CN203721701U - Supporting leg device of semiconductor wafer - Google Patents
Supporting leg device of semiconductor wafer Download PDFInfo
- Publication number
- CN203721701U CN203721701U CN201420095714.0U CN201420095714U CN203721701U CN 203721701 U CN203721701 U CN 203721701U CN 201420095714 U CN201420095714 U CN 201420095714U CN 203721701 U CN203721701 U CN 203721701U
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Abstract
The utility model discloses a supporting leg device of a semiconductor wafer; the supporting leg comprises an annular support ring arranged on an upper end of a wafer storage table in a semiconductor technology equipment wafer transmission system, and a plurality of support pins arranged on a periphery of the support ring and used for supporting the wafer; the support pin is in an L shape; an upper end of an L-shaped vertical portion is provided with a wafer support surface; an L-shaped horizontal portion is connected with the support ring; the support pin is connected with the support ring in an entad direction that the L-shaped vertical portion is positioned in an outer side and the L-shaped horizontal portion is positioned in an inner side; the support ring is reduced in a whole size, so equipment occupation area is reduced, and the wafer cannot fall and be broken from an inner diameter of the support ring; the wafer is more easily and stably placed, , thereby preventing friction damages and particle generation; the supporting leg device is suitable for factory promotion.
Description
Technical field
The utility model relates to the wafer storage platform in a kind of semiconductor manufacturing equipment wafer transfer system, more specifically, relates to the wafer support foot device of wafer storage platform in a kind of semiconductor manufacturing equipment wafer transfer system.
Background technology
Semiconductor manufacturing industry is circulation and the repetition of a series of main technological steps.Many preparation technologies comprise the chemical reaction occurring in semiconductor manufacturing equipment process cavity.Now, the treatment process to semiconductor crystal wafer, will use the chemical reaction occurring in process cavity conventionally.
According to treatment process of different nature, wafer often need to transmit by wafer transfer system between the process cavity of a plurality of semiconductor manufacturing equipments.In process equipment, the major function of wafer transfer system is to load wafer, and all handling are all completed by automation.Wafer receives into from device external, and the waiting period before technique is carried out, and needs the place of a temporary transient storage.The device of using during storage is wafer storage platform, in the top, is for manipulator, to pick up the support feet of wafer.
At present, common wafer support foot device generally comprises the annular brace ring being arranged on storage platform, and the some feets that are arranged on the supporting wafer on support ring circumference, and wafer is picked up in the space that manipulator can enter between adjacent two feets.
The designing requirement of wafer support device can make wafer place steadily, is convenient to Robot actions, and can protects wafer not damaged.
Chinese utility model patent CN202791172U support feet discloses a kind of support feet for wafer storage platform.This device support by the some feets that can adjust position along support ring circumference that are arranged on support ring the wafer being placed on it.Although the design form of this device can be is easily entered hand space by what adjust that feet meets manipulator in the position of support ring circumference, so that Robot actions, but also there is obvious problem: this support feet is because the wafer support face of feet is positioned at the front end of feet simultaneously, and be positioned at the rear end of feet with the rigging position of support ring, the internal diameter that makes support ring be greater than the outside dimension of wafer, the external diameter of support ring to expose the part of wafer external diameter a lot.The defect that this problem is brought is, cause the design of whole storage platform to take larger area on the one hand, on the other hand in manipulator fault or debugging, because manipulator crawl wafer is not firm or deviation, cause wafer to skid off bracing or strutting arrangement and land fragmentation from the inner radius of support ring, not only cause certain economic loss, also have influence on the production efficiency of equipment.In addition, this device adjustable support pin is not high in the design form actual application value of support ring circumferential position.For avoiding manipulator to collide feet, can enter according to manipulator the maximum fluctuation scope of hand distance completely, certain anticollision distance margin is left in the installation site of support ring upper support pin and prevent.And the structure of this device support ring is also more complicated, causes difficulty of processing greatly to improve, and can bring the increase of equipment cost.
