CN203720769U

CN203720769U - Heat source separated cooling fin for computer

Info

Publication number: CN203720769U
Application number: CN201420071532.XU
Authority: CN
Inventors: 孙永升; 鹿博; 王雪; 张凤涛
Original assignee: Shandong Chaoyue Numerical Control Electronics Co Ltd
Current assignee: Shandong Chaoyue Numerical Control Electronics Co Ltd
Priority date: 2014-02-19
Filing date: 2014-02-19
Publication date: 2014-07-16
Anticipated expiration: 2024-02-19

Abstract

The utility model discloses a heat source separated cooling fin for a computer. The heat source separated cooling fin comprises a cooling fin substrate, a heat pipe and a chip A heat release module, wherein heat conduction treatment is performed on a chip A by utilizing the chip A heat release module; the temperature resistance value of the chip A is smaller than temperature resistance values of other areas; the heat pipe is led to other heat release areas after passing the area of the chip A heat release module; heat isolation belts are arranged between the area of the chip A heat release module and the other heat release areas; in the area of the chip A heat release module, a gap is formed between the heat pipe and the chip A heat release module. For the manner, of the cooling fin, that chips are distinguished according to different power consumption of the chips and the heat pipe is still shared, all areas of the heat pipe are effectively obstructed by utilizing the principle of a fire-barrier belt, so the problem that a low-temperature resistance chip is heated can also be avoided while the heat release requirements of all the chips are met.

Description

Thermal source separate type heat radiator for a kind of computing machine

Technical field

The utility model relates to a kind of computing machine thermal source separate type heat radiator, belongs to computer realm.

Background technology

As special computer, in order to adapt to rugged environment, especially marine salt mist environment, complete machine need to be made the form of totally-enclosed.And along with the day by day development of electricity piece, more performance is integrated on some boards, the power consumption of board is also more and more higher thereupon, and this just makes the heat radiation of totally-enclosed machine face larger difficulty.

At present the conventional mode to board heat radiation is the heat radiator that increases aluminium milling processing on board, takes mode that aluminium sheet is close to realize the derivation of heat in corresponding high-power die.But this kind of mode is for current powerful chip inapplicable, although because leading on heat radiator for this kind of mode heat, but heat flow density is still excessive, the distribution in temperature field is too concentrated, cannot be taken away timely though heat can be derived.

For tackling this kind of mode, derive again a kind of mode of adding heat pipe on heat radiator, heat pipe is arranged along the surface of each chip, this kind of mode can make heat to lead uniformly on heat radiator along heat pipe, solved the too concentrated problem of temperature field distribution, this is also the conventional mode of high power consumption chip of tackling at present.But along with the development of integrated chip, this kind of mode also brought a new problem: because of limited space, this type of heat radiator one to two heat pipe of often can only arranging, that is to say that a lot of chips have to share a heat pipe.And the heat transfer efficiency of heat pipe is high, make heat almost loss-free fast along heat pipe transmission.But different chip heatproof value differences, and the temperature value of heat pipe just depends on the chip of maximum power dissipation, this also just makes original not hot chip also can be heated by large power consumption chip, makes this type of chip occur overheated problem.

Summary of the invention

Technical problem to be solved in the utility model is: in order to solve heat pipe by the problem of low heatproof temperature chip heating, the utility model proposes a kind of new thermal source separate type heat radiator.Can solve the problem of chip cooling, also can solve the problem of low heatproof temperature chip heating simultaneously.

Technical solution adopted in the utility model is:

Thermal source separate type heat radiator for a kind of computing machine, comprise heat radiator matrix, heat pipe, chip A radiating module, its chips A utilizes chip A radiating module to carry out heat conduction processing, the heatproof value of chip A is lower than the heatproof value in other regions, heat pipe leads to other heat dissipation region again through the region of chip A radiating module, between chip A radiating module region and other heat dissipation region, is provided with heat isolation strip.

In chip A radiating module heat dissipation region, between heat pipe (1) and chip A radiating module (2), be provided with gap, realize the isolation of heat.

The beneficial effects of the utility model are: distinguish according to the difference of chip power-consumption for heat radiator, heat pipe still adopts shared mode, utilize the principle of fire-blocking belt that the regional of heat pipe is effectively intercepted, in meeting each chip cooling, also can avoid the problem of low heatproof chip heating.

Brief description of the drawings

Fig. 1 is 3-D view of the present utility model;

Fig. 2 is the cross sectional view that the utility model is crossed chip A radiating module 2;

Fig. 3 is plan view of the present utility model;

Reference numeral: 1, heat pipe, 2, chip A radiating module, 3, chip B radiating module, 4, chip C radiating module, 5, heat radiator matrix, 6, heat isolation strip, 7, gap.

Embodiment

Below in conjunction with the drawings and specific embodiments, the utility model is described further.

As shown in Figures 1 to 3, arrange according to layout, chip A and chip B utilize respectively chip A radiating module 2 and chip B radiating module 3 to carry out heat conduction processing, space constraint heat pipe 1 needs to increase heat pipe for avoiding thermal field distribution to concentrate, because must pass through chip A radiating module in through chip B radiating module 3.But because the heatproof value difference of two chips, for avoiding heat to transmit between two chips by heat pipe, causes low heatproof chip heated, the technical scheme that the present embodiment adopts:

Thermal source separate type heat radiator for a kind of computing machine, comprise heat radiator matrix 5, heat pipe 1, chip A radiating module 2, its chips A utilizes chip A radiating module 2 to carry out heat conduction processing, the heatproof value of chip A is lower than the heatproof value in other regions, heat pipe leads to other heat dissipation region again through the region of chip A radiating module 2, between chip A radiating module 2 regions and other heat dissipation region, is provided with heat isolation strip 6.

In chip A radiating module 2 heat dissipation region, between heat pipe 1 and chip A radiating module 2, be provided with gap 7, realize the isolation of heat.

Claims

1. a thermal source separate type heat radiator for computing machine, comprise heat radiator matrix, heat pipe, chip A radiating module, its chips A utilizes chip A radiating module to carry out heat conduction processing, the heatproof value of chip A is lower than the heat-resisting value in other regions, heat pipe leads to other heat dissipation region again through the region of chip A radiating module, it is characterized in that: between chip A radiating module and other heat dissipation region, be provided with heat isolation strip.

2. thermal source separate type heat radiator for a kind of computing machine according to claim 1, is characterized in that: in chip A radiating module heat dissipation region, between heat pipe and radiating module, be provided with gap.