CN203456421U - Bonding head apparatus applied to full-automatic lead bonding device - Google Patents
Bonding head apparatus applied to full-automatic lead bonding device Download PDFInfo
- Publication number
- CN203456421U CN203456421U CN201320094235.2U CN201320094235U CN203456421U CN 203456421 U CN203456421 U CN 203456421U CN 201320094235 U CN201320094235 U CN 201320094235U CN 203456421 U CN203456421 U CN 203456421U
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- bonding
- assembly
- wire clamp
- sparking
- electromagnetic damping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model relates to a bonding head apparatus applied to a full-automatic lead bonding device. The bonding head apparatus comprises a bonding head pedestal, a bonding assembly for completing a bonding function, an electromagnetic damping assembly for increasing or controlling damping of a bonding body to reduce vibration during bonding, a sparking assembly for completing lead ball burning, and a wire clamp assembly for clamping and wire feeding of the lead. The bonding assembly is installed at the bottom of the bonding head pedestal. The electromagnetic damping assembly includes an electromagnetic damping plate and an electromagnet; the electromagnetic damping plate in the electromagnetic damping assembly is installed at the bonding assembly; and the electromagnet in the electromagnetic damping assembly is fixed at the bonding head pedestal. The sparking assembly is installed at one side of the bonding head pedestal; and the wire clamp assembly that moves with the bonding assembly is installed at the bonding assembly. When the bonding assembly stops at a bonding position, the electromagnetic damping assembly is controlled to generate a proper damping force to inhabit vibration of an ultrasonic transducer and the bonding assembly due to quick stopping, so that the lead bonding quality and the speed are improved.
Description
Technical field
The utility model is a kind of for the bonding joint device on full-automatic lead bonding equipment, belongs to the renovation technique for the bonding joint device on full-automatic lead bonding equipment.
Background technology
Wire bonder is the special equipment of IC components and parts and LED lamp encapsulation process chips and lead frame internal electric interconnection process, is the key equipment of microelectronics Packaging industry.Along with the fast development of microelectronics and LED industry, the package quality of components and parts becomes more and more important with encapsulation speed of production, more and more higher to the requirement of the running precision of wire bonder and speed.
Bonding head is the core component of full-automatic lead bonding machine, and para-linkage quality and bonding speed play vital effect.Yet along with the raising of the bonding head speed of service, the bonding tool vibration problem impact that stops and bring of suddenly getting impatient is huge, affects bonding speed and quality.
A kind of Lightweight high-rigidity XY worktable and bonding head is disclosed in Chinese Patent Application No. 200510200633.8, the device of a kind of supersonic bonding head and employing supersonic bonding head is disclosed in Chinese Patent Application No. 200610058852.1, a kind of lightweight bondhead assembly is disclosed in Chinese Patent Application No. 200610140824.4, a kind of bonding joint device is disclosed in Chinese Patent Application No. 200620201098.8, a kind of rotating lead bonding joint device is disclosed in Chinese Patent Application No. 200910245181.3, a kind of bonding joint device is disclosed in Chinese Patent Application No. 201010243239.3, in Chinese Patent Application No. 201010243441.4, a kind of bonding joint device etc. is disclosed, in these patent application documents, all do not mention the anxious stopping time of getting impatient of bonding head that how to solve high-speed motion and how to reduce vibration.
Summary of the invention
The purpose of this utility model be to consider the problems referred to above and provide a kind of quality that improves Bonding and speed for the bonding joint device on full-automatic lead bonding equipment.The utility model is reasonable in design, convenient and practical.
The technical solution of the utility model is: of the present utility model for the bonding joint device on full-automatic lead bonding equipment, include for the bonding head pedestal of each assembly is installed, the bonding assembly that has been used for key function, for increasing or the electromagnetic damping assembly of the damping of the operating key zoarium vibration when reducing bonding, be used for the sparking assembly that lead-in wire burns ball, for the clamping that goes between and the wire clamp assembly of line sending function, wherein bonding assembly is installed in the bottom of bonding head pedestal, electromagnetic damping assembly includes electromagnetic damping plate and electromagnet, electromagnetic damping plate in electromagnetic damping assembly is installed on bonding assembly, electromagnet in electromagnetic damping assembly is fixed on bonding head pedestal, sparking assembly is installed in a side of bonding head pedestal, the wire clamp assembly moving with bonding assembly is installed on bonding assembly.
