CN102223755A - Plate with coppered edge - Google Patents
Plate with coppered edge Download PDFInfo
- Publication number
- CN102223755A CN102223755A CN2010101529349A CN201010152934A CN102223755A CN 102223755 A CN102223755 A CN 102223755A CN 2010101529349 A CN2010101529349 A CN 2010101529349A CN 201010152934 A CN201010152934 A CN 201010152934A CN 102223755 A CN102223755 A CN 102223755A
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- China
- Prior art keywords
- conductive pattern
- layer
- conducting metal
- edges
- pattern circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a plate with a coppered edge. The plate with the coppered edge comprises at least one layer of isolation substrate and at least two layers of conductive pattern circuits; conductive metal is plated on at least one side of the at least one layer of isolation substrate; and the conductive metal is electrically connected with the at least two layers of conductive pattern circuits; the plate with the coppered edge is electrically connected with each layer of conductive pattern circuit through the conductive metal plated on the edge so as to realize signal connection between conductive pattern circuits, effectively reduce the number of conduction holes, and greatly reduce production difficulty and production cost of a printed circuit board. As the electrically connecting area between the conductive metal plated at the edge and each layer of conductive pattern circuit is larger than the electrically connecting area between the conventional conductive holes and each layer of conductive pattern circuit, the plate with the coppered edge is more favorable for signal transmission.
Description
Technical field
The present invention relates to a kind of structural improvement of printed circuit board (PCB), specifically relate to each interlayer conduction structural improvement of a kind of bilayer and multilayer board.
Background technology
Printed circuit board (PCB) (PCB) can be divided into single sided board, double sided board and multi-layer sheet three classes by the wiring level: single sided board has a conductive pattern circuit, and double sided board has two sides conductive pattern circuit, and multi-layer sheet has conductive pattern circuit more than three layers or three layers.
Wherein, the connection of the signal between the two sides conductive pattern circuit of double sided board is to realize by metallized through hole; Signal between multiple-plate each layer conductive pattern circuit connects to be realized by metallized via, multiple-plate via is divided into through hole, blind hole and buried via hole, because it is long-pending that through hole relatively takies printed circuit board surface, so the quantity that increases blind hole and buried via hole reduces the quantity of through hole, thereby improve printed circuit board (PCB) density.
Through hole, the hole of promptly getting through is the via that is extended to another top layer conductive pattern circuit from a top layer conductive pattern circuit of printed circuit board (PCB).
Blind hole, the hole of promptly not getting through, blind hole one end is positioned at the printed circuit board (PCB) top layer, the other end passes to till the internal layer of printed circuit board (PCB), and blind hole is the via between a top layer conductive pattern circuit and one or more internal layer conductive pattern circuit.
Buried via hole promptly is embedded in the hole that printed circuit board (PCB) is interior, do not extend to printed circuit board surface, and buried via hole is the through hole between internal layer conductive pattern circuit, can't see after the pressing, so needn't take the PCB surface area, the signal that buried via hole is used between internal layer conductive pattern circuit connects.
Unaffected for the transmission that guarantees signal, and reduce the delay of impedance and signal, must a lot of through hole, blind hole and the buried via holes of design.But through hole, blind hole and buried via hole all have some shortcomings separately: through hole relatively takies the surface area of printed circuit board (PCB), blind hole particularly the cost of manufacture of buried via hole than higher and complex procedures.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of edges of boards copper facing plate, this edges of boards copper facing plate can effectively reduce the quantity of via under the prerequisite that is beneficial to the signal transmission, and then it is greatly reduce the manufacture difficulty and the cost of printed circuit board (PCB), and simple in structure, easy to implement.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of edges of boards copper facing plate comprises one deck insulated substrate and two-layer at least conductive pattern circuit at least, and at least one side in one deck insulated substrate side is coated with conducting metal at least, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
Further technical scheme of the present invention is:
At least all full conducting metal of plating, described conducting metal and electric connections of two-layer at least conductive pattern circuit of at least one side in one deck insulated substrate side.