Utility model content
The purpose of this utility model is to overcome the above-mentioned defect that prior art exists, the Novel wafer support feet of wafer storage platform in a kind of semiconductor manufacturing equipment wafer transfer system is provided, by feet is designed to by wafer support face in outside, the structure of arranging at interior side direction with the installation site of support ring, make the internal diameter of support ring can be less than the outside dimension of wafer, and the part that the external diameter of support ring exposes wafer external diameter seldom, thereby dwindled the diameter of support ring, reduced the floor space of storage platform, and can avoid wafer from the inner radius of support ring, to land fragmentation when skidding off bracing or strutting arrangement because of deviation.
For achieving the above object, the technical solution of the utility model is as follows:
A support feet for semiconductor crystal wafer, comprises the annular brace ring that is arranged on wafer storage platform upper end in semiconductor manufacturing equipment wafer transfer system, is arranged on some feets of the supporting wafer on support ring circumference.Described feet is L shaped, the upper end of its L shaped vertical portion is provided with wafer support face, its L shaped horizontal component is installed and is connected with described support ring, and described feet is positioned at by its L shaped vertical portion the centripetal direction that outside, L shaped horizontal component be positioned at inner side and is connected with described support ring installation.The utility model improves the structural correspondence relation between the wafer support face position of feet in prior art and rigging position, rigging position by original wafer support face between inner side and support ring be positioned at outside front and back form is set, become the rigging position of wafer support face of the present utility model between outside and support ring be positioned at inner side front and back form is set.The version of feet in prior art, makes the external diameter of support ring much larger than brilliant diameter of a circle, causes the corresponding expansion of floor space of storage platform; And the internal diameter of support ring is greater than brilliant diameter of a circle, in manipulator fault or debugging, because manipulator captures the not firm or deviation of wafer, can causes wafer to skid off bracing or strutting arrangement and land fragmentation from the inner radius of support ring.New design of the present utility model makes support ring be able to integral body to dwindle, thereby can save the floor space of wafer storage platform.Simultaneously, the internal diameter of support ring is also due to the corresponding relation with feet installation site, and the diameter of a circle that the wafer support face inner side that is certainly less than each feet surrounds, the internal diameter that has guaranteed support ring is less than brilliant diameter of a circle, can avoid wafer from the inner radius of support ring, to land fragmentation when skidding off bracing or strutting arrangement because of deviation.
Further, the upper end of the L shaped vertical portion of described feet is provided with a halfpace, the table top of described halfpace is described wafer support face, the external facade of table top of described halfpace, described facade is for to consist of two crossing flare inclined-planes, the intersection on two described inclined-planes forms the corner angle staff protruding, and described corner angle staff overlaps with the axial symmetry median plane of described feet; Two described inclined-planes that form facade are crossing with halfpace, the lateral surface coplanar of the lateral surface of described facade and the L shaped vertical portion of described feet.Adopting halfpace design is in order to dwindle the area of wafer support face, reduces the contact area between wafer and wafer support face, improves the utilance of wafer.And facade is by two designs that crossing inclined-plane forms of tilting laterally, play and stop that wafer moves and the effect of the guiding that glides outward, when wafer, place when not in place, inclined-plane can stop that wafer moves outward, and slides to wafer support face under the protrusion corner angle staff that wafer is formed along the intersection by two inclined-planes.
Further, the upper end of the L shaped vertical portion of described feet is provided with wafer support face, described wafer support face is for consisting of two crossing inclined-planes that have a down dip to side direction in described support ring, the intersection on two described inclined-planes forms the corner angle staff protruding, and described corner angle staff overlaps with the axial symmetry median plane of described feet.Can reduce like this contact area between wafer and wafer support face, improve the utilance of wafer.The external facade in described two crossing inclined-planes, the inclined-plane that described facade is flare, the lateral surface coplanar of the lateral surface of described facade and the L shaped vertical portion of described feet.Inclined-plane shape facade can play equally and stop that wafer moves and the effect of the guiding that glides outward.
Further, the L shaped horizontal component of described feet is provided with mounting hole, the circumferential upper end of described support ring is distributed with some centripetal grooves, described groove floor is provided with installing hole, the L shaped horizontal component of described feet is arranged in described groove, and described feet is installed and is connected with the described installing hole of described support ring by the securing member through described mounting hole.Installation site between feet and support ring is arranged on to the inner side of wafer support face, makes the size of support ring be able to greatly reduce than prior art, saved the floor space of storage platform.The design of mounting hole, makes feet can adjust as required the installation site of centripetal direction.It is firm that groove design can make feet install, and play the guide effect while installing.
Further, described feet is installed and is connected with the described installing hole of described support ring by the securing member through described mounting hole, in described mounting hole, have installation step, described securing member is fastenedly connected the installing hole of described feet and described support ring by installation step.
Further, the afterbody of described securing member is imbedded described mounting hole, and its upper surface is not higher than the upper surface of the L shaped horizontal component of described feet.In the time of can avoiding like this that wafer is improper to be skidded off supporting surface and fall, touch the afterbody of securing member and damage.
Further, the table top of described halfpace is described wafer support face, and the radical length of described wafer support face is not more than 2mm.It is not need to make product that wafer periphery has the scope of 2mm conventionally, by principle the wafer support face of wafer and feet can overlap 2mm with interior be optimum state.
Further, the external facade of the table top of described halfpace, described facade is for to consist of two crossing flare inclined-planes, and the drift angle that the corner angle staff that the intersection on described two inclined-planes forms forms is fillet, and its radius of corner is 0.2～0.5mm.Drift angle is designed to fillet, is hard scraping degree when it contacts with wafer, wafer being caused in order to reduce.
Further, described wafer support face is for consisting of two crossing inclined-planes that have a down dip to side direction in described support ring, and the drift angle that the corner angle staff that the intersection on described two inclined-planes forms forms is fillet, and its radius of corner is 0.2～0.5mm.This drift angle is also designed to fillet, is hard scraping degree when it contacts with wafer, wafer being caused in order to reduce equally.
Further, described feet is arranged on the circumference of described support ring, and its quantity is 3.Wherein, between any 2 adjacent supports pin and the described support ring center of circle, the angle of line is between 30～150 degree, and the line of described 3 feets forms isosceles triangle.Manipulator enter the long distance of waist that hand space is isosceles triangle.According to manipulator, enter the demand in hand space, after the location positioning of any 2 adjacent supports pin, the position of the 3rd feet is also determined thereupon.Accordingly, can distinguish the size of wafer, batch machining has the support ring of different-diameter and different angles groove location to be installed and used, simple in structure, handling ease, and cost is relatively cheap.
From technique scheme, can find out, the L shaped structure that the utility model is arranged at interior side direction by feet being designed to by wafer support face in outside, with the installation site of support ring, make the internal diameter of support ring due to the corresponding relation with feet installation site, and the diameter of a circle that the wafer support face inner side that is certainly less than each feet surrounds, the internal diameter that has guaranteed support ring is less than brilliant diameter of a circle, can avoid wafer from the inner radius of support ring, to land fragmentation when skidding off bracing or strutting arrangement because of deviation; And the external diameter of support ring has also dwindled simultaneously, reduced the floor space of storage platform; Meanwhile, wafer support face and stop the improvement of ramp structure, more easily lays steadily wafer, reduces damage and particle that friction brings and produces.Therefore, the utlity model has simple in structure, easy realization, can save occupation area of equipment and reduce the distinguishing feature of wafer breakage rate.
Accompanying drawing explanation
Fig. 1 is the assembly structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model;
Fig. 2 is a kind of supporting foot structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model;
Fig. 3 is the supporting ring structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model;
Fig. 4 is the assembly structure cutaway view of the support feet in Fig. 1;
Fig. 5 is the another kind of structural representation of the support feet feet of a kind of semiconductor crystal wafer of the utility model.
100. feets in figure, 101.L shape horizontal component, 102. trapezoidal shape wafer support faces, 103. two crossing flare inclined-planes, 104. mounting holes, 105. two crossing bottom incline shape wafer support faces, 106.L shape vertical portion, 107. steps, 108. two crossing flare inclined-plane corner angle staffs, 109. flares stop inclined-plane, 110. two crossing bottom incline corner angle staffs, 200. screws, 300. support ring, 301. grooves, 302. installation screws, 400. wafers.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
Embodiment mono-
In the present embodiment, refer to Fig. 1, Fig. 1 is the assembly structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model.As shown in the figure, the support feet of the utility model wafer comprises the annular brace ring 300 that is arranged on wafer storage platform (omitting in figure) upper end in semiconductor manufacturing equipment wafer transfer system, and is arranged on 3 feets 100 of the supporting wafer on support ring circumference.Feet is L shaped, the upper end of its L shaped vertical portion 106 is provided with wafer support face, its L shaped horizontal component 101 is processed with mounting hole, is processed with installation step in mounting hole, and screw 200 passes mounting hole and by installation step, feet and support ring is fastenedly connected.Feet by its L shaped vertical portion be positioned at outside, L shaped horizontal component is positioned at being connected towards the installation of support ring center of circle direction and support ring of inner side.
The utility model improves the structural correspondence relation between the wafer support face position of feet in prior art and rigging position, rigging position by original wafer support face between inner side and support ring be positioned at outside front and back form is set, become the rigging position of wafer support face of the present utility model between outside and support ring be positioned at inner side front and back form is set.The version of feet in prior art, makes the external diameter of support ring much larger than brilliant diameter of a circle, causes the corresponding expansion of floor space of storage platform; And the internal diameter of support ring is greater than brilliant diameter of a circle, in manipulator fault or debugging, because manipulator captures the not firm or deviation of wafer, can causes wafer to skid off bracing or strutting arrangement and land fragmentation from the inner radius of support ring.New design of the present utility model makes support ring be able to integral body to dwindle, thereby can save the floor space of wafer storage platform.Simultaneously, the internal diameter of support ring is also due to the corresponding relation with feet installation site, and the diameter of a circle that the wafer support face inner side that is certainly less than each feet surrounds, the internal diameter that has guaranteed support ring is less than brilliant diameter of a circle, can avoid wafer from the inner radius of support ring, to land fragmentation when skidding off bracing or strutting arrangement because of deviation.
Refer to Fig. 2, Fig. 2 is a kind of supporting foot structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model.As shown in the figure, feet is L shaped.The upper end of the L shaped vertical portion 106 of feet is provided with a trapezoidal shape wafer support face 102, and the table top of halfpace is wafer support face, and this wafer support face is plane.The external facade of trapezoidal shape wafer support face 102, this facade is for to consist of two crossing flare inclined-planes 103.Two crossing flare inclined-plane corner angle staffs 108 overlap with the axial symmetry median plane of feet, are positioned at middle position.Two crossing flare inclined-planes 103 intersect with halfpace, the lateral surface coplanar of the L shaped vertical portion 106 of the lateral surface of facade and feet.
In Fig. 2, the wafer support face of feet adopts halfpace design, is in order to dwindle the area of wafer support face, reduces the contact area between wafer and wafer support face, improves the utilance of wafer.It is not need to make product that wafer periphery has the scope of 2mm conventionally, by principle the wafer support face of wafer and feet can overlap 2mm with interior be optimum state.Therefore, the radical length of wafer support face is processed into and is not more than 2mm.And facade is by two designs that crossing inclined-plane forms of tilting laterally, play and stop that wafer moves and the effect of the guiding that glides outward, when wafer, place when not in place, inclined-plane can stop that wafer moves outward, and slides to wafer support face under the protrusion corner angle staff that wafer is formed along the intersection by two inclined-planes.The drift angle that the corner angle staff that the intersection on two inclined-planes forms forms is processed into fillet, and its radius of corner is 0.2～0.5mm, can reduce hard scraping degree when it contacts with wafer, wafer being caused.
Please continue to refer to Fig. 2, as shown in the figure, the L shaped horizontal component 101 of feet is provided with mounting hole 104, makes feet can be adjusted at as required the installation site of support ring circumference centripetal direction.In mounting hole, be processed with installation step 107, like this, the screw 200 shown in Fig. 1 can and be fastenedly connected feet and support ring by installation step through mounting hole.
Refer to Fig. 3, Fig. 3 is the supporting ring structure schematic diagram of the support feet of a kind of semiconductor crystal wafer of the utility model.As shown in the figure, the circumferential upper end of support ring is distributed with 3 centripetal grooves 301, and groove floor is provided with installation screw 302.Groove, in the L shaped horizontal component of 3 feets is arranged on, can make feet install firm, and plays the guide effect while installing.Screw 200 shown in Fig. 1 can pass the mounting hole of the L shaped horizontal component of feet and by the installation step in mounting hole, the installation screw of feet and support ring 302 is fastenedly connected.
Please further consult Fig. 4, Fig. 4 is the assembly structure cutaway view of the support feet in Fig. 1.As shown in the figure, feet 100 is arranged on the groove location of support ring 300, and screw 200 passes the mounting hole of the L shaped horizontal component of feet and by the installation step in mounting hole, the installation screw of feet and support ring is fastenedly connected.The afterbody of screw is imbedded mounting hole, and compresses with step.The upper surface of screw afterbody is not higher than the upper surface of the L shaped horizontal component of feet.In the time of can avoiding like this that wafer is improper to be skidded off supporting surface and fall, touch the afterbody of securing member and damage.Trapezoidal shape wafer support face upper support has wafer 400, when wafer is when placing the external inclined-plane of contact wafer support face not in place, two external crossing inclined-planes of wafer support face can stop that wafer moves outward, and impel it along sliding to wafer support face under the protrusion corner angle staff being formed by the intersection on two inclined-planes.The inner side spacing of 2 L shaped vertical portions of feet shown in figure, enters hand space for manipulator.
Please continue to refer to Fig. 1, the structure of the feet exemplifying in Fig. 1 is consistent with the feet in Fig. 2.As shown in the figure, the L shaped horizontal component of 3 feets 100 is arranged in the groove on support ring 300 circumference.The concrete installation site of 3 feets 100 meets following condition: between any 2 adjacent supports pin and the support ring center of circle, the angle of line is between 30～150 degree, and the line of 3 feets forms isosceles triangle.Manipulator enter the long distance of waist that hand space is isosceles triangle.According to manipulator, enter the demand in hand space, after the location positioning of any 2 adjacent supports pin, the position of the 3rd feet is also determined thereupon.Accordingly, can distinguish the size of wafer, batch machining has the support ring of different-diameter and different angles groove location to be installed and used, simple in structure, handling ease, and cost is relatively cheap.
Wafer support face of the present utility model and stop the improvement of ramp structure, more easily lays steadily wafer, reduces damage and particle that friction brings and produces.Therefore, the utlity model has simple in structure, easy realization, can save occupation area of equipment and reduce the distinguishing feature of wafer breakage rate, be suitable for factory and promote.
Embodiment bis-
In the present embodiment, refer to Fig. 5, Fig. 5 is the another kind of structural representation of the support feet feet of a kind of semiconductor crystal wafer of the utility model.As shown in the figure, feet profile is still L shaped, and the structure of its L shaped horizontal component 101 is consistent with the feet exemplifying in embodiment mono-.In the present embodiment, the upper end of the L shaped vertical portion 106 of feet is provided with wafer support face, and described wafer support face is for to consist of two crossing bottom incline shape wafer support faces 105.Two crossing bottom incline corner angle staffs 110 overlap with the axial symmetry median plane of feet, are positioned at middle position.Can reduce like this contact area between wafer and wafer support face, improve the utilance of wafer.Two external facades in crossing inclined-plane, described facade is flare stops inclined-plane 109.The lateral surface coplanar of the L shaped vertical portion 106 of the lateral surface of facade and feet.Inclined-plane shape facade can play equally and stop that wafer moves and the effect of the guiding that glides outward.The drift angle that the corner angle staff that the intersection on two inclined-planes forms forms is processed into fillet, and its radius of corner is 0.2～0.5mm, can reduce hard scraping degree when it contacts with wafer, wafer being caused.Other structures of this feet and with the assembly relation of support ring and embodiment mono-roughly the same, and there is same function, this example repeats no more.
Above-described is only preferred embodiment of the present utility model; described embodiment is not in order to limit scope of patent protection of the present utility model; therefore the equivalent structure that every utilization specification of the present utility model and accompanying drawing content are done changes, and in like manner all should be included in protection range of the present utility model.
Claims (10)
1. the support feet of a semiconductor crystal wafer, comprise the annular brace ring that is arranged on wafer storage platform upper end in semiconductor manufacturing equipment wafer transfer system, be arranged on some feets of the supporting wafer on support ring circumference, it is characterized in that, described feet is L shaped, the upper end of its L shaped vertical portion is provided with wafer support face, its L shaped horizontal component is installed and is connected with described support ring, and described feet is positioned at by its L shaped vertical portion the centripetal direction that outside, L shaped horizontal component be positioned at inner side and is connected with described support ring installation.