Above-mentioned bonding assembly includes ultrasonic transducer, bonding tool, ultrasonic transducer holder, voice coil motor moving-coil, voice coil motor stator, flexible shell fragment, bonding assembly installed part and grating scale, and wherein bonding assembly is connected with bonding head pedestal by bonding assembly installed part; The flexible shell fragment of the mounted in pairing mode that meets at right angles is connected with ultrasonic transducer holder with bonding assembly installed part respectively, and forms rotation θ; Bonding tool is arranged on ultrasonic transducer, ultrasonic transducer is installed on ultrasonic transducer holder, voice coil motor moving-coil is arranged between two groups of voice coil motor stators, voice coil motor moving-coil moves between two groups of voice coil motor stators, voice coil motor stator is fixed on bonding head pedestal, the bonding tool of drive installation on ultrasonic transducer moves up and down and the voice coil motor moving-coil of Z-direction displacement is connected on ultrasonic transducer holder, and drives bonding assembly to rotate around rotation θ.
The bonding tool of above-mentioned execution Bonding task is arranged on the end of ultrasonic transducer.
The distance of the motion that moves up and down and rotate of above-mentioned bonding tool and corner are obtained by the measurement of grating scale assembly.
Electromagnet in above-mentioned electromagnetic damping assembly includes electromagnetic damping coil, electromagnetic core, wherein electromagnetic damping coil winding forms an electromagnet on electromagnetic core, the electromagnetic damping plate of following the motion of bonding assembly is arranged on bonding assembly, and the electromagnet that electromagnetic damping coil winding forms on electromagnetic core is fixed on bonding head pedestal.
Above-mentioned electromagnet is electrically connected to magnet driver, and electromagnet is controlled by magnet driver.
Above-mentioned sparking assembly includes sparking bar, sparking bar regulates rotating shaft, sparking assembly installed part, sparking line, the sparking line that wherein plays making current effect is connected with sparking bar, the sparking bar that sparking bar is clamped to the apical position that can regulate sparking bar regulates in rotating shaft, sparking bar regulating rotary axle is clamped on sparking assembly installed part, and sparking assembly installed part is connected with bonding head pedestal.
Above-mentioned wire clamp assembly includes wire clamp fixed arm, wire clamp turning arm, wire clamp solenoid, lead-in wire pilot hole, jewel sheet, wire clamp shell fragment, wherein wire clamp turning arm is connected with wire clamp turning arm by afterbody wire clamp shell fragment, wire clamp solenoid and lead-in wire pilot hole are installed on wire clamp fixed arm, and two jewel sheets are installed in respectively on wire clamp fixed arm and wire clamp turning arm; Above-mentioned wire clamp assembly is connected with bonding assembly by wire clamp fixed arm, moves together with bonding assembly.
On the wire clamp turning arm of above-mentioned wire clamp assembly, be also provided with the wire clamp regulating spring that can regulate the clamping force between wire clamp fixed arm and wire clamp turning arm.
The utility model is because employing includes the structure of bonding head pedestal, bonding assembly, electromagnetic damping assembly, sparking assembly, wire clamp assembly, and bondhead assembly is mainly driven by voice coil motor, thereby drives ultrasonic transducer and bonding tool to move up and down.The distance of motion obtains from grating ruler reading head feedback.During bonding, the accurate control of bonding force is controlled by voice coil motor drive current; When bonding tool is parked in bonding position, control electromagnetic damper, produce suitable damping force, suppress ultrasonic transducer and bonding tool due to the vibration that stops fast causing, improve quality and the speed of Bonding.The utility model is that a kind of design is ingenious, and function admirable is convenient and practical for the bonding joint device on full-automatic lead bonding equipment.
Accompanying drawing explanation
Fig. 1 is that the overall structure assembly installation of the utility model embodiment is related to schematic diagram;
Fig. 2 is the included bonding modular construction schematic diagram of the lead bonding joint device of the utility model embodiment;
Fig. 3 is the included electromagnetic damping assembly schematic diagram of the lead bonding joint device of the utility model embodiment;
Fig. 4 is the included sparking modular construction schematic diagram of the lead bonding joint device of the utility model embodiment;
Fig. 5 is the included wire clamp modular construction schematic diagram of the lead bonding joint device of the utility model embodiment;
Fig. 6 is the overall structure schematic diagram of the utility model embodiment.
Wherein, 101-ultrasonic transducer, 102-bonding tool, 103-transducer holder, 104-voice coil motor moving-coil, 105 voice coil motor stators, the flexible shell fragment of 106-, 107-bonding assembly installed part, 108-grating reading head, θ-bonding head rotation, 201-electromagnetic damping plate, 202-electromagnetic damping coil, 203-electromagnetic core, 204-magnet driver, the 301-bar of striking sparks, 302-sparking bar regulates rotating shaft, 303-sparking assembly installed part, the 304-line of striking sparks, 401-wire clamp fixed arm, 402 wire clamp turning arms, 403-wire clamp solenoid, 404-wire clamp regulating spring, the 405-pilot hole that goes between, 406-jewel sheet, 407-wire clamp shell fragment, 5-bonding head pedestal.
Embodiment
Embodiment:
Structural representation of the present utility model is as Fig. 1, 2, 3, 4, 5, shown in 6, of the present utility model for the bonding joint device on full-automatic lead bonding equipment, include for the bonding head pedestal 5 of each assembly is installed, the bonding assembly 1 that has been used for key function, for increasing or the electromagnetic damping assembly 2 of the damping of the operating key zoarium vibration when reducing bonding, be used for the sparking assembly 3 that lead-in wire burns ball, for the clamping that goes between and the wire clamp assembly 4 of line sending function, wherein bonding assembly 1 is installed in the bottom of bonding head pedestal 5, electromagnetic damping assembly 2 includes electromagnetic damping plate 201 and electromagnet, damping sheet 201 in electromagnetic damping assembly 2 is installed on bonding assembly 1, its electromagnet is fixed on bonding head pedestal 5, sparking assembly 3 is installed in a side of bonding head pedestal 5, wire clamp assembly 4 is installed on bonding assembly 3, with 1 motion of bonding assembly, above-mentioned bonding head pedestal 5, be mainly used in installing the fundamental parts of each assembly, and be connected with XY worktable (not shown), with this, complete the displacement of the XY direction of bonding tool.
Above-mentioned bonding assembly 1 includes ultrasonic transducer 101, bonding tool 102, ultrasonic transducer holder 103, voice coil motor moving-coil 104, two groups of voice coil motor stators 105, flexible shell fragment 106, bonding assembly installed part 107 and grating scales, and wherein bonding assembly 2 is connected with bonding head pedestal 5 by bonding assembly installed part 107, charge-coupled installed part of flexible shell fragment 106 connecting keys 107 and the ultrasonic transducer holder 103 of the mounted in pairing mode that meets at right angles, and form rotation θ, as shown in Figure 2, rotation θ is vertical with the geometrical axis of ultrasonic transducer holder 103, parallel with bonding assembly installed part 107, bonding tool 102 is arranged on ultrasonic transducer 101, ultrasonic transducer 101 is installed on ultrasonic transducer holder 103, voice coil motor moving-coil 104 is arranged between two groups of voice coil motor stators 105, voice coil motor moving-coil 104 moves between two groups of voice coil motor stators 105, voice coil motor stator 105 is fixed on bonding head pedestal 5, voice coil motor moving-coil 104 is connected on ultrasonic transducer holder 103, the bonding tool 102 of drive installation on ultrasonic transducer 101 moves up and down and Z-direction displacement, and drive bonding assembly 2 to rotate around rotation θ.The drive current that during bonding, the size of bonding force can be controlled voice coil motor is accurately controlled.Bonding tool 102 moves up and down and required XYZ tri-bit spaces of the synthetic whole Bonding of set of displacements of Z-direction displacement and XY platform move.Above-mentioned ultrasonic transducer 101 produces ultrasonic vibration by ultrasonic generator (not shown), drives bonding tool 102 to complete Bonding.The size of bonding force is controlled by voice coil motor.
The bonding tool 102 of above-mentioned execution Bonding task is arranged on the end of ultrasonic transducer 101.
The distance of the motion that moves up and down and rotate of above-mentioned bonding tool 102 and corner are obtained by the measurement of grating scale assembly.
Electromagnet in above-mentioned electromagnetic damping assembly 2 includes electromagnetic damping coil 202, electromagnetic core 203, in electromagnetic damping assembly 2, also include magnet driver 204, electromagnetic damping coil 202 is wrapped on electromagnetic core 203 and forms electromagnet, electromagnet is fixed on bonding head pedestal 5, electromagnet is controlled by magnet driver 204, electromagnetic damping plate 201 in magnetic damping assembly 2 is arranged on bonding assembly 1, follow bonding assembly) motion, while moving by damping sheet, produce resistance, reach the effect that reduces the vibration of bonding assembly.Magnet driver 204 drives electromagnetic damping coil 202, in electromagnetic core 203 generation magnetic fields, two ends, and when electromagnetic damping plate 201 moves or vibrates along with bondhead assembly, cutting magnetic line, thus on electromagnetic damping plate 201, produce the damping force of retardation motion.Can control drive current size and the break-make of electromagnetic driver 204, when bonding head stops fast, produce suitable damping force, bonding head is stopped fast, and effectively suppress vibration, improve quality and the speed of bonding.
Above-mentioned sparking assembly 3 includes sparking bar 301, sparking bar regulates rotating shaft 302, sparking assembly installed part 303, sparking line 304, the line 304 of wherein striking sparks connects sparking bar 301, play making current effect, sparking bar 301 is regulated rotating shaft 302 to grip by sparking bar, sparking bar regulates rotating shaft 302 to be gripped by sparking assembly installed part 303, and sparking assembly installed part 303 is connected with bonding head pedestal 5; By the adjusting bar of striking sparks, regulate rotating shaft 302 to regulate the most advanced and sophisticated left and right of sparking bar (301), upper and lower position, the function of burning ball to adapt to sparking.
By rotation or X-direction, move sparking bar and regulate rotating shaft 302 can regulate the position of sparking boom end Z and X-direction in space, move forward and backward sparking bar 301 can regulate sparking boom end space Y to position.High-tension current is delivered to sparking bar 301 tips by sparking line 304, completes the electric discharge of lead-in wire tailfiber end is burnt to ball function.
Above-mentioned wire clamp assembly 4 includes wire clamp fixed arm 401, wire clamp turning arm 402, wire clamp solenoid 403, lead-in wire pilot hole 405, jewel sheet 406, wire clamp shell fragment 407, wherein wire clamp turning arm 402 is connected with wire clamp fixed arm by afterbody wire clamp shell fragment 407, wire clamp solenoid 403 and lead-in wire pilot hole 405 are installed on wire clamp fixed arm 401, wire clamp regulating spring 404 is installed on wire clamp turning arm 401, and two jewel sheets 406 are installed in respectively on wire clamp fixed arm 401 and wire clamp turning arm 401; Above-mentioned wire clamp assembly is connected with bonding assembly by wire clamp fixed arm 401, moves together with bonding assembly.
Above-mentioned wire clamp assembly is connected with bonding assembly by wire clamp fixed arm 401, in bonding process, moves together with bonding assembly.Lead-in wire (not shown), through lead-in wire pilot hole 405, by the centre of two jewel sheets 406, arrives bonding tool 102.Wire clamp turning arm 402, under the solenoidal driving of wire clamp, opens or closed jewel sheet 406 as required in time, completes the clamping of lead-in wire or unclamps.In the present embodiment, on the wire clamp turning arm 401 of above-mentioned wire clamp assembly 4, be also provided with the wire clamp regulating spring 404 that can regulate the clamping force between wire clamp fixed arm 401 and wire clamp turning arm 402.The control of lead-in wire clamping force size is realized by adjusting wire clamp regulating spring 404.
The method of the utility model operating key syncephalon vibration, in welding process, need the stable moment of bonding tool, as bonding or go between into arc constantly, the size of controlling electromagnet coil current is carried out the damping size of charge-coupled motion of operating key or vibration, thereby realize, suppresses fast vibration.
Operation principle of the present utility model is as follows: bonding assembly 1 rests on sparking position, and now wire clamp is closed; Tailfiber (a bit of lead-in wire-gold thread exposing, silver-colored line or the alloy wire) electric discharge that sparking bar 301 para-linkage instruments (as chopper) reserve, causes tailfiber and burns till spherical; Wire clamp is opened, and bonding assembly 1 is descending fast under the driving of the voice coil motor being comprised of voice coil motor moving-coil 104 and voice coil motor stator 105; When encountering pad (as the pad on IC), bonding assembly 1 stops; Now electromagnetic damping assembly 2 works, and suppresses the vibration producing when bonding assembly 1 stops at a high speed; Then the ultra-sonic welded (ultrasonic driven by ultrasonic transducer) of the first solder joint goes between; After being soldered, bonding head gets up, and spatially guiding lead-in wire carries out arcing, stops to the second solder joint (being positioned on IC or LED support); Electromagnetic damping assembly 2 suppresses 1 vibration of bonding assembly, welds the second solder joint, and after completing, bonding assembly goes upward to the tailfiber that reserves appropriate length, and wire clamp is closed, pulls apart lead-in wire; Then get back to sparking position, carry out next circulation.
Claims (9)
1. one kind for the bonding joint device on full-automatic lead bonding equipment, be characterised in that and include for the bonding head pedestal (5) of each assembly is installed, the bonding assembly (1) that has been used for key function, for increasing or the electromagnetic damping assembly (2) of the damping of the operating key zoarium vibration when reducing bonding, be used for the sparking assembly (3) that lead-in wire burns ball, for the clamping that goes between and the wire clamp assembly (4) of line sending function, wherein bonding assembly (1) is installed in the bottom of bonding head pedestal (5), electromagnetic damping assembly (2) includes electromagnetic damping plate (201) and electromagnet, electromagnetic damping plate (201) in electromagnetic damping assembly (2) is installed on bonding assembly (1), electromagnet in electromagnetic damping assembly (2) is fixed on bonding head pedestal (5), sparking assembly (3) is installed in a side of bonding head pedestal (5), wire clamp assembly (4) with bonding assembly (1) motion is installed on bonding assembly (1).
2. according to claim 1 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that above-mentioned bonding assembly (1) includes ultrasonic transducer (101), bonding tool (102), ultrasonic transducer holder (103), voice coil motor moving-coil (104), voice coil motor stator (105), flexible shell fragment (106), bonding assembly installed part (107) and grating scale, wherein bonding assembly (2) is connected with bonding head pedestal (5) by bonding assembly installed part (107), the flexible shell fragment (106) of the mounted in pairing mode that meets at right angles is connected with ultrasonic transducer holder (103) with bonding assembly installed part (107) respectively, and forms rotation θ, bonding tool (102) is arranged on ultrasonic transducer (101), ultrasonic transducer (101) is installed on ultrasonic transducer holder (103), voice coil motor moving-coil (104) is arranged between two groups of voice coil motor stators (105), voice coil motor moving-coil (104) moves between two groups of voice coil motor stators (105), voice coil motor stator (105) is fixed on bonding head pedestal (5), the bonding tool (102) of drive installation on ultrasonic transducer (101) moves up and down and the voice coil motor moving-coil (104) of Z-direction displacement is connected on ultrasonic transducer holder (103), and drive bonding assembly (2) to rotate around rotation θ.
