CN203407088U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN203407088U CN203407088U CN201320534204.4U CN201320534204U CN203407088U CN 203407088 U CN203407088 U CN 203407088U CN 201320534204 U CN201320534204 U CN 201320534204U CN 203407088 U CN203407088 U CN 203407088U
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- CN
- China
- Prior art keywords
- conducting
- copper foil
- foil layer
- conducting end
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a flexible circuit board including a copper foil layer, a polyimide film and a conducting end. A low ion tackiness agent layer is arranged between the polyimide film and the copper foil layer in a coating manner. The conducting end is arranged on an end of the copper foil layer. The flexible circuit board provided by the utility model is simple in structure and convenient to weld and a performance of welding and conducting with the external part is improved. Besides, since the thickness (which is generally 9 to 11 micrometers) of a coated copper layer of a conducting hole is increased, a problem of poor electric conduction caused by copper loss is avoided. At the same time, iconic migration can be reduced effectively and influence of pollutants on reliability of an assembly part can be weakened and a problem of insulation degradation can be solved effectively.
Description
Technical field
The utility model belongs to flexible PCB field, more particularly to a kind of flexible PCB with golden finger.
Background technology
Existing flexible PCB is usually through golden finger and turned on outside, when golden finger is by welding and ft connection, also by block tin mutual conduction between its two symmetrical conducting end, but due to the reasons such as welding technique easily occur conducting end be welded and fixed with block tin it is bad, so as to influence and outside conducting.
In the printed circuit boards, because being polluted by ionic substance, or when in circuit board containing ionic substance, apply under high-temperature humidifying state after voltage, electrode has an electric field, and in the presence of there is moisture in clearance for insulation portion, because ionized metal is moved in the opposite direction, original metal is reduced at comparative electrode and the phenomenon of dendritic metal is separated out, short circuit is often resulted in, is referred to as the phenomenon of insulation degradation.Therefore high insulaion resistance, such competence exertion loop function are required between printing insulated substrate surface and close conductor.Surface insulation impedance simultaneously is widely used for assessing influence of the pollutant to assembly reliability.
Utility model content
The purpose of this utility model is to provide a kind of flexible PCB with golden finger, it is good with outside weldings effect, improves conducting end and outside conduction property, simultaneously, the utility model can also effectively reduce Ion transfer, preferably reduce influence of the pollutant to assembly reliability.
The technical scheme that the utility model solution above-mentioned technical problem is used is as follows：A kind of flexible PCB, including copper foil layer, Kapton, conducting end are coated with the gluing oxidant layer of low ion between the Kapton and copper foil layer, the conducting end is arranged at copper foil layer one end.
The conducting end is multipair, and is symmetrically set；
The via being mutually communicated is provided with the symmetrical conducting end；
The via is close to the termination of conducting end；
The conducting hole plating copper thickness is more than 11um.
Beneficial effect：During welding, the liquid tin of fusing is passed through into the via, itself and outside welding turn-on effect is improved.The utility model is simple in construction, convenient welding, improves the welding conduction property with outside, and due to conducting hole plating copper thickness increase（General conducting hole plating copper thickness is 9-11um）, the problem of preventing from causing conductive bad because of the loss of copper.Meanwhile, the low gluing oxidant layer of ion can effectively reduce Ion transfer, preferably reduce influence of the pollutant to assembly reliability, the problem of effectively solving insulation degradation.
Brief description of the drawings
Fig. 1 is the utility model structural representation
Wherein, the gluing oxidant layer 3- copper foil layers 4- conducting ends 5- vias of the low ions of 1- Kaptons 2-
Embodiment
The utility model is further illustrated below in conjunction with the accompanying drawings.As shown in figure 1, a kind of flexible PCB, Kapton 1 including copper foil layer 3, conducting end 4, are coated with the gluing oxidant layer 2 of low ion between the Kapton 1 and copper foil layer 3, the conducting end 4 is arranged at the one end of copper foil layer 3.
The conducting end 4 is 4 pairs, and is symmetrically set；
The via 5 being mutually communicated is provided with the symmetrical conducting end 4；
The via 5 is close to the termination of conducting end 4；
The plating of via 5 copper thickness is 12um.
Claims (5)
1. a kind of flexible PCB, including copper foil layer, Kapton, conducting end, it is characterised in that the gluing oxidant layer of low ion is coated between the Kapton and copper foil layer, the conducting end is arranged at copper foil layer one end.
2. a kind of flexible PCB according to claim 1, it is characterised in that the conducting end is multipair, and is symmetrically set.
3. a kind of flexible PCB according to claim 2, it is characterised in that be provided with the via being mutually communicated in the symmetrical conducting end.
4. a kind of flexible PCB according to claim 3, it is characterised in that the via is close to the termination of conducting end.
5. a kind of flexible PCB according to claim 3 or 4, it is characterised in that the conducting hole plating copper thickness is more than 11um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320534204.4U CN203407088U (en) | 2013-08-29 | 2013-08-29 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320534204.4U CN203407088U (en) | 2013-08-29 | 2013-08-29 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407088U true CN203407088U (en) | 2014-01-22 |
Family
ID=49943006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320534204.4U Expired - Fee Related CN203407088U (en) | 2013-08-29 | 2013-08-29 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407088U (en) |
-
2013
- 2013-08-29 CN CN201320534204.4U patent/CN203407088U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN FUCHANGTAI PRECISION CIRCUIT CO., LTD. Free format text: FORMER OWNER: HAIYANG BIAIQI ELECTRONICS CO., LTD. Effective date: 20141219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 265100 YANTAI, SHANDONG PROVINCE TO: 518104 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141219 Address after: 518104, Shenzhen, Guangdong, Baoan District province manhole street, Wan An Road (West) Heng Changrong Industrial Park, C building on the first floor, A District Patentee after: Shenzhen fosunny Tai Precision circuit Co. Ltd. Address before: 265100 No. 12, Nanjing street, Haiyang Economic Development Zone, Yantai, Shandong Patentee before: Haiyang Bi Ai odd electron Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20160829 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |