CN203423847U - Multilayer circuit board allowing registration detection - Google Patents
Multilayer circuit board allowing registration detection Download PDFInfo
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- CN203423847U CN203423847U CN201320491556.6U CN201320491556U CN203423847U CN 203423847 U CN203423847 U CN 203423847U CN 201320491556 U CN201320491556 U CN 201320491556U CN 203423847 U CN203423847 U CN 203423847U
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Abstract
The utility model discloses a multilayer circuit board allowing registration detection. The multilayer circuit board comprises conductive grounding holes, first grounding wires and at least one first testing hole corresponding to the first grounding wires. The conductive grounding holes penetrate a single board at each layer of the multilayer circuit board and are arranged at edge positions of the multilayer circuit board. One first grounding wire is disposed at a position corresponding to a preset coordinate position of each inner single board of the multilayer circuit board. Each first grounding wire is electrically connected with the respective conductive grounding hole. The first testing hole penetrates the single board at each layer of the multilayer circuit board, and has a preset distance from one preset first grounding wire. The multilayer circuit board provided by the utility model can solve the problems in the interlayer registration detection, thereby verifying the qualification of the interlayer registration of the multilayer circuit board.
Description
Technical field
The utility model relates to multilayer circuit board field, particularly a kind of multilayer circuit board that can carry out Aligning degree detection.
Background technology
Current communication is highly integrated, and speed promotes, and integrated chip and crimping device miniaturization etc. causes the number of plies of PCB more and more, from 8 layers of PCB of the nineties, develops into present 28 layers.In backboard field, 50 layers have been occurred, even the sample of 100 layers.The difficult point of high-layer PCB processing is exactly the plating of level to level alignment degree, high thickness to diameter ratio.And level to level alignment is spent greatly, to the subsequent applications of PCB and when the high speed signal emulation, there will be larger loss, produce serious product failure hidden danger, particularly power panel, high voltage can cause the burning plate risk of micro-spacing PCB.
Industry is section and X-ray to the main detection method of level to level alignment at present, two kinds of methods all cannot comprehensively be understood the Aligning degree situation of whole plate, particularly section has destructiveness, and be subject to the restriction of microtomy, likely can in slicing processes, introduce defect, cause erroneous judgement, so can only inspect by random samples, cannot carry out to the Aligning degree of PCB 100% check.When the interlayer side-play amount of a certain multi-layer PCB board exceeds in the scope of permission, if can not detect, will leave potential safety hazard.
Utility model content
Main purpose of the present utility model is for providing a kind of multilayer circuit board that can carry out Aligning degree detection, simple and easy to realize, to detect reliably multilayer circuit board level to level alignment degree situation.
To achieve these goals, the utility model proposes a kind of multilayer circuit board that can carry out Aligning degree detection, this multilayer circuit board comprises conductive earthing hole, the first earth connection and at least one first instrument connection corresponding with the first earth connection, and described conductive earthing hole is run through each layer of veneer of described multilayer circuit board and is arranged on the marginal position of described multilayer circuit board; The preset coordinate position correspondence of each internal layer veneer of described multilayer circuit board is provided with one first earth connection; Described in each, the first earth connection is electrically connected to described conductive earthing hole; Described the first instrument connection runs through each layer of veneer of described multilayer circuit board, and the distance of described the first instrument connection and predetermined first earth connection is a preset value.
Preferably, this multilayer circuit board comprises at least two described the first instrument connections, described in each, the first instrument connection distributes successively along a side of described predetermined the first earth connection, and the distance described in each between the first instrument connection and described predetermined the first earth connection is according to distributing position order increasing or decreasing.
Preferably, this multilayer circuit board also comprises the second earth connection on each the internal layer veneer that is arranged at described multilayer circuit board, and at least one second instrument connection corresponding with the second earth connection; Described the second earth connection is electrically connected to described conductive earthing hole; Described the second instrument connection runs through each layer of veneer of described multilayer circuit board, described the second instrument connection is corresponding one by one with described the first instrument connection, and described the second instrument connection and the distance of corresponding the second earth connection equal the distance of the first earth connection on internal layer veneer under the first instrument connection that described the second instrument connection is corresponding and described the second instrument connection.
Preferably, each internal layer veneer of described multilayer circuit board is provided with at least two described second instrument connections corresponding with described the second earth connection, described in each on each internal layer veneer, the second instrument connection distributes successively along a side of the second earth connection on each internal layer veneer, and the distance between the second earth connection described in each on each internal layer veneer on the second instrument connection and each internal layer veneer is according to distributing position order increasing or decreasing.
Preferably, in described conductive earthing hole, described the first instrument connection and/or described the second instrument connection, be provided with conducting medium.
Preferably, described conducting medium is electrodeposited coating.
Preferably, described conductive earthing hole is arranged on a drift angle place of described multilayer circuit board.
Preferably, described multilayer circuit board comprises at least two described conductive earthing holes, and described in each, conductive earthing hole is distributed in respectively each drift angle place of described multilayer circuit board.
The utility model multilayer circuit board by arranging conductive earthing hole, the first earth connection and at least one first instrument connection corresponding with the first earth connection on a multilayer circuit board, and described conductive earthing hole is run through each layer of veneer of described multilayer circuit board and is arranged on the marginal position of described multilayer circuit board; The preset coordinate position correspondence of each internal layer veneer of described multilayer circuit board is provided with one first earth connection; Described in each, the first earth connection is electrically connected to described conductive earthing hole; Described the first instrument connection runs through each layer of veneer of described multilayer circuit board, and the distance of described the first instrument connection and predetermined first earth connection is a preset value.After this multilayer circuit sheet metal forming, can detect the first instrument connection of different distance and open circuit and the short-circuit conditions between conductive earthing hole by the break-make gimmick of circuit, and then whether the level to level alignment that can directly judge this multilayer circuit board is qualified, therefore, realized the effective detection to the level to level alignment degree of multilayer circuit board.
Accompanying drawing explanation
Fig. 1 is the structural representation of an internal layer veneer of the utility model multilayer circuit board that can carry out Aligning degree detection;
Fig. 2 is the explosion type structural representation that the utility model can carry out multilayer circuit board one embodiment of Aligning degree detection;
Fig. 3 is the overall structure schematic diagram that the utility model can carry out multilayer circuit board one embodiment of Aligning degree detection.
The realization of the utility model object, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Shown in Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is the structural representation of an internal layer veneer of the utility model multilayer circuit board that can carry out Aligning degree detection; Fig. 2 is the explosion type structural representation that the utility model can carry out multilayer circuit board one embodiment of Aligning degree detection; Fig. 3 is the overall structure schematic diagram that the utility model can carry out multilayer circuit board one embodiment of Aligning degree detection.
A kind of technical scheme that is difficult to detect the drift condition between each single layer board after the multilayer circuit board that can carry out Aligning degree detection the utility model proposes completes mainly for multilayer circuit board.Those skilled in the art is to be understood that the multilayer circuit board exemplifying in this programme is formed by the pressing of the 1st layer of veneer～the n layer veneer, is laid with circuit on each layer of veneer.And after each layer of veneer pressing, need to guarantee between each veneer to there will not be the skew that exceeds permission, therefore, after pressing, all need, by instrument, this multilayer circuit board is carried out to the detection of level to level alignment degree, take and learn whether this circuit board is non-defective unit.
The multilayer circuit board that can carry out Aligning degree detection that the present embodiment provides comprises conductive earthing hole 10, the first earth connection 20 and at least one first instrument connection 30 corresponding with the first earth connection 20, and described conductive earthing hole 10 is run through each layer of veneer of described multilayer circuit board and is arranged on the marginal position of described multilayer circuit board; The preset coordinate position correspondence of each internal layer veneer of described multilayer circuit board is provided with one first earth connection 20; Described in each, the first earth connection 20 is electrically connected to described conductive earthing hole 10; Described the first instrument connection 30 runs through each layer of veneer of described multilayer circuit board, and the distance of described the first instrument connection 30 and predetermined first earth connection 20 is a preset value.After this multilayer circuit sheet metal forming, break-make gimmick by circuit detects the first instrument connection 30 of different distance and open circuit and the short-circuit conditions between conductive earthing hole 10, and then whether the level to level alignment degree that can directly judge this multilayer circuit board is qualified, therefore, realized the effective detection to the level to level alignment degree of multilayer circuit board.
In the present embodiment, in conductive earthing hole 10, be provided with conductive layer or conductive filler each layer the first earth connection 20 linked together.Above-mentioned internal layer veneer refers to the arbitrary veneer in second layer veneer layer extremely second from the bottom veneer in multilayer circuit board.Hypothetical multilayer circuit board is n layer, and the arbitrary veneer in the 2nd layer of veneer to the n-1 layer veneer, should be understood that this internal layer veneer comprises the 2nd layer of veneer and n-1 layer veneer.Wherein preset coordinate position is with respect to the same coordinate position of the initial point of each veneer on each veneer, the position of the initial point that should be understood that each veneer described herein on each veneer is identical, be after each veneer pressing and when level to level alignment perfect condition, the initial point of each veneer should be on same straight line, and this straight line is perpendicular to this circuit board.Wherein predetermined first earth connection 20 specifically refers to after multilayer circuit board stitching, by laser searchlighting, obtain the position of the first earth connection 20 of each internal layer veneer, and judge the mean deviation position of each internal layer veneer with this, or determine in the first earth connection 20 of each internal layer veneer that the first earth connection 20 of the first edges of boards of close multilayer circuit board is symmetrical in the position away from the symmetry axis of the first earth connection 20 of the first edges of boards.The mean deviation position of the position at this symmetry axis place or described each internal layer veneer is the position of described the first default earth connection 20, and then according to the position of this symmetry axis or mean deviation position, the side in the position of this symmetry axis arranges the first instrument connection 30 of different distance as required.Vertical range between the first instrument connection 30 and the position of symmetry axis is described preset value.Should be understood that, when having a plurality of the first instrument connection 30, the first instrument connection 30 correspondences of diverse location be a different preset value, this preset value is generally according to the safe distance setting between circuit in this multilayer circuit board, the quantity of the first instrument connection 30 precision as required specifically arranges.In addition, should guarantee can short circuit for the distance between two first instrument connections 30.
The concrete detection method of this multilayer circuit board is as follows:
By universal instrument or electric logging equipment, a testing needle is connected with conductive earthing hole 10, an other testing needle removes to connect the first instrument connection 30 of different distance successively, while there is short circuit between arbitrary the first instrument connection 30 on this multilayer circuit board being detected and conductive earthing hole 10, can directly judge the problem that has level to level alignment after this multilayer circuit board stitching, there is potential safety hazard in this multilayer circuit board.And record while being open circuit between all the first instrument connections 30 on a certain multilayer circuit board and conductive earthing hole 10, can learn that the level to level alignment degree of this multilayer circuit board meets production requirement.The lowest distance value that wherein records not short circuit is interlayer alignment ability value, can be follow-up adjustment interlayer circuit safety line-spacing data-guiding is provided.
Further, in order to improve the precision of test, this multilayer circuit board comprises at least two described the first instrument connections 30, described in each, the first instrument connection 30 distributes successively along a side of described predetermined the first earth connection, and the distance described in each between the first instrument connection 30 and described predetermined the first earth connection is according to distributing position order increasing or decreasing.
Further, this multilayer circuit board also comprises the second earth connection 40 on each the internal layer veneer that is arranged at described multilayer circuit board, and at least one second instrument connection 50 corresponding with the second earth connection 40; Described the second earth connection 40 is electrically connected to described conductive earthing hole 10; Described the second instrument connection 50 runs through each layer of veneer of described multilayer circuit board, described the second instrument connection 50 is corresponding one by one with described the first instrument connection 30, and described the second instrument connection 50 and the distance of corresponding the second earth connection 40 equal the distance of the first earth connection 20 on internal layer veneer under the first instrument connection 30 that described the second instrument connection 50 is corresponding and described the second instrument connection 50.In the present embodiment, only on that tested one deck veneer, the second earth connection 40 is set, by after each veneer pressing, by laser, measure all the first instrument connections 30 to the vertical range of the first earth connection 20 on that tested one deck veneer again, then according to all the first instrument connections 30, to the vertical range of the first earth connection 20 on that tested one deck veneer, on the multilayer circuit board after pressing, corresponding the second instrument connection 50 is set, for example, the vertical range of supposing the first earth connection 20 of one of them the first instrument connection 30a to the m layer is d, the vertical range between the second instrument connection 50b of aforementioned the first instrument connection 30a of correspondence and the second earth connection 40 of m layer is also made as to d.The detection method of the present embodiment can, with reference to the detection method of above-described embodiment, repeat no more herein.By detecting all second instrument connections 50 of m layer and short circuit and the open circuit situation between the second earth connection 40 of m layer, can know the alignment situation of this layer.
Further, in order to improve the precision of test, each internal layer veneer of described multilayer circuit board is provided with at least two described second instrument connections 50 corresponding with described the second earth connection 40, described in each on each internal layer veneer, the second instrument connection 50 distributes successively along a side of the second earth connection 40 on each internal layer veneer, and the distance between the second earth connection 40 described in each on each internal layer veneer on the second instrument connection 50 and each internal layer veneer is according to distributing position order increasing or decreasing.
Further, in order to improve the electric conductivity of conductive earthing hole 10, the first instrument connection 30 and the second instrument connection 50, in described conductive earthing hole 10, described the first instrument connection 30 and/or described the second instrument connection 50, be provided with conducting medium.Preferably, described conducting medium is electrodeposited coating.
Further, in order to reduce the space that takies circuit board, described conductive earthing hole 10 is arranged on a drift angle place of described multilayer circuit board.
Further, in order to reduce space and convenient detection that takies circuit board, described multilayer circuit board comprises at least two described conductive earthing holes 10, and described in each, conductive earthing hole 10 is distributed in respectively each drift angle place of described multilayer circuit board.
The foregoing is only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. the multilayer circuit board that can carry out Aligning degree detection, it is characterized in that, this multilayer circuit board comprises conductive earthing hole, the first earth connection and at least one first instrument connection corresponding with the first earth connection, and described conductive earthing hole is run through each layer of veneer of described multilayer circuit board and is arranged on the marginal position of described multilayer circuit board; The preset coordinate position correspondence of each internal layer veneer of described multilayer circuit board is provided with one first earth connection; Described in each, the first earth connection is electrically connected to described conductive earthing hole; Described the first instrument connection runs through each layer of veneer of described multilayer circuit board, and the distance of described the first instrument connection and predetermined first earth connection is a preset value.
2. the multilayer circuit board that can carry out Aligning degree detection according to claim 1, it is characterized in that, this multilayer circuit board comprises at least two described the first instrument connections, described in each, the first instrument connection distributes successively along a side of described predetermined the first earth connection, and the distance described in each between the first instrument connection and described predetermined the first earth connection is according to distributing position order increasing or decreasing.
3. the multilayer circuit board that can carry out Aligning degree detection according to claim 1, it is characterized in that, this multilayer circuit board also comprises the second earth connection on each the internal layer veneer that is arranged at described multilayer circuit board, and at least one second instrument connection corresponding with the second earth connection; Described the second earth connection is electrically connected to described conductive earthing hole; Described the second instrument connection runs through each layer of veneer of described multilayer circuit board, described the second instrument connection is corresponding one by one with described the first instrument connection, and described the second instrument connection and the distance of corresponding the second earth connection equal the distance of the first earth connection on internal layer veneer under the first instrument connection that described the second instrument connection is corresponding and described the second instrument connection.
4. the multilayer circuit board that can carry out Aligning degree detection according to claim 3, it is characterized in that, each internal layer veneer of described multilayer circuit board is provided with at least two described second instrument connections corresponding with described the second earth connection, described in each on each internal layer veneer, the second instrument connection distributes successively along a side of the second earth connection on each internal layer veneer, and the distance between the second earth connection described in each on each internal layer veneer on the second instrument connection and each internal layer veneer is according to distributing position order increasing or decreasing.