2. the support feet of wafer as claimed in claim 1, it is characterized in that, the upper end of the L shaped vertical portion of described feet is provided with a halfpace, the table top of described halfpace is described wafer support face, the external facade of table top of described halfpace, described facade is for to consist of two crossing flare inclined-planes, and the intersection on two described inclined-planes forms the corner angle staff protruding, and described corner angle staff overlaps with the axial symmetry median plane of described feet; Two described inclined-planes that form facade are crossing with halfpace, the lateral surface coplanar of the lateral surface of described facade and the L shaped vertical portion of described feet.
3. the support feet of wafer as claimed in claim 1, it is characterized in that, the upper end of the L shaped vertical portion of described feet is provided with wafer support face, described wafer support face is for consisting of two crossing inclined-planes that have a down dip to side direction in described support ring, the intersection on two described inclined-planes forms the corner angle staff protruding, and described corner angle staff overlaps with the axial symmetry median plane of described feet; The external facade in described two crossing inclined-planes, the inclined-plane that described facade is flare, the lateral surface coplanar of the lateral surface of described facade and the L shaped vertical portion of described feet.
4. the support feet of wafer as claimed in claim 1, it is characterized in that, the L shaped horizontal component of described feet is provided with mounting hole, the circumferential upper end of described support ring is distributed with some centripetal grooves, described groove floor is provided with installing hole, the L shaped horizontal component of described feet is arranged in described groove, and described feet is installed and is connected with the described installing hole of described support ring by the securing member through described mounting hole.
5. the support feet of wafer as claimed in claim 4, it is characterized in that, described feet is installed and is connected with the described installing hole of described support ring by the securing member through described mounting hole, in described mounting hole, have installation step, described securing member is fastenedly connected the installing hole of described feet and described support ring by installation step.
6. the support feet of wafer as claimed in claim 5, is characterized in that, the afterbody of described securing member is imbedded described mounting hole, and its upper surface is not higher than the upper surface of the L shaped horizontal component of described feet.
7. the support feet of wafer as claimed in claim 2, is characterized in that, the table top of described halfpace is described wafer support face, and the radical length of described wafer support face is not more than 2mm.
8. the support feet of wafer as claimed in claim 2, it is characterized in that, the external facade of table top of described halfpace, described facade is for to consist of two crossing flare inclined-planes, the drift angle that the corner angle staff that the intersection on described two inclined-planes forms forms is fillet, and its radius of corner is 0.2～0.5mm.
9. the support feet of wafer as claimed in claim 3, it is characterized in that, described wafer support face is for consisting of two crossing inclined-planes that have a down dip to side direction in described support ring, the drift angle that the corner angle staff that the intersection on described two inclined-planes forms forms is fillet, and its radius of corner is 0.2～0.5mm.
10. the support feet of the wafer as described in claim 1 or 4, is characterized in that, described feet is arranged on the circumference of described support ring, and its quantity is 3; Wherein, between any 2 adjacent supports pin and the described support ring center of circle, the angle of line is between 30～150 degree, and the line of described 3 feets forms isosceles triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420095714.0U CN203721701U (en) | 2014-03-04 | 2014-03-04 | Supporting leg device of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420095714.0U CN203721701U (en) | 2014-03-04 | 2014-03-04 | Supporting leg device of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721701U true CN203721701U (en) | 2014-07-16 |
Family
ID=51160837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420095714.0U Withdrawn - After Issue CN203721701U (en) | 2014-03-04 | 2014-03-04 | Supporting leg device of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203721701U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811399A (en) * | 2014-03-04 | 2014-05-21 | 北京七星华创电子股份有限公司 | Support device of semiconductor wafer |
-
2014
- 2014-03-04 CN CN201420095714.0U patent/CN203721701U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811399A (en) * | 2014-03-04 | 2014-05-21 | 北京七星华创电子股份有限公司 | Support device of semiconductor wafer |
| CN103811399B (en) * | 2014-03-04 | 2016-04-06 | 北京七星华创电子股份有限公司 | A kind of bracing or strutting arrangement of semiconductor crystal wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140716 Effective date of abandoning: 20160406 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |