CN203482494U - Any layer interconnectable HDI (high density interconnectable) board - Google Patents
Any layer interconnectable HDI (high density interconnectable) board Download PDFInfo
- Publication number
- CN203482494U CN203482494U CN201320550671.6U CN201320550671U CN203482494U CN 203482494 U CN203482494 U CN 203482494U CN 201320550671 U CN201320550671 U CN 201320550671U CN 203482494 U CN203482494 U CN 203482494U
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- China
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- lamina rara
- hole
- rara externa
- blind hole
- inner plating
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Abstract
The utility model provides an any layer interconnectable HDI (high density interconnectable) board, which comprises an inner board, wherein the inner board is provided with a plurality of buried holes, and the upper and lower sides of the inner board are provided with a plurality of outer boards which take the inner board as a symmetric board; each of the outer boards is provided with a plurality of tapered blind holes, the number of the tapered blind holes decreases progressively in the direction from the outer boards to the inner board, and the position and the number of the tapered blind holes in the outer board, which is contacted with the inner board are in one-to-one correspondence to that of the buried holes. As the any layer interconnectable HDI board provided by the utility model adopts the tapered blind holes and the tapered blind holes of each layer are enabled to be correspondingly combined through a layered overlaying mode, so that a problem that the hole depth and the hole diameter of the blind hole are high in vertical and horizontal comparison, thereby being convenient for drilling, improving the exchange capacity of a medical liquid in hole metallization, avoiding a copper-free circumstance in the hole, improving the quality of the circuit board, and reducing the rejection rate.
Description
Technical field
The utility model relates to printed wiring board, specific design be a kind of can random layer the high density HDI plate of interconnection.
Background technology
HDI wiring board also claims high density interconnect plate, is the higher circuit board of a kind of circuit distribution density that uses micro-blind buried via hole technology, its have can reduce multi-layer PCB board production cost, increase the advantages such as line density, reliability are high, good electrical property.
At present in PCB product design process; in order farthest to cater to the demand of terminal electronic product; conventionally can adopt comparatively complicated electrical connection design, wherein the most outstanding is exactly random layer interconnection, is specially between adjacent two-layer or multilayer line and carries out electric interconnection by blind hole.But the aperture of blind hole great majority are 0.15mm and 0.20mm in the HDI plate of this structure, for the PCB of random layer interconnection, there is following quality hidden danger in this kind of design:
1, the hole depth of blind hole and the aspect ratio in aperture are higher, and laser drill cannot realize, and the dark machine drilling of employing control easily drills the copper layer of bottom, hole, and need to repeatedly adjust control degree deeply, easily occur open circuit risk and the production cost that increases boring;
2, the hole depth of this kind of blind hole and the aspect ratio in aperture are higher, the exchange capacity extreme difference of liquid medicine during hole metallization, and hole content is prone to the situation without copper, causes wiring board scrappage high, affects cost control.
Utility model content
For this reason, the purpose of this utility model is to provide a kind of high density HDI plate that can random layer interconnection, with solve in current HDI plate because of the hole depth of blind hole and the aspect ratio in aperture higher, have that boring difficulty is large, open circuit risk is high and having no copper in the holes, the problem that wiring board scrappage is high.
The purpose of this utility model is achieved through the following technical solutions.
Can random layer the high density HDI plate of interconnection, comprising: inner plating, on described inner plating, be provided with some buried via holes, on the two sides up and down of described inner plating, be respectively arranged with and take some lamina rara externas that described inner plating is symmetrical plate; On described each lamina rara externa, be provided with a plurality of tapered blind hole, the quantity of described tapered blind hole is successively decreased to inner plating direction by lamina rara externa, and corresponding one by one with position and the quantity of described buried via hole with the upper conical blind hole of lamina rara externa of inner plating contact.
Preferably, the quantity of the upper conical blind hole of described adjacent lamina rara externa is successively successively decreased one by lamina rara externa to inner plating direction, and be positioned at the tapered blind hole of inner side on lamina rara externa has a tapered blind hole corresponding with it on the lamina rara externa of outside, described two tapered blind hole are big or small identical and be located along the same line.
Preferably, also include a through hole that runs through inner plating and described lamina rara externa.
Preferably, in described buried via hole, be filled with resin.
Preferably, described inner plating, lamina rara externa are the insulating medium layer that upper and lower surface has copper foil layer.
The utility model compared with prior art, beneficial effect is: the utility model provides can random layer the high density HDI plate of interconnection, on inner plating, offer buried via hole, on each lamina rara externa, correspondence offers tapered blind hole, and the quantity ecto-entad of tapered blind hole is successively successively decreased, and make buried via hole quantity on inner plating and be positioned at the upper conical blind hole of lamina rara externa of inner side, and be positioned at the quantity of the upper conical blind hole of outside lamina rara externa and position with corresponding one by one.Because the utility model has adopted tapered blind hole, and the mode superposeing by layering makes corresponding combination between every one deck tapered blind hole, effectively avoided the problem that the hole depth of blind hole and aperture aspect ratio are higher, facilitated boring, and the exchange capacity of liquid medicine while having improved hole metallization, avoid appearance in hole without the situation of copper, to improve the quality of wiring board, reduced scrappage.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the utility model high density HDI plate.
Identifier declaration in figure: inner plating 10, buried via hole 11, buried via hole 12, copper layer 13, copper layer 14, lamina rara externa 20, tapered blind hole 21, copper layer 22, lamina rara externa 30, tapered blind hole 31, copper layer 32, lamina rara externa 40, tapered blind hole 41, copper layer 42, lamina rara externa 50, tapered blind hole 51, copper layer 52, through hole 60.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model provide a kind of can random layer the high density HDI plate of interconnection, be mainly used in solving in current HDI plate because of the hole depth of blind hole and the aspect ratio in aperture higher, existence boring difficulty is large, open circuit risk is high and having no copper in the holes, the problem that wiring board scrappage is high.
The utility model comprises: inner plating and a plurality of lamina rara externas that are positioned at these upper and lower two sides of inner plating, and the lamina rara externa of described inner plating upper side and the lamina rara externa of downside be take inner plating as symmetrical plate symmetry, and the lamina rara externa quantity of the upper and lower two sides of inner plating is identical, in the same size.
Between inner plating and lamina rara externa, and all laminated together by prepreg between lamina rara externa and lamina rara externa, and on the upper and lower surface of inner plating and each lamina rara externa, be provided with copper layer, on inner plating, be provided with buried via hole, on each lamina rara externa, be provided with tapered blind hole, the quantity of described tapered blind hole is successively successively decreased to inner plating direction by lamina rara externa, and corresponding one by one with position and the quantity of described buried via hole with the upper conical blind hole of lamina rara externa of inner plating contact, guarantee after lamination simultaneously buried via hole on inner plating corresponding with lamina rara externa on tapered blind hole on same straight line, and correspondence is filled with resin in buried via hole.
Tapered blind hole and buried via hole have all carried out hole metallization processing, so that inwall corresponding formation in hole is communicated with bilevel copper layer, realize the connection between copper layer on different layers.
In the utility model embodiment, take six laminates as example describes, refer to shown in Fig. 1, Fig. 1 is the cross-sectional view of the utility model high density HDI plate.
Wherein on the utility model HDI plate, be provided with a through hole 60 that runs through whole plate, on the utility model inner plating 10, be provided with buried via hole 11 and buried via hole 12, in described buried via hole 11 and buried via hole 12, be all filled with resin, on the upper side of inner plating 10, be provided with copper layer 13, on downside, be provided with copper layer 14, by the copper layer of buried via hole 11 and buried via hole 12 hole inwalls, can realize being connected between copper layer 13 and copper layer 14.
Wherein inner plating described herein, lamina rara externa are the insulating medium layer that upper and lower surface has copper foil layer.
On the upper side of inner plating 10, correspondence is bonded with lamina rara externa 20, and on lamina rara externa 20, be provided with two tapered blind hole 21, one of them tapered blind hole 21 correspondence be positioned at buried via hole 11 directly over, the two is on same straight line, on lamina rara externa 20 upper sides, be provided with copper layer 22, by the copper layer of tapered blind hole 21 hole inwalls, can realize being connected between copper layer 22 and copper layer 13.
Lamina rara externa 20 top correspondences are also bonded with lamina rara externa 30, on described lamina rara externa 30, be provided with three tapered blind hole 31, and wherein two tapered blind hole 31 correspondences be positioned at tapered blind hole 21 directly over, and respectively on same straight line, in lamina rara externa 30 upper side correspondences, be provided with copper layer 32, by the copper layer of tapered blind hole 31 hole inwalls, can realize being connected between copper layer 32 and copper layer 22.
Known by above-mentioned explanation, between the present embodiment China and foreign countries laminate 30 and lamina rara externa 20, by three tapered blind hole 31, realize being connected of copper layer 32 and copper layer 22, between lamina rara externa 20 and inner plating 10, by two tapered blind hole 21, realize being connected of copper layer 22 and copper layer 13, the copper layer 13 of the upper and lower surface of inner plating 10, copper layer 14 are connected with buried via hole 12 by buried via hole 11.
On the downside of inner plating 10, correspondence is bonded with lamina rara externa 40, and on lamina rara externa 40, be provided with two tapered blind hole 41, one of them tapered blind hole 41 correspondence be positioned at buried via hole 12 directly over, the two is on same straight line, on the downside of lamina rara externa 40, be provided with copper layer 42, by the copper layer of tapered blind hole 41 hole inwalls, can realize being connected between copper layer 42 and copper layer 14.
Lamina rara externa 40 top correspondences are also bonded with lamina rara externa 50, on described lamina rara externa 50, be provided with three tapered blind hole 51, and wherein two tapered blind hole 51 correspondences be positioned at tapered blind hole 41 under, and respectively on same straight line, downside correspondence at lamina rara externa 50 is provided with copper layer 52, by the copper layer of tapered blind hole 51 hole inwalls, can realize being connected between copper layer 52 and copper layer 42.
Known by above-mentioned explanation, between the present embodiment China and foreign countries laminate 50 and lamina rara externa 40, by three tapered blind hole 51, realize being connected of copper layer 52 and copper layer 42, between lamina rara externa 40 and inner plating 10, by two tapered blind hole 41, realize being connected of copper layer 42 and copper layer 14, the copper layer 13 of the upper and lower surface of inner plating 10, copper layer 14 are connected with buried via hole 12 by buried via hole 11.
More than describing is only the explanation to six laminates in the present embodiment, and it is all applicable for the HDI plate that surpasses six layers.
In sum, in the present embodiment, by the tapered blind hole on lamina rara externa and the buried via hole on inner plating, effectively realized random layer interconnection before, the tapered blind hole that the utility model all adopts when making on every laminate, effectively avoid the situation of high aspect ratio, and by increasing the repeatedly production method of buried via hole and blind hole stack of layer, guarantee the reliability of random layer electric interconnection, reduced difficulty and the scrappage of production, guaranteed product quality.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. can random layer the high density HDI plate of interconnection, it is characterized in that, comprising: inner plating, on described inner plating, be provided with some buried via holes, on the two sides up and down of described inner plating, be respectively arranged with and take some lamina rara externas that described inner plating is symmetrical plate; On described each lamina rara externa, be provided with a plurality of tapered blind hole, the quantity of described tapered blind hole is successively decreased to inner plating direction by lamina rara externa, and corresponding one by one with position and the quantity of described buried via hole with the upper conical blind hole of lamina rara externa of inner plating contact.
According to claim 1 can random layer the high density HDI plate of interconnection, it is characterized in that, the quantity of the upper conical blind hole of described adjacent lamina rara externa is successively successively decreased one by lamina rara externa to inner plating direction, and be positioned at the tapered blind hole of inner side on lamina rara externa has a tapered blind hole corresponding with it on the lamina rara externa of outside, described two tapered blind hole are big or small identical and be located along the same line.
According to claim 1 can random layer the high density HDI plate of interconnection, it is characterized in that, also include a through hole that runs through inner plating and described lamina rara externa.
According to claim 1 can random layer the high density HDI plate of interconnection, it is characterized in that, in described buried via hole, be filled with resin.
According to claim 1 can random layer the high density HDI plate of interconnection, it is characterized in that, described inner plating, lamina rara externa are the insulating medium layer that upper and lower surface has copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320550671.6U CN203482494U (en) | 2013-08-29 | 2013-08-29 | Any layer interconnectable HDI (high density interconnectable) board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320550671.6U CN203482494U (en) | 2013-08-29 | 2013-08-29 | Any layer interconnectable HDI (high density interconnectable) board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203482494U true CN203482494U (en) | 2014-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320550671.6U Expired - Fee Related CN203482494U (en) | 2013-08-29 | 2013-08-29 | Any layer interconnectable HDI (high density interconnectable) board |
Country Status (1)
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| CN (1) | CN203482494U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN108684160A (en) * | 2018-06-04 | 2018-10-19 | 珠海崇达电路技术有限公司 | A kind of multistage blind hole HDI board manufacturing methods |
| CN110300498A (en) * | 2019-06-26 | 2019-10-01 | Oppo广东移动通信有限公司 | A kind of multilayer circuit board laminated structure |
| CN110809376A (en) * | 2019-10-22 | 2020-02-18 | 胜宏科技（惠州）股份有限公司 | Process flow for replacing HDI plate back drill |
| US10834831B2 (en) | 2015-10-30 | 2020-11-10 | At&S (China) Co. Ltd. | Component carrier with alternatingly vertically stacked layer structures of different electric density |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
-
2013
- 2013-08-29 CN CN201320550671.6U patent/CN203482494U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378931A (en) * | 2014-11-21 | 2015-02-25 | 江门崇达电路技术有限公司 | Method for manufacturing metallized counterbore in PCB |
| CN104378931B (en) * | 2014-11-21 | 2017-11-28 | 江门崇达电路技术有限公司 | The preparation method of metallization counterbore in a kind of PCB |
| US10834831B2 (en) | 2015-10-30 | 2020-11-10 | At&S (China) Co. Ltd. | Component carrier with alternatingly vertically stacked layer structures of different electric density |
| CN108684160A (en) * | 2018-06-04 | 2018-10-19 | 珠海崇达电路技术有限公司 | A kind of multistage blind hole HDI board manufacturing methods |
| CN108684160B (en) * | 2018-06-04 | 2020-10-16 | 珠海崇达电路技术有限公司 | Manufacturing method of multi-step blind hole HDI plate |
| CN110300498A (en) * | 2019-06-26 | 2019-10-01 | Oppo广东移动通信有限公司 | A kind of multilayer circuit board laminated structure |
| CN110809376A (en) * | 2019-10-22 | 2020-02-18 | 胜宏科技（惠州）股份有限公司 | Process flow for replacing HDI plate back drill |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20140829 |
|
| EXPY | Termination of patent right or utility model |