5. the multilayer circuit board that can carry out Aligning degree detection according to claim 3, is characterized in that, in described conductive earthing hole, described the first instrument connection and/or described the second instrument connection, is provided with conducting medium.
6. the multilayer circuit board that can carry out Aligning degree detection according to claim 5, is characterized in that, described conducting medium is electrodeposited coating.
7. according to the multilayer circuit board that can carry out Aligning degree detection described in claim 1-6 any one, it is characterized in that, described conductive earthing hole is arranged on a drift angle place of described multilayer circuit board.
8. the multilayer circuit board that can carry out Aligning degree detection according to claim 7, is characterized in that, described multilayer circuit board comprises at least two described conductive earthing holes, and described in each, conductive earthing hole is distributed in respectively each drift angle place of described multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320491556.6U CN203423847U (en) | 2013-08-12 | 2013-08-12 | Multilayer circuit board allowing registration detection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320491556.6U CN203423847U (en) | 2013-08-12 | 2013-08-12 | Multilayer circuit board allowing registration detection |
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| CN203423847U true CN203423847U (en) | 2014-02-05 |
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| CN201320491556.6U Expired - Lifetime CN203423847U (en) | 2013-08-12 | 2013-08-12 | Multilayer circuit board allowing registration detection |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
| CN106197250A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | The method of testing of pcb board internal layer off normal |
| CN106211636A (en) * | 2016-07-19 | 2016-12-07 | 浪潮电子信息产业股份有限公司 | The determination method of PCB Aligning degree and PCB |
| CN106550556A (en) * | 2016-10-12 | 2017-03-29 | 深圳市五株科技股份有限公司 | Aligning degree of multi-layer circuit board detecting system and its detection method |
| CN106961807A (en) * | 2017-01-16 | 2017-07-18 | 生益电子股份有限公司 | The inclined Aligning degree digitization analysis method of PCB layer and managing and control system |
| CN107241851A (en) * | 2016-03-29 | 2017-10-10 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN110031749A (en) * | 2019-05-15 | 2019-07-19 | 星科金朋半导体（江阴）有限公司 | A kind of substrate layer aligns test-strips and its monitoring method partially |
| CN110426536A (en) * | 2019-07-29 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | PCB conductive fabric measurement circuit plate |
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2013
- 2013-08-12 CN CN201320491556.6U patent/CN203423847U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107241851A (en) * | 2016-03-29 | 2017-10-10 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN107241851B (en) * | 2016-03-29 | 2019-05-28 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
| CN106197250A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | The method of testing of pcb board internal layer off normal |
| CN106197250B (en) * | 2016-07-01 | 2019-02-26 | 广州兴森快捷电路科技有限公司 | The test method of pcb board internal layer deviation |
| CN106211636A (en) * | 2016-07-19 | 2016-12-07 | 浪潮电子信息产业股份有限公司 | The determination method of PCB Aligning degree and PCB |
| CN106550556A (en) * | 2016-10-12 | 2017-03-29 | 深圳市五株科技股份有限公司 | Aligning degree of multi-layer circuit board detecting system and its detection method |
| CN106961807A (en) * | 2017-01-16 | 2017-07-18 | 生益电子股份有限公司 | The inclined Aligning degree digitization analysis method of PCB layer and managing and control system |
| CN106961807B (en) * | 2017-01-16 | 2019-07-05 | 生益电子股份有限公司 | The inclined Aligning degree digitization analysis method of PCB layer and managing and control system |
| CN110031749A (en) * | 2019-05-15 | 2019-07-19 | 星科金朋半导体（江阴）有限公司 | A kind of substrate layer aligns test-strips and its monitoring method partially |
| CN110031749B (en) * | 2019-05-15 | 2024-03-12 | 星科金朋半导体（江阴）有限公司 | Substrate layer offset alignment test strip and monitoring method thereof |
| CN110426536A (en) * | 2019-07-29 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | PCB conductive fabric measurement circuit plate |
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Granted publication date: 20140205 |