At least one side in the described edges of boards copper facing plate side is the full conducting metal of plating all, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
At least at least one side part in one deck insulated substrate side is coated with conducting metal, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
At least one side part in the described edges of boards copper facing plate side is coated with conducting metal, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
Symmetry offers arc-shaped notch on four angles of described edges of boards copper facing plate, the full conducting metal of described arc-shaped notch surface plating, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
Described conducting metal is a copper.
The invention has the beneficial effects as follows: the conducting metal that edges of boards copper facing plate of the present invention is coated with by edges of boards electrically connects each layer conductive pattern circuit, thereby realize that the signal between each layer conductive pattern circuit connects, effectively reduce the quantity of via, made the manufacture difficulty of printed circuit board (PCB) and cost of manufacture reduce greatly; Again since the conducting metal that is coated with of these edges of boards and the electric connection area between each layer conductive pattern circuit greater than the electric connection area between traditional via and each layer conductive pattern circuit, transmit so this edges of boards copper facing plate more helps signal.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Embodiment: a kind of edges of boards copper facing plate, comprise one deck insulated substrate 1 and two-layer at least conductive pattern circuit 2 at least, at least one side in the described edges of boards copper facing plate side is the full copper 3 of plating all, and described copper electrically connects with two-layer at least conductive pattern circuit.
When this edges of boards copper facing plate is that symmetry offers arc-shaped notch and by these four arc-shaped notch during with printed circuit board (PCB) that the element that is complementary engages on four angles, the full conducting metal of described arc-shaped notch surface plating, described conducting metal electrically connects with two-layer at least conductive pattern circuit, arc-shaped notch has not only played the effect of interlayer conduction like this, can also electrically connect with the element that fastens.
Claims (7)
1. edges of boards copper facing plate, comprise one deck insulated substrate and two-layer at least conductive pattern circuit at least, it is characterized in that: at least one side in one deck insulated substrate side is coated with conducting metal at least, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
2. edges of boards copper facing plate according to claim 1 is characterized in that: all full conducting metal of plating, described conducting metal and electric connections of two-layer at least conductive pattern circuit of at least one side in one deck insulated substrate side at least.
3. edges of boards copper facing plate according to claim 2 is characterized in that: at least one side in the described edges of boards copper facing plate side is the full conducting metal of plating all, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
4. edges of boards copper facing plate according to claim 1 is characterized in that: at least one side part in one deck insulated substrate side is coated with conducting metal at least, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
5. edges of boards copper facing plate according to claim 4 is characterized in that: at least one side part in the described edges of boards copper facing plate side is coated with conducting metal, and described conducting metal electrically connects with two-layer at least conductive pattern circuit.
6. edges of boards copper facing plate according to claim 1, it is characterized in that: symmetry offers arc-shaped notch on four angles of described edges of boards copper facing plate, the full conducting metal of described arc-shaped notch surface plating, described conducting metal electrically connects with two-layer at least conductive pattern circuit.
7. according to the described edges of boards copper facing of one of claim 1 to 6 plate, it is characterized in that: described conducting metal is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101529349A CN102223755A (en) | 2010-04-13 | 2010-04-13 | Plate with coppered edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101529349A CN102223755A (en) | 2010-04-13 | 2010-04-13 | Plate with coppered edge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102223755A true CN102223755A (en) | 2011-10-19 |
Family
ID=44780141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101529349A Pending CN102223755A (en) | 2010-04-13 | 2010-04-13 | Plate with coppered edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102223755A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
| CN104135829A (en) * | 2013-04-30 | 2014-11-05 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN105682344A (en) * | 2016-02-29 | 2016-06-15 | 上海摩软通讯技术有限公司 | Printed circuit board (PCB) and arrangement method of same |
-
2010
- 2010-04-13 CN CN2010101529349A patent/CN102223755A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
| CN103068165B (en) * | 2012-12-20 | 2015-05-13 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
| CN104135829A (en) * | 2013-04-30 | 2014-11-05 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN104135829B (en) * | 2013-04-30 | 2017-11-28 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN105682344A (en) * | 2016-02-29 | 2016-06-15 | 上海摩软通讯技术有限公司 | Printed circuit board (PCB) and arrangement method of same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111019 |