CN203700557U - Phosphor copper ball with grooves in surface - Google Patents
Phosphor copper ball with grooves in surface Download PDFInfo
- Publication number
- CN203700557U CN203700557U CN201420083873.9U CN201420083873U CN203700557U CN 203700557 U CN203700557 U CN 203700557U CN 201420083873 U CN201420083873 U CN 201420083873U CN 203700557 U CN203700557 U CN 203700557U
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- CN
- China
- Prior art keywords
- copper balls
- phosphorous copper
- phosphor copper
- copper ball
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
The utility model relates to a phosphor copper ball with grooves in the surface. The phosphor copper ball comprises a phosphor copper ball body and the grooves formed in the surface of the phosphor copper ball body at intervals, wherein the height difference between the groove bottom of each groove and the surface of the phosphor copper ballbody is in a range of 1-3 mm. Compared with an existing solid phosphor copper ball with the smooth and flat surface, the phosphor copper ball with the grooves in the surface has the advantages that the surface area is large, the bearable current is large, more copper ions are released during electroplating, and the usage rate is high.
Description
Technical field
The utility model relates to a kind of reeded phosphorous copper balls of surperficial tool for electroplating.
Background technology
Anodic phosphorous copper balls is the main plated material in copper-plating technique, is the root that cupric ion produces.The phosphorous copper balls of existing plating use is all the phosphorous copper balls of solid shape, and the smooth surface of phosphorous copper balls is smooth.Easily there is following problem in the smooth phosphorous copper balls of this smooth surface: 1, phosphorous copper balls surface-area is fixed, and can only have fixing cupric ion to discharge from the surface of phosphorous copper balls in the time electroplating use; 2, while just having brought into use, because the each several part of phosphorous copper balls generates the phosphorus content difference of phosphorus film because of each several part, the phosphorus film of XianCheng has dividing of speed; 3, the fixing phosphorous copper balls of surface-area, because use at the beginning needs first false plating, makes phosphorous copper balls produce uniformly phosphorus film, therefore the cupric ion that needs waste to use in advance; 4, when large electric current use, because phosphorous copper balls surface-area is fixed, can only the larger copper ball of option table area, therefore phosphorous copper balls uses size to become large; 5, owing to being solid and phosphorous copper balls that surfacing is smooth, its quality is heavier, and cost is higher.
Summary of the invention
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, and a kind of reeded phosphorous copper balls of surperficial tool for electroplating is provided.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
The reeded phosphorous copper balls of a kind of surperficial tool, comprises phosphorous copper balls body, and described phosphorous copper balls also comprises the groove being disposed on described phosphorous copper balls body surface, and the surperficial difference of altitude of the trench bottom of described groove and described phosphorous copper balls body is 1 ~ 3mm.
Described groove is arranged on the whole surface of described phosphorous copper balls body evenly distributedly.
Described groove is semisphere, and the centre of sphere of all described grooves is all on same sphere.
Due to the enforcement of above technical scheme, the utility model compared with prior art has following advantages:
The surface uniform of the utility model phosphorous copper balls is distributed with groove, the existence of groove can increase the outer surface area of phosphorous copper balls greatly, equating under spherical diameter, compare existing phosphorous copper balls solid and that smooth surface is smooth and there is larger surface-area, cupric ion can be emitted cupric ion from groove surfaces and phosphorous copper balls body surface simultaneously simultaneously, so the cupric ion of emitting under identical conditions is many, make that circulating current can be born larger, can shorten the time of plating, and the utilization ratio of corresponding phosphorous copper balls is all high than existing phosphorous copper balls, can reduce the required electroplating time of workpiece, and the reeded phosphorous copper balls of surperficial tool is compared existing phosphorous copper balls, and also to have quality lighter, the advantage that cost is lower.
Accompanying drawing explanation
Fig. 1 is the cross-sectional schematic of phosphorous copper balls of the present invention.
In figure: 1, phosphorous copper balls body; 10, groove.
Embodiment
Below in conjunction with Figure of description, the utility model is described further:
As shown in Figure 1, phosphorous copper balls of the present utility model, comprises phosphorous copper balls body 1, is disposed on the lip-deep groove 10 of phosphorous copper balls body 1, and the surperficial difference of altitude of the trench bottom of groove 10 and phosphorous copper balls body 1 is 1 ~ 3mm.
While setting particularly, groove 10 is evenly distributed on the whole surface of phosphorous copper balls body 1, is shaped as semisphere, fluted 10 the centre of sphere all on same sphere.
Adopting diameter of the present utility model is that the smooth phosphorous copper balls of the reeded phosphorous copper balls of surperficial tool of 25mm and the existing solid surface of same diameter is simultaneously for electroplating (wherein, groove radius on the reeded phosphorous copper balls of surface tool is 2mm), after using 72 hours, its result is as follows:
1. the phosphorous copper balls that the smooth diameter of solid and smooth surface is 25mm: weight 73.5g before not using, use current density 3A, negative plate 16g, used after 72 hours, copper ball diameter 22mm, weight 45g after using, negative plate weight 45g.
2. the reeded phosphorous copper balls of surperficial tool: weight 70g before not using, use current density 3A, negative plate 16g, used after 72 hours, copper ball diameter 20mm, weight 40g after using, negative plate weight 48g.
The above results can find out, the reeded phosphorous copper balls of surperficial tool, due to the large advantage of surface-area of the phosphorous copper balls more smooth than solid surface, is being electroplated in performance, and the speed that discharges cupric ion is fast.
Above the utility model is described in detail; its object is to allow the personage who is familiar with this art can understand content of the present utility model and be implemented; can not limit protection domain of the present utility model with this; all equivalences of doing according to spirit of the present utility model change or modify, and all should be encompassed in protection domain of the present utility model.
Claims (3)
1. the reeded phosphorous copper balls of surperficial tool, comprise phosphorous copper balls body, it is characterized in that, described phosphorous copper balls also comprises the groove being disposed on described phosphorous copper balls body surface, and the surperficial difference of altitude of the trench bottom of described groove and described phosphorous copper balls body is 1 ~ 3mm.
2. the reeded phosphorous copper balls of surperficial tool according to claim 1, is characterized in that, described groove is arranged on the whole surface of described phosphorous copper balls body evenly distributedly.
3. the reeded phosphorous copper balls of surperficial tool according to claim 1, is characterized in that, described groove is semisphere, and the centre of sphere of all described grooves is all on same sphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420083873.9U CN203700557U (en) | 2014-02-26 | 2014-02-26 | Phosphor copper ball with grooves in surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420083873.9U CN203700557U (en) | 2014-02-26 | 2014-02-26 | Phosphor copper ball with grooves in surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203700557U true CN203700557U (en) | 2014-07-09 |
Family
ID=51051019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420083873.9U Expired - Fee Related CN203700557U (en) | 2014-02-26 | 2014-02-26 | Phosphor copper ball with grooves in surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203700557U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849909A (en) * | 2014-02-26 | 2014-06-11 | 东又悦（苏州）电子科技新材料有限公司 | Phosphor copper ball with grooves at surface and preparation method thereof |
-
2014
- 2014-02-26 CN CN201420083873.9U patent/CN203700557U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103849909A (en) * | 2014-02-26 | 2014-06-11 | 东又悦（苏州）电子科技新材料有限公司 | Phosphor copper ball with grooves at surface and preparation method thereof |
| CN103849909B (en) * | 2014-02-26 | 2017-01-04 | 东又悦（苏州）电子科技新材料有限公司 | A kind of surface has the preparation method of reeded phosphorous copper balls |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20170226 |