CN203503643U - Power module free of bending of power terminals - Google Patents
Power module free of bending of power terminals Download PDFInfo
- Publication number
- CN203503643U CN203503643U CN201320525972.3U CN201320525972U CN203503643U CN 203503643 U CN203503643 U CN 203503643U CN 201320525972 U CN201320525972 U CN 201320525972U CN 203503643 U CN203503643 U CN 203503643U
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- power
- power terminal
- copper
- terminal
- terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
Provided is a power module free of the bending of power terminals. The power module comprises a copper-clad ceramic substrate, a copper heating panel and a module shell, the copper-clad ceramic substrate is welded on the copper heating panel, and the copper-clad ceramic substrate is provided with a power chip, power terminals, signal terminals and a peripheral circuit. The power module free of the bending of the power terminals is characterized in that one terminals of the power terminals and the signal terminals are welded on the copper-clad ceramic substrate, the other terminals of the power terminals and the signal terminals are used for electrical connection with an external system, the module shell is provided with openings arranged at the terminals of the power terminals and the signal terminals electrically connected with the external system, sides of the openings of the power terminals of the module shell are provided with drawer grooves, corresponding drawer type embedded blocks are also provided, and the thickness and the width of the drawer type embedded blocks both correspond to internal dimensions of the power terminals and cooperate with the dimensions of the drawer grooves. According to the power module free of the bending of the power terminals, the welding of the power terminals can be easily achieved, and the structure and the manufacturing technology of the power module of a semiconductor are simplified.
Description
Technical field
The utility model relates to a kind of semiconductor module of new encapsulating structure, is specifically related to a kind of power model of exempting from power terminal bending.
Background technology
The semiconductor packages that a kind of power model of exempting from power terminal bending is used in power electronic circuit, main application and power electronics electric power, power current conversion (as frequency converter), high frequency power source system, as UPS, heating system, typical power semiconductor is insulated gate bipolar transistor (IGBT), power metal field effect transistor (MOSFET), power fast recovery diode FWD.The encapsulation technology of power semiconductor is exactly by encapsulating, material, and design, technique, is packaged into module symmetrically a lot of power chips, and packaging technology is considered the current balance type of device, heat radiation and simplification technique etc.
Conventional power module is carried out bending after needing that after encapsulation completes power terminal is welded to DBC, makes installing hole alignment housings screw hole.
Summary of the invention
The object of this invention is to provide a kind of power model of exempting from power terminal bending, the starting point of this patent is exactly to consider work simplification by increasing the terminal current carrying capacity design of high power device simultaneously, completes power terminal and module housing design.
The technical scheme that completes foregoing invention task is, a kind of power model of exempting from power terminal bending comprises and covers copper ceramic substrate (or be called ceramic copper-clad plate, be called for short DBC), copper heating panel and module housing, described in cover copper ceramic substrate and be welded on copper heating panel; Cover copper ceramic substrate and be provided with power chip, power terminal, signal terminal and peripheral circuit, described power terminal and one end of signal terminal are welded on to be covered on copper ceramic substrate, and the other end of described power terminal and signal terminal is in order to be electrically connected with external system; Described module housing is provided with power terminal opening and signal terminal opening, and described power terminal and signal terminal are arranged at respectively in power terminal opening and signal terminal opening; Described power terminal is stamping forming Π shape copper coin.
In prioritization scheme of the present utility model, the structure of each power terminal adopts the stamping forming Π shape of copper coin symmetric design, and the top of this Π shape plate is as the one end in order to external system electrical connection; The bottom of two side plates of this Π shape all arranges pin, and pin is connected with power chip, by electric current, can improve terminal by the ability of electric current, reduces chip and the outside dead resistance causing that is connected, and can improve module by the heat-sinking capability of terminal simultaneously.
As further optimization of the present utility model, in a side of power terminal opening, offer drawer groove, in drawer groove, be provided with corresponding drawer type abaculus; The thickness of described drawer type abaculus and width be all corresponding to each power terminal size, and match with described drawer groove size.The anterior space embedding in Π shape power terminal of drawer type abaculus, agree with mutually with drawer groove at drawer type abaculus rear portion, forms enclosed package with module housing.
The utility model is at bonding power terminal and after being set with module housing; insert drawer type abaculus; each parts and circuit in not only can protection module shell; and drawer type abaculus can play a supporting role to one end of each power terminal and external system electrical connection, convenient in be connected electric with external system.
Further optimize, the first material of described power terminal and signal terminal is copper, and nickel plating is carried out on the surface of copper coin, silver-plated processing.
In other words, the utility model be by an electrode welding of semiconductor chip on ceramic copper-clad plate, DBC is welded on copper heating panel, other electrodes of chip are welded on DBC by copper tip, by shell, module packed and pass through after silica gel, will draw that each electrode of chip is exposed to be electrically connected with external system outside shell.Starting point of the present invention is by power terminal one-shot forming design and shell split-type design, power terminal adopts can increase overcurrent and heat-sinking capability, after shell is drawn in upper end simultaneously, avoid power terminal bending technique, by shell from the arbitrary design drawer boxlike abaculus that selects a side of long side, terminal directly inserts from a side after completing welding procedure, completes module package.
The utility model is considered work simplification by increasing the terminal current carrying capacity design of high power device simultaneously, completes power terminal and module housing design; Can be easy to realize a kind of power model power terminal welding of exempting from power terminal bending, simplified structure and manufacturing process.
Accompanying drawing explanation
Fig. 1 is mounted inside figure of the present utility model;
Fig. 2 is shell encapsulation of the present utility model and cover top portion design;
Fig. 3 is for inserting the structural representation of drawer type abaculus;
Fig. 4 is the module profile schematic diagram after having encapsulated;
Fig. 5 is mounted inside figure;
Fig. 6 is assembling schematic diagram;
Fig. 7 is a kind of power terminal structural representation
Fig. 8 is another kind of power terminal structural representation;
Fig. 9 is a kind of signal terminal structural representation;
Figure 10 is another kind of signal terminal structural representation.
Embodiment
See figures.1.and.2, a kind of power model 100 of exempting from power terminal bending, comprises and covers copper ceramic substrate 11, copper heating panel 5 and module housing 11, covers copper ceramic substrate 11 and is welded on copper heating panel 5; Cover copper ceramic substrate 11 and be provided with power chip 8, power terminal 1, signal terminal 3 and peripheral circuit, peripheral circuit comprises diode 7, connecting bridge 6 and resistance 12 etc.One end of two power terminals 1 and two signal terminals 3 is welded on to be covered on copper ceramic substrate (DBC) 11, and the other end of each power terminal 1 and signal terminal 3 is in order to be electrically connected with external system.Module housing 9 is provided with power terminal opening 4a and signal terminal opening 4b, in power terminal opening 4a and signal terminal opening 4b, is respectively equipped with power terminal 1 and signal terminal 3.Each power terminal 1 adopts the stamping forming Π shape of copper coin plate, and the top of Π shape power terminal 1 is as the one end in order to external system electrical connection.
As shown in Figure 5, the end of two side plates of Π shape shape power terminal 1 is equipped with pin 13, pin 13 is connected with power chip 8, be used for passing through electric current, can improve power terminal by the ability of electric current, reduce power chip 8 and the outside dead resistance causing that is connected, can improve module by the heat-sinking capability of terminal simultaneously.
As shown in FIG. 7 and 8, the top width of Π shape power terminal 1 is 19mm, and top 14 is 32.32mm to the height between pin 13, and the distance between the pin 13 of two side plates can be adjusted as required.
As shown in Figures 9 and 10, the top width of signal terminal 3 is 9mm, and top 15 is 31.09mm to the height between pin.
As shown in Fig. 3, Fig. 4 and Fig. 6, module housing 9 on, in a side of each power terminal opening 4, offer drawer groove 2, be provided with corresponding drawer type abaculus 10 simultaneously; The thickness of drawer type abaculus 10 and width be all corresponding to the inside dimension of each power terminal, and match with drawer groove 10 sizes.The anterior 10a of drawer type abaculus embeds the space in Π shape power terminal 1, and drawer type abaculus rear portion 10b agrees with mutually with drawer groove 2, forms enclosed package with module housing 9.Power terminal 1, signal terminal 3 with cover copper ceramic substrate 11 and weld and be set with module housing 9 after; drawer type abaculus 10 embeds the space in Π shape plate; each parts and circuit in like this not only can protection module shell 9; and drawer type abaculus 10 can play a supporting role to each power terminal 1 and the top of external system electrical connection, convenient in be connected electric with external system.
Claims (6)
1. exempt from a power model for power terminal bending, comprise and cover copper ceramic substrate, copper heating panel and module housing, described in cover copper ceramic substrate and be welded on copper heating panel; Cover copper ceramic substrate and be provided with power chip, power terminal, signal terminal and peripheral circuit, it is characterized in that, described power terminal and one end of signal terminal are welded on to be covered on copper ceramic substrate, and the other end of described power terminal and signal terminal is in order to be electrically connected with external system; Described module housing is provided with power terminal opening and signal terminal opening, and described power terminal and signal terminal are arranged at respectively in power terminal opening and signal terminal opening; Described power terminal is stamping forming Π shape copper coin.
2. power model of exempting from power terminal bending according to claim 1, is characterized in that, the bottom of two side plates of described Π shape copper coin all arranges pin, and pin is connected with power chip.
3. power model of exempting from power terminal bending according to claim 1, is characterized in that, in a side of power terminal opening, offers drawer groove, is provided with corresponding drawer type abaculus simultaneously; The anterior space embedding in Π shape copper coin of described drawer type abaculus, matches with drawer groove size in described drawer type abaculus rear portion.
4. power model of exempting from power terminal bending according to claim 1, is characterized in that, the first material of described power terminal and signal terminal is copper, and nickel plating is carried out on the surface of copper coin, silver-plated processing.
5. power model of exempting from power terminal bending according to claim 1, is characterized in that, the top width of described Π shape power terminal is 19mm, and top is 32.32mm to the height between pin.
6. according to the power model of exempting from power terminal bending one of claim 2 Suo Shu, it is characterized in that, the side at each power terminal opening in described module housing offers drawer groove, is in the following ways: from long side both sides, carry out perforate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320525972.3U CN203503643U (en) | 2013-08-27 | 2013-08-27 | Power module free of bending of power terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320525972.3U CN203503643U (en) | 2013-08-27 | 2013-08-27 | Power module free of bending of power terminals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203503643U true CN203503643U (en) | 2014-03-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320525972.3U Expired - Lifetime CN203503643U (en) | 2013-08-27 | 2013-08-27 | Power module free of bending of power terminals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203503643U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108233820A (en) * | 2016-12-16 | 2018-06-29 | 上海电驱动股份有限公司 | A kind of BSG electric machine controllers integrated electrical module |
| CN109994439A (en) * | 2019-05-06 | 2019-07-09 | 合肥中恒微半导体有限公司 | A kind of IGBT module and its packaging technology of high-temperature resistant degree circulation |
| CN110010579A (en) * | 2019-05-06 | 2019-07-12 | 合肥中恒微半导体有限公司 | A kind of signal terminal built-in power semiconductor module and its packaging technology |
| CN113078130A (en) * | 2021-03-10 | 2021-07-06 | 赛晶亚太半导体科技(浙江)有限公司 | Novel connection structure of power terminal of IGBT module |
| CN116314072A (en) * | 2023-03-27 | 2023-06-23 | 珠海市浩威达电子科技有限公司 | Package structure of rectifying module and manufacturing method thereof |
| CN116830247A (en) * | 2021-02-08 | 2023-09-29 | 日立能源瑞士股份公司 | Power semiconductor module, power semiconductor device and method for producing a power semiconductor device |
-
2013
- 2013-08-27 CN CN201320525972.3U patent/CN203503643U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108233820A (en) * | 2016-12-16 | 2018-06-29 | 上海电驱动股份有限公司 | A kind of BSG electric machine controllers integrated electrical module |
| CN108233820B (en) * | 2016-12-16 | 2024-06-11 | 上海电驱动股份有限公司 | Integrated electrical module for BSG motor controller |
| CN109994439A (en) * | 2019-05-06 | 2019-07-09 | 合肥中恒微半导体有限公司 | A kind of IGBT module and its packaging technology of high-temperature resistant degree circulation |
| CN110010579A (en) * | 2019-05-06 | 2019-07-12 | 合肥中恒微半导体有限公司 | A kind of signal terminal built-in power semiconductor module and its packaging technology |
| CN109994439B (en) * | 2019-05-06 | 2024-03-22 | 合肥中恒微半导体有限公司 | IGBT module with high temperature cycle resistance and packaging technology thereof |
| CN110010579B (en) * | 2019-05-06 | 2024-03-22 | 合肥中恒微半导体有限公司 | Signal terminal embedded power semiconductor module and packaging process thereof |
| CN116830247A (en) * | 2021-02-08 | 2023-09-29 | 日立能源瑞士股份公司 | Power semiconductor module, power semiconductor device and method for producing a power semiconductor device |
| CN113078130A (en) * | 2021-03-10 | 2021-07-06 | 赛晶亚太半导体科技(浙江)有限公司 | Novel connection structure of power terminal of IGBT module |
| CN113078130B (en) * | 2021-03-10 | 2023-11-10 | 赛晶亚太半导体科技(浙江)有限公司 | Novel connection structure of power terminal of IGBT module |
| CN116314072A (en) * | 2023-03-27 | 2023-06-23 | 珠海市浩威达电子科技有限公司 | Package structure of rectifying module and manufacturing method thereof |
| CN116314072B (en) * | 2023-03-27 | 2023-12-05 | 珠海市浩威达电子科技有限公司 | Package structure of rectifying module and manufacturing method thereof |
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Granted publication date: 20140326 |