CN203521397U - PGA/BGA three-dimensional structure used for component assembling - Google Patents
PGA/BGA three-dimensional structure used for component assembling Download PDFInfo
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- CN203521397U CN203521397U CN201320625737.3U CN201320625737U CN203521397U CN 203521397 U CN203521397 U CN 203521397U CN 201320625737 U CN201320625737 U CN 201320625737U CN 203521397 U CN203521397 U CN 203521397U
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- module
- bga
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The utility model discloses a PGA/BGA three-dimensional structure used for component assembling. The structure includes a T/R module, a lead-out end of which is a BGA structure and a subsystem plate, a lead-out end of which is a PGA structure. The T/R module includes a T/R module substrate and components connected to the T/R module substrate. The subsystem plate includes a subsystem substrate and components connected to the subsystem substrate. The T/R module substrate and the subsystem substrate are also provided with cavities used for installing the components. Both of the T/R module substrate and the subsystem substrate are LTCC substrates. The PGA/BGA three-dimensional structure adopts a cavity and BGA lead-out structure so that three-layer three-dimensional assembling of the components is realized and assembling area is reduced and assembling density is improved and system weight is reduced. The cavity structure enables the components to be protected better and lead-wire length to be optimized further and thus reliability of the T/R module is improved. The subsystem plate can be used for assembling of not only a planar mother board, but also a curved-surface mother board.
Description
Technical field
The utility model relates to a kind of PGA/BGA three-dimensional structure for components and parts assembling.
Background technology
Active phase array antenna is comprised of a hundreds of even thousands of T/R module conventionally.These T/R modules or employing planar alignment, or adopt curved surface to arrange.Owing to can not carrying out good coplanar contact for the T/R module of plane assembling with curved surface, therefore while assembling, T/R module is difficult to carry out coplanar welding with curved surface.Therefore adopt the T/R module of planar alignment to be generally only applicable to the assembling of plane motherboard, can not carry out the assembling of curved surface motherboard.Equally, owing to can not carrying out good coplanar contact with plane motherboard for the T/R module of curved surface assembling, subsystem is difficult to weld with plane, and the subsystem that therefore adopts curved surface to arrange is generally also only applicable to curved surface assembling, form conformal antenna, and can not assemble for plane motherboard.
Conventional components and parts assembling is to carry out in two-dimensional surface.The chip of assembling or other elements are more, and shared assembling area is just larger, and the area of module, volume and weight are also just larger.If make assembling components and parts vertical distribution two-layer or more multi-layered on, with three-dimensional assembling, substitute two-dimentional one side assembling, can make module and system bulk dwindle, weight saving, owing to having shortened interconnection line, ghost effect reduces simultaneously, and signal transmission is faster, noise and loss also decline, and the performance of system is further enhanced.
Summary of the invention
The utility model adopts PGA/BGA 3-D stacks structure fabrication active phase array antenna T/R module subsystem, has not only realized the vertical closed assembly of chip, has improved packaging density, and this structure both can be used for the assembling of plane motherboard, also can be used for the assembling of curved surface motherboard.
A kind of PGA/BGA three-dimensional structure for components and parts assembling of the present utility model, comprises that exit is the T/R module of BGA structure and the subsystem plate that exit is PGA structure; Described T/R module comprises T/R module substrate and is connected to the components and parts on T/R module substrate, described subsystem plate comprises subsystem substrate and is connected to the components and parts on subsystem substrate, on described T/R module substrate and subsystem substrate, be also provided with the cavity for mounting related components, the BGA exit of described T/R module welds mutually with subsystem substrate.
Described T/R module substrate and subsystem substrate are ltcc substrate.
This product is comprised of upper and lower two parts.Top be with can assembling chip in cavity, cavity etc. components and parts, exit be the T/R module of BGA structure; Bottom be with can assembling chip in cavity, cavity etc. components and parts, surface can assemble several T/R modules, exit is the subsystem plate of PGA structure.
T/R module substrate and subsystem plate all adopt LTCC(LTCC) make.
Cavity on T/R module substrate and subsystem plate is by borehole on green band, multi-layer green ceramic band is laminated to then sintering forms.
T/R(module) BGA on substrate makes metallization weld zone in T/R substrate bottom surface, adopts the middle temperature soldered ball of 210-230 ℃ of fusing point to form by reflow welding mode.
PGA on subsystem plate makes metallization weld zone in subsystem plate bottom surface, adopt plating Ni/Au to cut down to draw pin to form by AuSn welding manner.
T/R module is by make metallization weld zone on subsystem plate with being connected of subsystem plate, then adopts low temperature soldering paste to link together making metallization weld zone on the BGA on T/R substrate and subsystem plate.If subsystem plate is assembled on plane motherboard, to draw pin length consistent for all PGA; If be assembled on curved surface motherboard, it is inconsistent that all PGA draw pin length, draws pin length and can select or cut out according to the distance of this point to curved surface.
The utility model compared with prior art tool has the following advantages:
1, packaging density is high.Prior art is generally only carried out the assembling of components and parts individual layer at substrate surface.The utility model adopts cavity and BGA deriving structure, has realized the assembling of components and parts three-layer stereo, therefore, has reduced assembling area, has improved packaging density.For the many systems of module units, incite somebody to action reduction system volume greatly, mitigation system weight.Simultaneously.Owing to having used cavity structure, the components and parts in cavity are better protected, and wire length is further optimized, so the reliability of T/R module and performance will be improved.
