CN203510496U - Silicon material cutting device - Google Patents
Silicon material cutting device Download PDFInfo
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- CN203510496U CN203510496U CN201320680605.0U CN201320680605U CN203510496U CN 203510496 U CN203510496 U CN 203510496U CN 201320680605 U CN201320680605 U CN 201320680605U CN 203510496 U CN203510496 U CN 203510496U
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- silicon material
- pulley
- cutter sweep
- cut
- material cutter
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Abstract
The utility model provides a silicon material cutting device comprising silicon material driving devices and a cutting line, wherein the silicon material driving devices are used for driving a to-be-cut silicon material to rotate; and the cutting line is arranged on one side of the silicon material, and at least one part of the cutting line extends in the axial direction of the silicon material and performs linear cutting motion. According to the silicon material cutting device, the silicon driving devices are utilized to drive the silicon material to rotate, and further, the cutting line moving in the axial direction of the silicon material is arranged on one side of the silicon material, so that redundant material on the silicon material is cut off wholly by the cutting line. Therefore, the redundant material on the silicon material can be recovered, and accordingly, not only can the material waste be reduced, but also the condition of environment pollution caused by production of silicon powder contained wastewater can be prevented.
Description
Technical field
The utility model relates to silicon material manufacture field, more specifically, relates to a kind of silicon material cutter sweep.
Background technology
After silicon material evolution, need to remove unnecessary part through broken side, round as a ball supervisor, thereby in prior art, be to adopt the method for wheel grinding to carry out rounding processing to silicon material to remove unnecessary material.Yet, adopt the method for wheel grinding can produce a large amount of silica flours, this part silica flour can be drained along with waste water, can not be recycled, and has so not only caused the waste of material also to pollute the environment.
Utility model content
The utility model aims to provide a kind of silicon material cutter sweep, removes the problem of the easy contaminated environment of excess stock to solve the method for the employing wheel grinding of prior art.
For solving the problems of the technologies described above, the utility model provides a kind of silicon material cutter sweep, comprising: silicon material drive unit, for driving silicon material rotation to be cut; Line of cut, is arranged on a side of silicon material, and at least a portion of line of cut extends axially and do line cutting movement along silicon material.
Further, silicon material cutter sweep also comprises that the first support pulley and second supports pulley, and at least a portion winding of line of cut is supported between pulley at the first support pulley and second.
Further, the first support pulley and second supports the same side that pulley is arranged on silicon material drive unit.
Further, silicon material cutter sweep also comprises actinobacillus wheel and the take-up pulley arranging rotationally, and one end winding of line of cut is on actinobacillus wheel, and the other end winding of line of cut is on take-up pulley.
Further, silicon material cutter sweep also comprises: work box, and silicon material drive unit, first supports pulley and the second support pulley is arranged on the end face of work box; Actinobacillus wheel and take-up pulley are arranged on the inside of work box.
Further, silicon material cutter sweep also comprises: leading block, leading block is arranged between actinobacillus wheel and take-up pulley.
Further, silicon material cutter sweep also comprises tension-adjusting gear, and tension-adjusting gear comprises pinch roller and for compressing the swing arm of the line of cut between actinobacillus wheel and take-up pulley; Pinch roller is pivotably mounted in swing arm.
Further, silicon material drive unit comprises the first clamping element and the second clamping element, and silicon material clamping is between the first clamping element and the second clamping element.
Further, silicon material cutter sweep also comprises actinobacillus wheel drive unit and take-up pulley drive unit, and actinobacillus wheel drive unit drives and is connected with actinobacillus wheel, and take-up pulley drive unit drives and is connected with take-up pulley.
Further, silicon material cutter sweep also comprises for controlling the control system of silicon material drive unit and line of cut.
The utility model utilizes silicon material drive unit to drive silicon material to rotatablely move, and is provided with along the line of cut of silicon material axially-movable in a side of silicon material, and line of cut is cut down the excess stock monoblock on silicon material.Like this, can realize the recycling of excess stock on silicon material, thereby both can reduce the waste of material, can avoid again because producing the situation of the waste water contaminated environment that contains silica flour.
Accompanying drawing explanation
The accompanying drawing that forms the application's a part is used to provide further understanding of the present utility model, and schematic description and description of the present utility model is used for explaining the utility model, does not form improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 has schematically shown the structural representation of the silicon material cutter sweep in the utility model; And
Fig. 2 has schematically shown the top view of Fig. 1.
Reference numeral in figure: 10, silicon material drive unit; 20, line of cut; 31, first support pulley; 32, second support pulley; 33, leading block; 41, actinobacillus wheel; 42, take-up pulley; 50, work box; 60, tension-adjusting gear; 61, pinch roller; 62, swing arm; 71, the first clamping element; 72, the second clamping element; 80, silicon material.
The specific embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
The utility model provides a kind of silicon material cutter sweep, please refer to Fig. 1 and Fig. 2, and this silicon material cutter sweep comprises: silicon material drive unit 10, for driving silicon material to be cut 80 rotations; Line of cut 20, is arranged on a side of silicon material 80, and at least a portion of line of cut 20 extends axially and do line cutting movement along silicon material 80.Preferably, described silicon material 80 is monocrystal rod.
As depicted in figs. 1 and 2, in the course of work of silicon material cutter sweep, silicon material drive unit 10 drives silicon material 80 to rotatablely move, and line of cut 20 is axially done cutting movement in a side of silicon material along silicon material 80 simultaneously; Like this, when the redundance of Gui Liao 80 edges can contact with line of cut 20, line of cut 20 monoblocks that meeting passive movement cut, thereby complete the processing of silicon material 80.
The utility model utilizes silicon material drive unit 10 to drive silicon material 80 to rotatablely move, and is provided with along the line of cut 20 of silicon material 80 axially-movables in a side of silicon material 80, and line of cut 20 is cut down the excess stock monoblock on silicon material 80.Like this, can realize the recycling of excess stock on silicon material 80, thereby both can reduce the waste of material, can avoid again because producing the situation of the waste water contaminated environment that contains silica flour.
Preferably, silicon material cutter sweep also comprises that the first support pulley 31 and second supports pulley 32, and at least a portion winding of line of cut 20 is supported between pulley 32 at the first support pulley 31 and second.Line of cut 20 is erected to the first support pulley 31 and second and supports on pulley 32, be both conducive to the cutting of 20 pairs of silicon material 80 of line of cut, can facilitate again the transmission of line of cut 20.
Preferably, the first support pulley 31 and second supports the same side that pulley 32 is arranged on silicon material drive unit 10.Arrange like this, when silicon material 80 rotatablely moves, line of cut 20 just can be poured out fillet from silicon material 80, thereby the excess stock on silicon material 80 is cut down.
Preferably, silicon material cutter sweep also comprises actinobacillus wheel 41 and the take-up pulley 42 arranging rotationally, and one end winding of line of cut 20 is on actinobacillus wheel 41, and the other end winding of line of cut 20 is on take-up pulley 42.By the two ends of line of cut 20, winding is on actinobacillus wheel 41 and take-up pulley 42 respectively, and like this, when actinobacillus wheel 41 and take-up pulley 42 are done rotatablely moving of matching, line of cut 20 is transferred on take-up pulley 42 from actinobacillus wheel 41 gradually.
Preferably, silicon material cutter sweep also comprises: work box 50, and silicon material drive unit 10, first supports pulley 31 and the second support pulley 32 is arranged on the end face of work box 50; Actinobacillus wheel 41 and take-up pulley 42 are arranged on the inside of work box 50.
Preferably, silicon material cutter sweep also comprises: leading block 33, leading block 33 is arranged between actinobacillus wheel 41 and take-up pulley 42.Preferably, silicon material cutter sweep comprises a plurality of leading blocks 33.In the transmission process of line of cut 20, if line of cut 20 occurs to relax, will affect significantly the effect of cutting.Herein, between actinobacillus wheel 41 and take-up pulley 42, leading block 33 is set, like this, when line of cut 20 occurs to relax, 33 pairs of this states of leading block have a kind of cushioning effect, make still to keep tensioning state in cutting the part line of cut 20 of silicon material 80, thereby improve the stability of cut state.
Preferably, silicon material cutter sweep also comprises tension-adjusting gear 60, and tension-adjusting gear 60 comprises pinch roller 61 and for compressing the swing arm 62 of the line of cut 20 between actinobacillus wheel 41 and take-up pulley 42; Pinch roller 61 is pivotably mounted in swing arm 62.Preferably, tension-adjusting gear 60 is arranged on the position near actinobacillus wheel 41.Preferably, silicon material cutter sweep also comprises pneumatic means, and described pneumatic means is for controlling the motion of swing arm 62.Like this, by controlling the position of swing arm 62, pinch roller 61 is pressed on the line of cut 20 between actinobacillus wheel 41 and take-up pulley 42, just can realizes the adjustment of the tension force of line of cut 20.
Preferably, silicon material drive unit 10 comprises the first clamping element 71 and the second clamping element 72, and silicon material 80 is clamped between the first clamping element 71 and the second clamping element 72.Utilize the first clamping element 71 and the second clamping element 72 to clamp silicon material 80, can make silicon material drive unit 10 more easily drive silicon material 80 to rotate.