3. according to claim 2 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that the bonding tool (102) of above-mentioned execution Bonding task is arranged on the end of ultrasonic transducer (101).
4. according to claim 2 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that distance and the corner of the motion that moves up and down and rotate of above-mentioned bonding tool (102) obtained by the measurement of grating scale assembly.
5. according to claim 1 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that the electromagnet in above-mentioned electromagnetic damping assembly (2) includes electromagnetic damping coil (202), electromagnetic core (203), wherein electromagnetic damping coil (202) is wrapped in an electromagnet of the upper formation of electromagnetic core (203), the electromagnetic damping plate (201) of following bonding assembly (1) motion is arranged on bonding assembly (1) above, and electromagnetic damping coil (202) is wrapped in the upper electromagnet forming of electromagnetic core (203) and is fixed on bonding head pedestal (5).
6. according to claim 5 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that above-mentioned electromagnet is electrically connected to magnet driver (204), electromagnet is controlled by magnet driver (204).
7. according to claim 1 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that above-mentioned sparking assembly (3) includes sparking bar (301), sparking bar regulates rotating shaft (302), sparking assembly installed part (303), sparking line (304), the sparking line (304) that wherein plays making current effect is connected with sparking bar (301), the sparking bar that sparking bar (301) is clamped to the apical position that can regulate sparking bar (301) regulates in rotating shaft (302), sparking bar regulates rotating shaft (302) to be clamped on sparking assembly installed part (303), sparking assembly installed part (303) is connected with bonding head pedestal (5).
8. according to claim 1 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that above-mentioned wire clamp assembly (4) includes wire clamp fixed arm (401), wire clamp turning arm (402), wire clamp solenoid (403), lead-in wire pilot hole (405), jewel sheet (406), wire clamp shell fragment (407), wherein wire clamp turning arm (402) is connected with wire clamp turning arm (402) by afterbody wire clamp shell fragment (407), wire clamp solenoid (403) and lead-in wire pilot hole (405) are installed on wire clamp fixed arm (401), two jewel sheets (406) are installed in respectively on wire clamp fixed arm (401) and wire clamp turning arm (402), above-mentioned wire clamp assembly is connected with bonding assembly (1) by wire clamp fixed arm (401), motion together with bonding assembly (1).
9. according to claim 8 for the bonding joint device on full-automatic lead bonding equipment, it is characterized in that being also provided with the wire clamp regulating spring (404) that can regulate the clamping force between wire clamp fixed arm (401) and wire clamp turning arm (402) on the wire clamp turning arm (401) of above-mentioned wire clamp assembly (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320094235.2U CN203456421U (en) | 2013-03-01 | 2013-03-01 | Bonding head apparatus applied to full-automatic lead bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320094235.2U CN203456421U (en) | 2013-03-01 | 2013-03-01 | Bonding head apparatus applied to full-automatic lead bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203456421U true CN203456421U (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320094235.2U Expired - Fee Related CN203456421U (en) | 2013-03-01 | 2013-03-01 | Bonding head apparatus applied to full-automatic lead bonding device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203456421U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177980A (en) * | 2013-03-01 | 2013-06-26 | 广东工业大学 | Bonding head device on full-automatic lead bonding equipment |
| CN107160050A (en) * | 2017-07-04 | 2017-09-15 | 东莞市凯格精密机械有限公司 | A kind of bonding equipment |
-
2013
- 2013-03-01 CN CN201320094235.2U patent/CN203456421U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177980A (en) * | 2013-03-01 | 2013-06-26 | 广东工业大学 | Bonding head device on full-automatic lead bonding equipment |
| CN107160050A (en) * | 2017-07-04 | 2017-09-15 | 东莞市凯格精密机械有限公司 | A kind of bonding equipment |
| CN107160050B (en) * | 2017-07-04 | 2023-03-24 | 东莞市凯格精机股份有限公司 | Wire bonding machine |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20210301 |