2, subsystem plate can be used for plane and curved surface assembling.By select or cutting different length draw the subsystem plate that pin is made PGA exit, can make subsystem plate both can be used for the assembling that plane motherboard also can be used for curved surface motherboard.
Accompanying drawing explanation
Fig. 1 is the utility model PGA/BGA three-dimensional structure welding schematic diagram;
1:LTCC substrate; 2: pad; 3:BGA soldered ball; 4:PGA draws pin; 5: cavity; 6: components and parts.
Embodiment
As shown in Figure 1, the PGA/BGA three-dimensional structure for components and parts assembling of the present utility model, comprises that exit is the T/R module of BGA structure and the subsystem plate that exit is PGA structure; Described T/R module comprises T/R module substrate and is connected to the components and parts on T/R module substrate, described subsystem plate comprises subsystem substrate and is connected to the components and parts on subsystem substrate, on described T/R module substrate and subsystem substrate, be also provided with the cavity for mounting related components, the BGA exit of described T/R module welds mutually with subsystem substrate; Described T/R module substrate and subsystem substrate are ltcc substrate.
The manufacture method of PGA/BGA three-dimensional structure of the present utility model, can adopt following steps:
1), by borehole on green band, multi-layer green ceramic band laminated to sintering then form with the T/R module substrate of cavity with the subsystem substrate of cavity;
2), adopt AuSn weld tabs or soldering paste that PGA is drawn to pin to be welded on subsystem substrate, welding temperature is 310～350 ℃;
3), adopt the middle temperature scolder of 210-230 ℃ of fusing point by reflow welding, components and parts to be welded on subsystem substrate, welding temperature is 240～270 ℃;
4), on T/R module substrate, the middle temperature soldered ball of fusing point 210-230 ℃ is seated in to BGA pad locations, adopt the middle temperature solder paste of 210-230 ℃ of fusing point in cavity, to pre-fix components and parts, then by reflow welding, on T/R module substrate, form BGA structure and welding component, welding temperature is 240～270 ℃;
5), on the corresponding welding position of the subsystem plate being connected with T/R module, stamp or put and coat eutectic welding cream Sn62Pn36Ag2 or Sn63Pn37, on the surface of T/R module substrate, need on the position of welding component the same low temperature soldering paste Sn62Pn36Ag2 of employing or Sn63Pn37 to pre-fix components and parts, again T/R module and subsystem plate are carried out to contraposition, by reflow welding, realize the welding of T/R Modular surface components and parts and the welding of T/R module and subsystem plate, welding temperature is 210～240 ℃.
The utility model adopts cavity and BGA deriving structure, has realized the assembling of components and parts three-layer stereo, has reduced assembling area, has improved packaging density.For the many systems of module units, incite somebody to action reduction system volume greatly, mitigation system weight.Meanwhile, owing to having used cavity structure, the components and parts in cavity are better protected, and wire length is further optimized, so the reliability of T/R module and performance will be improved.Subsystem plate of the present utility model can be used for plane and curved surface assembling.By select or cutting different length draw the subsystem plate that pin is made PGA exit, can make subsystem plate both can be used for the assembling that plane motherboard also can be used for curved surface motherboard.
Claims (2)
1. for a PGA/BGA three-dimensional structure for components and parts assembling, it is characterized in that, comprise that exit is the T/R module of BGA structure and the subsystem plate that exit is PGA structure; Described T/R module comprises T/R module substrate and is connected to the components and parts on T/R module substrate, described subsystem plate comprises subsystem substrate and is connected to the components and parts on subsystem substrate, on described T/R module substrate and subsystem substrate, be also provided with the cavity for mounting related components, the BGA exit of described T/R module welds mutually with subsystem substrate.
2. as claimed in claim 1 for the PGA/BGA three-dimensional structure of components and parts assembling, it is characterized in that, described T/R module substrate and subsystem substrate are ltcc substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320625737.3U CN203521397U (en) | 2013-10-11 | 2013-10-11 | PGA/BGA three-dimensional structure used for component assembling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320625737.3U CN203521397U (en) | 2013-10-11 | 2013-10-11 | PGA/BGA three-dimensional structure used for component assembling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521397U true CN203521397U (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320625737.3U Expired - Fee Related CN203521397U (en) | 2013-10-11 | 2013-10-11 | PGA/BGA three-dimensional structure used for component assembling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489847A (en) * | 2013-10-11 | 2014-01-01 | 中国电子科技集团公司第四十三研究所 | PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components and production method thereof |
-
2013
- 2013-10-11 CN CN201320625737.3U patent/CN203521397U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489847A (en) * | 2013-10-11 | 2014-01-01 | 中国电子科技集团公司第四十三研究所 | PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components and production method thereof |
| CN103489847B (en) * | 2013-10-11 | 2016-05-18 | 中国电子科技集团公司第四十三研究所 | A kind of PGA/BGA three-dimensional structure for components and parts assembling and preparation method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20161011 |
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| CF01 | Termination of patent right due to non-payment of annual fee |