal 10, the edge of rectangle cylinder 3 one sides is provided with a plurality of for fixing screw hole 7, 4 screw holes 7 are set on the rectangle cylinder 3 of the present embodiment, the quantity of screw hole 7 can be determined according to production engineering specifications, and in each screw hole 7, high-temperature insulation glass tube 8 is housed, the first half of rectangle cylinder 3 is provided with screw terminal 10, rectangle cylinder opposite side edge is embedded with T-shaped thermocouple 9, it is the tighten up a screw side at 7 places, hole of rectangle cylinder 3 that the opposite of T-shaped thermocouple 9 is provided with T-shaped thermocouple socket 5(), T-shaped thermocouple 9 is electrically connected to T-shaped thermocouple socket 5 by the inner thermocouple wire 6 embedding of rectangle cylinder 3.The intersection interface of square column 1,2 and rectangle cylinder 3 and separately bottom are provided with heat conductive insulating adhesive tape 4, to guarantee their mutually insulateds each other.
Referring to Fig. 3, when using the heat resistance test apparatus of the present embodiment, first to guarantee that T-shaped thermocouple and T-shaped thermocouple socket are stably arranged on rectangle cylinder, being fixed on controllable temperature cooling platform by screw hole and screw by heat-radiating substrate; Then by measured device DUT(Device Under Test, measured device) be arranged on heat-radiating substrate, and by cooling platform self with pressure apparatus device is pressed on heat-radiating substrate tightly, to guarantee that three electrodes of device are electrically connected to corresponding three heat-radiating substrates respectively; In order to guarantee the accuracy of test result, should between measured device DUT and heat-radiating substrate, be coated with skim heat-conducting silicone grease; Use wire connecting screw connection terminal and thermal resistance tester, and T-shaped thermocouple socket is connected with thermal resistance tester, control thermal resistance tester measured device is applied to power, by T-shaped thermocouple monitoring device tube shell bottom temperature, utilize thermal resistance tester test SMD-0.5 package power semiconductor devices crust thermal resistance, test result shows and is kept on thermal resistance tester.
In actual applications, consider and improve heat dispersion and reduce manufacturing cost, the square column and the rectangle cylinder that form heat-radiating substrate form by metallic copper manufacture.The T-shaped thermopair that the present embodiment is selected has the features such as measuring accuracy is high, temperature measurement range is wide.
The SMD-0.5 package power semiconductor devices heat resistance test apparatus of the utility model embodiment, clamping action by heat-radiating substrate to measured power device, met the assumed conditions of heat along one-dimensional square to downward conduction, therefore can test out scientificly, reasonably and accurately the crust thermal resistance value of SMD-0.5 package power semiconductor devices, not only can provide important parameter index for the heat dispersion of assessment device like this, and for being all significant reliability and the serviceable life of the design of optimizing power device, raising device.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (6)
1. a SMD-0.5 package power semiconductor devices heat resistance test apparatus, is characterized in that, comprises heat-radiating substrate, high-temperature insulation glass tube, thermocouple and thermocouple socket; Described heat-radiating substrate consists of the identical rectangular cylinder of polylith thickness, comprises square column and rectangle cylinder; The edge of described square column and rectangle cylinder is respectively arranged with a plurality of screw holes, and high-temperature insulation glass tube is housed in each screw hole; On described square column and rectangle cylinder, be separately installed with screw terminal; On described rectangle cylinder, be embedded with thermocouple, the opposite of described thermocouple is provided with thermocouple socket; Described thermocouple is electrically connected to thermocouple socket by thermocouple wire; The intersection interface of described square column and rectangle cylinder and separately bottom are provided with heat-conducting insulation material.
2. SMD-0.5 package power semiconductor devices heat resistance test apparatus as claimed in claim 1, it is characterized in that, described heat-radiating substrate consists of 3 identical rectangular cylinders of thickness, possesses and comprises the first square column, the second square column and the first rectangle cylinder; The edge of described first, second square column is respectively arranged with 2 screw holes, and the edge of described the first rectangle cylinder one side is provided with 4 screw holes; The center of described first, second square column is separately installed with screw terminal, and the first half of described the first rectangle cylinder is provided with screw terminal; Described the first rectangle cylinder opposite side edge is embedded with thermocouple, and the opposite of described thermocouple is provided with thermocouple socket.
3. SMD-0.5 package power semiconductor devices heat resistance test apparatus as claimed in claim 2, is characterized in that, the length breadth ratio of described the first rectangle cylinder is 2:1.
4. SMD-0.5 package power semiconductor devices heat resistance test apparatus as claimed in claim 1, is characterized in that, described thermocouple is T-shaped thermocouple, and described thermocouple socket is T-shaped thermocouple socket.
5. SMD-0.5 package power semiconductor devices heat resistance test apparatus as claimed in claim 1, is characterized in that, described thermocouple wire embeds described rectangle column body.
6. SMD-0.5 package power semiconductor devices heat resistance test apparatus as claimed in claim 1, is characterized in that, described heat-conducting insulation material is heat conductive insulating adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420107215.9U CN203773016U (en) | 2014-03-10 | 2014-03-10 | Apparatus for testing thermal resistance of SMD-0.5 packaging power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420107215.9U CN203773016U (en) | 2014-03-10 | 2014-03-10 | Apparatus for testing thermal resistance of SMD-0.5 packaging power semiconductor device |
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|---|---|
| CN203773016U true CN203773016U (en) | 2014-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420107215.9U Expired - Lifetime CN203773016U (en) | 2014-03-10 | 2014-03-10 | Apparatus for testing thermal resistance of SMD-0.5 packaging power semiconductor device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104237300A (en) * | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN104764990A (en) * | 2015-04-02 | 2015-07-08 | 泰州海天半导体有限公司 | Device and method for online testing thermal resistance in chip mounting process |
| CN111337810A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for SMD-3 packaged power device |
-
2014
- 2014-03-10 CN CN201420107215.9U patent/CN203773016U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104237300A (en) * | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN104764990A (en) * | 2015-04-02 | 2015-07-08 | 泰州海天半导体有限公司 | Device and method for online testing thermal resistance in chip mounting process |
| CN111337810A (en) * | 2020-03-23 | 2020-06-26 | 上海精密计量测试研究所 | Thermal resistance testing device for SMD-3 packaged power device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150929 Address after: No. 11 Beijing 100029 Chaoyang District microelectronics Beitucheng West Road Comprehensive Building 4 layer Patentee after: BEIJING ZHONGKE XINWEITE SCIENCE & TECHNOLOGY DEVELOPMENT Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140813 |