CN203260616U - Led芯片 - Google Patents
Led芯片 Download PDFInfo
- Publication number
- CN203260616U CN203260616U CN 201320098554 CN201320098554U CN203260616U CN 203260616 U CN203260616 U CN 203260616U CN 201320098554 CN201320098554 CN 201320098554 CN 201320098554 U CN201320098554 U CN 201320098554U CN 203260616 U CN203260616 U CN 203260616U
- Authority
- CN
- China
- Prior art keywords
- electrode
- conductive
- type semiconductor
- semiconductor layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000002955 isolation Methods 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 91
- 239000007772 electrode material Substances 0.000 claims description 23
- 239000011241 protective layer Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 238000004020 luminiscence type Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000011810 insulating material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229910002601 GaN Inorganic materials 0.000 description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910004541 SiN Inorganic materials 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910021392 nanocarbon Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
Images
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Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320098554 CN203260616U (zh) | 2013-02-08 | 2013-03-04 | Led芯片 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320072665 | 2013-02-08 | ||
CN201320072665.4 | 2013-02-08 | ||
CN 201320098554 CN203260616U (zh) | 2013-02-08 | 2013-03-04 | Led芯片 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203260616U true CN203260616U (zh) | 2013-10-30 |
Family
ID=49473157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201320098554 Expired - Fee Related CN203260616U (zh) | 2013-02-08 | 2013-03-04 | Led芯片 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203260616U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103794689A (zh) * | 2014-02-25 | 2014-05-14 | 深圳市兆明芯科技控股有限公司 | 覆晶式led芯片的制作方法 |
CN103794695A (zh) * | 2014-02-25 | 2014-05-14 | 深圳市兆明芯科技控股有限公司 | 覆晶式led芯片 |
CN103985804A (zh) * | 2013-02-08 | 2014-08-13 | 东莞市正光光电科技有限公司 | Led芯片及其制造方法 |
CN109326688A (zh) * | 2018-12-04 | 2019-02-12 | 九江职业技术学院 | 一种双金属层环形叉指电极倒装led芯片及其制作方法 |
-
2013
- 2013-03-04 CN CN 201320098554 patent/CN203260616U/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103985804A (zh) * | 2013-02-08 | 2014-08-13 | 东莞市正光光电科技有限公司 | Led芯片及其制造方法 |
CN103794689A (zh) * | 2014-02-25 | 2014-05-14 | 深圳市兆明芯科技控股有限公司 | 覆晶式led芯片的制作方法 |
CN103794695A (zh) * | 2014-02-25 | 2014-05-14 | 深圳市兆明芯科技控股有限公司 | 覆晶式led芯片 |
WO2015127744A1 (zh) * | 2014-02-25 | 2015-09-03 | 深圳市兆明芯科技控股有限公司 | 覆晶式 led 芯片 |
CN109326688A (zh) * | 2018-12-04 | 2019-02-12 | 九江职业技术学院 | 一种双金属层环形叉指电极倒装led芯片及其制作方法 |
CN109326688B (zh) * | 2018-12-04 | 2023-09-12 | 九江职业技术学院 | 一种双金属层环形叉指电极倒装led芯片及其制作方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DONGGUAN ZHENGGUANG LIGHTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LIU YAN Effective date: 20131121 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131121 Address after: 523909 No. 1, Lane 8, South Road, Weiyuan, Humen Town, Dongguan, Guangdong Patentee after: Dongguan Zhengguang Lighting Technology Co., Ltd. Address before: 523909 No. 1, Lane 8, South Road, Weiyuan, Humen Town, Dongguan, Guangdong Patentee before: Liu Yan |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20160304 |