CN203536428U - Lead frame free of weld mark - Google Patents
Lead frame free of weld mark Download PDFInfo
- Publication number
- CN203536428U CN203536428U CN201320567425.1U CN201320567425U CN203536428U CN 203536428 U CN203536428 U CN 203536428U CN 201320567425 U CN201320567425 U CN 201320567425U CN 203536428 U CN203536428 U CN 203536428U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- weld mark
- utility
- model
- middle pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a lead frame free of a weld mark. The lead frame comprises a paster zone, a radiating fin, a middle pin and two side pins. The middle pin and the two side pins are fixed through a connecting piece. Root parts of the two side pins are provided with weld feet welded with bonding wires. One end of the middle pin, close to the paster zone, is provided with an open hole. According to the lead frame, one end of the middle pin, close to the paster zone, is provided with the open hole, so that resin can reach the other surface of the lead frame through the open hole to shorten filling time in the injection moulding, thereby preventing bubble formation in the injection moulding and weld mark formation on the surface of the lead frame. The appearance and the quality of the lead frame are guaranteed.
Description
Technical field
The utility model semiconductor packages field, is specifically related to the lead frame that a kind of anti-weld mark produces.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material, form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.Existing lead frame, when injection moulding, tends to form pore, further produces weld mark, not only can affect the outward appearance of product, and can affect the quality of lead frame.
In Chinese utility model patent specification CN201758123U, a kind of lead frame is disclosed, shown in lead frame when injection moulding, tend to form pore, further produce weld mark, not only can affect the outward appearance of product, and can affect the quality of lead frame.
Utility model content
In order to solve existing lead frame, can form weld mark when the injecting glue, further affect outward appearance and quality, the lead frame that the utility model provides a kind of anti-weld mark to produce.
The lead frame that described a kind of anti-weld mark produces, comprises Chip Area, fin, interim pins and two side pipe pin; Described interim pins and two side pipe pin are fixed by brace, and the root of two side pipe pin is provided with the leg with bonding wire welding, and described interim pins is provided with perforate near one end, Chip Area.
As a kind of optimal way, described perforate is rectangle.
Preferably, described fin inside is provided with pilot hole, and described pilot hole periphery is provided with the first convex tendon.
Further, described fin periphery is provided with the second convex tendon, and described Chip Area periphery is provided with the 3rd convex tendon.
The utility model is by being provided with the mode of perforate near one end, Chip Area in interim pins, the another side that can allow resin arrive lead frame by perforate when injection moulding carrys out the brief filling time, thereby prevent from forming bubble when injection mo(u)lding, lead frame surface produces weld mark.Outward appearance and the quality of lead frame have been guaranteed.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is side structure schematic diagram of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment 1
With reference to figure 1 and Fig. 2, the lead frame that a kind of anti-weld mark produces, comprises Chip Area 2, fin 1, interim pins 4 and two side pipe pin 3; Described fin 1 periphery is provided with the second convex tendon 92, and described Chip Area 2 peripheries are provided with the 3rd convex tendon 93, and described fin 1 inside is provided with pilot hole 8, and described pilot hole 8 peripheries are provided with the first convex tendon 91; Described interim pins 4 and two side pipe pin 3 are fixed by brace 7, and the root of two side pipe pin 3 is provided with the leg 5 with bonding wire welding, and described interim pins 3 is provided with perforate 6 near 2 one end, Chip Area, and described perforate 6 is rectangle opening.
Resin is injected into lead frame from injection hole 10, owing to having perforate 6, the another side that can allow resin arrive interim pins 4 place's lead frames by perforate carrys out the brief filling time, thereby prevents from forming bubble when injection mo(u)lding, and lead frame surface produces weld mark.Outward appearance and the quality of lead frame have been guaranteed.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. the lead frame that anti-weld mark produces, comprises Chip Area, fin, interim pins and two side pipe pin; Described interim pins and two side pipe pin are fixed by brace, and the root of two side pipe pin is provided with the leg with bonding wire welding, it is characterized in that, described interim pins is provided with perforate near one end, Chip Area.
2. the lead frame that a kind of anti-weld mark produces according to claim 1, is characterized in that, described perforate is rectangle.
3. the lead frame that a kind of anti-weld mark produces according to claim 1, is characterized in that, described fin inside is provided with pilot hole, and described pilot hole periphery is provided with the first convex tendon.
4. the lead frame that a kind of anti-weld mark produces according to claim 3, is characterized in that, described fin periphery is provided with the second convex tendon, and described Chip Area periphery is provided with the 3rd convex tendon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320567425.1U CN203536428U (en) | 2013-09-13 | 2013-09-13 | Lead frame free of weld mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320567425.1U CN203536428U (en) | 2013-09-13 | 2013-09-13 | Lead frame free of weld mark |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203536428U true CN203536428U (en) | 2014-04-09 |
Family
ID=50422607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320567425.1U Expired - Fee Related CN203536428U (en) | 2013-09-13 | 2013-09-13 | Lead frame free of weld mark |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203536428U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545769A (en) * | 2018-11-15 | 2019-03-29 | 佛山市蓝箭电子股份有限公司 | Silicon chip package lead frame and its packaging method |
-
2013
- 2013-09-13 CN CN201320567425.1U patent/CN203536428U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545769A (en) * | 2018-11-15 | 2019-03-29 | 佛山市蓝箭电子股份有限公司 | Silicon chip package lead frame and its packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203536428U (en) | Lead frame free of weld mark | |
| CN105591010A (en) | ED chip, LED support, and packaging method of LED chip | |
| CN104576407B (en) | A kind of tin plating encapsulating method and structure in lead frame pin end face | |
| CN201417768Y (en) | Lead frame for semi-conductor integrated circuit | |
| CN204204914U (en) | LED encapsulation structure | |
| CN203466185U (en) | Novel IC molding structure | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN202474034U (en) | Surface-mounted LED (light emitting diode) device adopting flexible rubbers to protect inner core | |
| CN203210622U (en) | Plastic packaging mold box | |
| CN204375733U (en) | A kind of Double-lead-frame | |
| CN202977524U (en) | A surface-mounted LED lamp bead | |
| CN206388725U (en) | LED encapsulation structure | |
| CN207690789U (en) | A kind of TO lead frames preventing layering | |
| CN203536423U (en) | Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction | |
| CN203942698U (en) | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight | |
| CN203659845U (en) | Lead frame having limiting structure | |
| CN104369322A (en) | Injection molding mold of chip-sticking and rectifying bridge | |
| CN206849834U (en) | A kind of lead frame of shock resistance | |
| CN207353084U (en) | A kind of locating support and the pouring current transformer with the locating support | |
| CN204451058U (en) | A kind of paster rectifier bridge injection mold | |
| CN202816926U (en) | Semiconductor lead frame preventing reverse packaging | |
| CN206364053U (en) | A kind of firm optically focused LED support | |
| CN202977521U (en) | A surface-mounted LED lamp bead with double gold threads | |
| CN202917480U (en) | Multi-chip integrated circuit leading wire framework for increasing plastic packaging binding force | |
| CN205488112U (en) | SOT223 frame construction that goes between |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 Termination date: 20140913 |
|
| EXPY | Termination of patent right or utility model |