Preferably, silicon material cutter sweep also comprises actinobacillus wheel drive unit and take-up pulley drive unit, and actinobacillus wheel drive unit drives and is connected with actinobacillus wheel 41, and take-up pulley drive unit drives and is connected with take-up pulley 42.So arrange, just can realize the rotation of actinobacillus wheel 41 and take-up pulley 42.
Preferably, silicon material cutter sweep also comprises for controlling the control system of silicon material drive unit 10 and line of cut 20.Preferably, described control system can also be controlled the motion of tension-adjusting gear 60.Like this, control system just can be controlled the carrying out of whole cutting process.Preferably, silicon material cutter sweep also comprises cooling device, and the line of cut 20 when this cooling device is used to cutting provides cooling fluid.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. a silicon material cutter sweep, is characterized in that, comprising:
Silicon material drive unit (10), for driving silicon material (80) rotation to be cut;
Line of cut (20), is arranged on a side of described silicon material (80), and at least a portion of described line of cut (20) extends axially and do line cutting movement along described silicon material (80).
2. silicon material cutter sweep according to claim 1, it is characterized in that, described silicon material cutter sweep also comprises that the first support pulley (31) and second supports pulley (32), and described at least a portion winding of described line of cut (20) is supported pulley (31) and described second described first and supported between pulley (32).
3. silicon material cutter sweep according to claim 2, is characterized in that, described first supports pulley (31) and described second supports the same side that pulley (32) is arranged on described silicon material drive unit (10).
4. silicon material cutter sweep according to claim 2, it is characterized in that, described silicon material cutter sweep also comprises actinobacillus wheel (41) and the take-up pulley (42) arranging rotationally, one end winding of described line of cut (20) is upper at described actinobacillus wheel (41), and the other end winding of described line of cut (20) is on described take-up pulley (42).
5. silicon material cutter sweep according to claim 4, is characterized in that, described silicon material cutter sweep also comprises:
Work box (50), described silicon material drive unit (10), described first supports pulley (31) and described the second support pulley (32) is arranged on the end face of described work box (50); Described actinobacillus wheel (41) and described take-up pulley (42) are arranged on the inside of described work box (50).
6. silicon material cutter sweep according to claim 4, is characterized in that, described silicon material cutter sweep also comprises:
Leading block (33), described leading block (33) is arranged between described actinobacillus wheel (41) and described take-up pulley (42).
7. silicon material cutter sweep according to claim 5, it is characterized in that, described silicon material cutter sweep also comprises tension-adjusting gear (60), and described tension-adjusting gear (60) comprises pinch roller (61) and for compression, is positioned at the swing arm (62) of the described line of cut (20) between described actinobacillus wheel (41) and described take-up pulley (42); Described pinch roller (61) is pivotably mounted in described swing arm (62).
8. silicon material cutter sweep according to claim 6, it is characterized in that, described silicon material drive unit (10) comprises the first clamping element (71) and the second clamping element (72), and described silicon material (80) is clamped between described the first clamping element (71) and described the second clamping element (72).
9. silicon material cutter sweep according to claim 4, it is characterized in that, described silicon material cutter sweep also comprises actinobacillus wheel drive unit and take-up pulley drive unit, described actinobacillus wheel drive unit drives and is connected with described actinobacillus wheel (41), and described take-up pulley drive unit drives and is connected with described take-up pulley (42).
10. silicon material cutter sweep according to claim 1, is characterized in that, described silicon material cutter sweep also comprises for controlling the control system of described silicon material drive unit (10) and described line of cut (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320680605.0U CN203510496U (en) | 2013-10-30 | 2013-10-30 | Silicon material cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320680605.0U CN203510496U (en) | 2013-10-30 | 2013-10-30 | Silicon material cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203510496U true CN203510496U (en) | 2014-04-02 |
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ID=50369478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320680605.0U Expired - Fee Related CN203510496U (en) | 2013-10-30 | 2013-10-30 | Silicon material cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203510496U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105216043A (en) * | 2015-10-08 | 2016-01-06 | 遵义市润丰源钢铁铸造有限公司 | For the driving mechanism of heating wire movement |
| CN108357003A (en) * | 2018-05-11 | 2018-08-03 | 青岛高测科技股份有限公司 | A kind of cutting head and the two line excavation machines comprising the head |
-
2013
- 2013-10-30 CN CN201320680605.0U patent/CN203510496U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105216043A (en) * | 2015-10-08 | 2016-01-06 | 遵义市润丰源钢铁铸造有限公司 | For the driving mechanism of heating wire movement |
| CN108357003A (en) * | 2018-05-11 | 2018-08-03 | 青岛高测科技股份有限公司 | A kind of cutting head and the two line excavation machines comprising the head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20151030 |
|
| EXPY | Termination of patent right or utility model |