CN203536423U - Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction - Google Patents

Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction Download PDF

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Publication number
CN203536423U
CN203536423U CN201320561141.1U CN201320561141U CN203536423U CN 203536423 U CN203536423 U CN 203536423U CN 201320561141 U CN201320561141 U CN 201320561141U CN 203536423 U CN203536423 U CN 203536423U
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CN
China
Prior art keywords
chip
pin
bonding wire
lead frame
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320561141.1U
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Chinese (zh)
Inventor
王鹏
曹周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Great Team Backend Foundry Dongguan Co Ltd
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Great Team Backend Foundry Dongguan Co Ltd
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Priority to CN201320561141.1U priority Critical patent/CN203536423U/en
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Publication of CN203536423U publication Critical patent/CN203536423U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The utility model relates to a novel connection structure used in wire welding of a chip with multiple welding windows in the Y-axis direction. The novel connection structure comprises a lead wire framework. The lead wire framework is provided with a chip. A power supply interface and electrodes are arranged on the chip. Aluminium foil is connected between the electrodes. One side of the lead wire framework is connected with lead wire framework pins which comprise a first pin and a second pin. The first pin is connected to the power supply interface through a first aluminium wire, and the second pin is connected to the aluminium foil through a second aluminium wire. The novel connection structure used in wire welding of the chip with multiple welding windows in the Y-axis direction provided by the utility model solves a problem that the wire welding of a conventional chip with multiple windows in the Y-axis direction is difficult or cannot be achieved.

Description

A kind of bonding wire new Joining Structure of many welding windows of Y direction chip
Technical field
The utility model relates to chip package art of wire, is specifically related to a kind of bonding wire new Joining Structure of many welding windows of Y direction chip.
Background technology
In the encapsulation process of semiconductor components and devices, because aluminium foil conduction bearing capacity is good, therefore often select aluminium foil or be used as the bridge that is connected between lead frame pin and chip electrode, the wire soldering method of existing many welding windows of Y direction chip and syndeton thereof are as Fig. 1, comprise and on lead frame 1, chip 2, described chip 2, be respectively equipped with power interface 3, the first electrodes 4, the second electrode 5, third electrode 6; Described lead frame 1 is provided with lead frame pin, described lead frame pin comprises the first lead frame pin 7, the second lead frame pin 8, described the first lead frame pin 7 connects power interface 3 by aluminum steel 9, and described the first electrode 4, the second electrode 5, third electrode 6 are all connected on the second lead frame pin 8 by aluminium foil 10; In this wire soldering method, because electrode is arranged at the Y direction of chip and parallel between two, have larger turning when bonding wire, directly weld aluminium foil or bonding wire and all have very large difficulty, this has increased the weight of the operation cost of enterprise undoubtedly, and has affected welding quality.
Application number is that 200610172822.3 Chinese patent discloses the patent of invention that name is called " chip-packaging structure ", between its chip and a plurality of interior pins, adopt bonding wire to be connected, in its connection procedure, use a plurality of switch-over soldering pads, this has increased the weight of the production cost of enterprise greatly in operating process, be not suitable for the long term growth of enterprise.
Utility model content
The purpose of this utility model is to provide a kind of bonding wire new Joining Structure of many welding windows of Y direction chip, solves existing Y direction multiwindow chip bonding wire difficulty or present situation that cannot bonding wire, reduces the production cost of enterprise.
In order to overcome the above problems, the utility model provides a kind of bonding wire new Joining Structure of many welding windows of Y direction chip, comprise a lead frame, described lead frame is provided with chip, described chip is provided with power interface and electrode, between described electrode, be connected with aluminium foil, one side of described lead frame is connected with lead frame pin, described lead frame pin comprises the first pin and the second pin, described the first pin is connected in described power interface by the first aluminum steel, improvements of the present utility model are, described the second pin is connected in described aluminium foil by the second aluminum steel.
Further, the quantity of described electrode is 3, and described electrode is arranged at the Y direction of chip, and parallel between two.
Further, the quantity of described aluminium foil is 2.
The quantity of the aluminum steel further, being connected between described the second pin and described aluminium foil is 4.
The bonding wire new Joining Structure of many welding windows of a kind of Y direction of the utility model chip, existing Y direction multiwindow chip bonding wire difficulty or present situation that cannot bonding wire have been solved, adopt 4 aluminum steels to be connected in aluminium foil and pin, simple to operation, and current carrying capacity is strong, greatly saved the quality of enterprise's production cost and welding.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of existing Y direction multiwindow chip bonding wire;
The structural representation of new Joining Structure for the welding of a kind of many welding windows of Y direction chip that Fig. 2 provides for the utility model.
Embodiment
The bonding wire new Joining Structure of a kind of many welding windows of Y direction chip that the utility model provides, solves existing Y direction multiwindow chip bonding wire difficulty or present situation that cannot bonding wire, reduces the production cost of enterprise.
Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model is clearly and completely described, obviously, described is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.
Referring to Fig. 2, the utility model provides a kind of bonding wire new Joining Structure of many welding windows of Y direction chip, comprise a lead frame 20, described lead frame 20 is provided with chip 21, described chip 21 is provided with power interface 22 and electrode 23, 23, described electrode is connected with aluminium foil 24, one side of described lead frame 20 is connected with lead frame pin, described lead frame pin comprises the first pin two 5 and the second pin two 6, described the first pin two 5 is connected in described power interface 22 by the first aluminum steel 27, described the second pin two 6 is connected in described aluminium foil 24 by the second aluminum steel 28, while having solved existing Y direction multiwindow chip bonding wire, exist and compared with large turning, cause bonding wire difficulty or present situation that cannot bonding wire, the quantity of described electrode 23 is 3, described electrode is arranged at the Y direction of chip, and parallel between two, the quantity of described aluminium foil is 2, the quantity of the aluminum steel being connected between described the second pin and described aluminium foil is 4, strengthen current carrying capacity.
Known by above description, the bonding wire new Joining Structure of many welding windows of a kind of Y direction of the utility model chip, existing Y direction multiwindow chip bonding wire difficulty or present situation that cannot bonding wire have been solved, adopt 4 aluminum steels to be connected in aluminium foil and pin, simple to operation, and current carrying capacity is strong, greatly saved the quality of enterprise's production cost and welding.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims (4)

1. the bonding wire new Joining Structure of many welding windows of Y direction chip, comprise a lead frame, described lead frame is provided with chip, described chip is provided with power interface and electrode, between described electrode, be connected with aluminium foil, one side of described lead frame is connected with lead frame pin, described lead frame pin comprises the first pin and the second pin, described the first pin is connected in described power interface by the first aluminum steel, it is characterized in that, described the second pin is connected in described aluminium foil by the second aluminum steel.
2. the bonding wire new Joining Structure of a kind of many welding windows of Y direction chip according to claim 1, is characterized in that, the quantity of described electrode is 3, and described electrode is arranged at the Y direction of chip, and parallel between two.
3. the bonding wire new Joining Structure of a kind of many welding windows of Y direction chip according to claim 1, is characterized in that, the quantity of described aluminium foil is 2.
4. the bonding wire new Joining Structure of a kind of many welding windows of Y direction chip according to claim 1, is characterized in that, the quantity of the second aluminum steel being connected between described the second pin and described aluminium foil is 4.
CN201320561141.1U 2013-09-11 2013-09-11 Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction Expired - Lifetime CN203536423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320561141.1U CN203536423U (en) 2013-09-11 2013-09-11 Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction

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Application Number Priority Date Filing Date Title
CN201320561141.1U CN203536423U (en) 2013-09-11 2013-09-11 Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction

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CN203536423U true CN203536423U (en) 2014-04-09

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104409430A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof
CN104409372A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104409430A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof
CN104409372A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof
CN104409372B (en) * 2014-12-08 2018-09-21 杰群电子科技（东莞）有限公司 A kind of semiconductor devices and its packaging method

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Granted publication date: 20140409