CN203250782U - 一种cob封装基板 - Google Patents

一种cob封装基板 Download PDF

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Publication number
CN203250782U
CN203250782U CN2013202035701U CN201320203570U CN203250782U CN 203250782 U CN203250782 U CN 203250782U CN 2013202035701 U CN2013202035701 U CN 2013202035701U CN 201320203570 U CN201320203570 U CN 201320203570U CN 203250782 U CN203250782 U CN 203250782U
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China
Prior art keywords
substrate
cob
chip
board
model
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Expired - Lifetime
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CN2013202035701U
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Inventor
李桂华
金鸿
陈森
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NANJING SUNFULL ELECTRONIC CIRCUIT Co Ltd
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NANJING SUNFULL ELECTRONIC CIRCUIT Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型涉及一种COB封装基板，由基板和发光区组成，所述基板由铝板、绝缘层、铜焊盘组成，所述基板上设有穿线孔。本实用新型基板制作完成后，在基板背面镂空出穿线孔，正负极连接导线直接从基板底部穿到正面的焊盘上，焊接后正面光源面上只有焊点，不会有裸露的导线，结构紧凑，整洁美观，同时导线是直接穿孔焊接，不会有折弯、磨蹭断裂、脱焊的危险，非常安全实用，适于广泛推广使用。

Description

一种COB封装基板
技术领域
本实用新型涉及一种COB封装基板。 
背景技术
COB（chip on board 板上芯片封装）光源的正负极连接的焊接，一般是临时在基板上直接开穿线孔或者在表面直接焊接，这种常规的焊线方式，在光源的正面会看到裸露的导线，影响美观，而且在使用过程中，穿孔或折弯的焊接导线，会出现脱落、剐蹭破皮等安全隐患。 
实用新型内容
本实用新型的目的是克服现有技术存在的缺陷，提供一种COB封装基板。 
实现本实用新型目的的技术方案是：一种COB封装基板，由基板和发光区组成，所述基板由铝板、绝缘层、铜焊盘组成，所述基板上设有穿线孔。 
进一步的，所述穿线孔穿透铝板、绝缘层和铜焊盘，铝板上的穿线孔直径A为2.50mm，绝缘层和铜焊盘上的穿线孔直径B为1.00mm。 
本实用新型具有积极的效果：基板制作完成后，在基板背面镂空出穿线孔，正负极连接导线直接从基板底部穿到正面的焊盘上，焊接后正面光源面上只有焊点，不会有裸露的导线，结构紧凑，整洁美观，同时导线是直接穿孔焊接，不会有折弯、磨蹭断裂、脱焊的危险，非常安全实用，适于广泛推广使用。 
附图说明
为了使本实用新型的内容更容易被清楚地理解，下面根据具体实施例并结合附图，对本实用新型作进一步详细的说明，其中 
图1为本实用新型的结构示意图。 
图2为本实用新型的剖面结构示意图。 
图3为本实用新型焊接导线后的结构示意图。 
其中：1、铜焊盘，2、绝缘层，3、铝板，4、导线，5、穿线孔，6、发光区， 7、基板。 
具体实施方式
如图1、2和3所示，本实用新型是一种COB封装基板，由基板7和发光区6组成，基板7由铝板3、绝缘层2、铜焊盘1组成，基板7上设有穿线孔5，穿线孔5穿透铝板3、绝缘层2和铜焊盘1，铝板3上的穿线孔5直径A为2.50mm，绝缘层2和铜焊盘1上的穿线孔5直径B为1.00mm。 
基板7制作完成后，在基板7背面镂空出穿线孔5，正负极连接导线4直接从基板7底部穿到正面的铜焊盘1上，焊接后正面光源面上只有焊点，不会有裸露的导线4，结构紧凑，整洁美观，同时导线4是直接穿孔焊接，不会有折弯、磨蹭断裂、脱焊的危险，非常安全实用，适于广泛推广使用。 
以上所述的具体实施例，对本实用新型的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本实用新型的具体实施例而已，并不用于限制本实用新型，凡在本实用新型的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。 

Claims (2)

1.一种COB封装基板，由基板（7）和发光区（6）组成，所述基板（7）由铝板（3）、绝缘层（2）、铜焊盘（1）组成，其特征在于：所述基板（7）上设有穿线孔（5）。
2.根据权利要求1所述的一种COB封装基板，其特征在于：所述穿线孔（5）穿透铝板（3）、绝缘层（2）和铜焊盘（1），铝板（3）上的穿线孔（5）直径A为2.50mm，绝缘层（2）和铜焊盘（1）上的穿线孔（5）直径B为1.00mm。
CN2013202035701U 2013-04-20 2013-04-20 一种cob封装基板 Expired - Lifetime CN203250782U (zh)

Priority Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112719514A (zh) * 2020-11-17 2021-04-30 十四冶建设集团云南安装工程有限公司 一种采用碳弧焊焊接紫铜板与紫铜绞线的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112719514A (zh) * 2020-11-17 2021-04-30 十四冶建设集团云南安装工程有限公司 一种采用碳弧焊焊接紫铜板与紫铜绞线的方法

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C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Chip-on-board (COB) package substrate

Effective date of registration: 20160517

Granted publication date: 20131023

Pledgee: Bank of Nanjing, Zhujiang branch, Limited by Share Ltd.

Pledgor: NANJING SUNFULL ELECTRONIC CIRCUIT Co.,Ltd.

Registration number: 2016990000396

PLDC Enforcement, change and cancellation of contracts on pledge of patent right or utility model
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20180925

Granted publication date: 20131023

Pledgee: Bank of Nanjing, Zhujiang branch, Limited by Share Ltd.

Pledgor: NANJING SUNFULL ELECTRONIC CIRCUIT Co.,Ltd.

Registration number: 2016990000396

PC01 Cancellation of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Chip-on-board (COB) package substrate

Effective date of registration: 20180930

Granted publication date: 20131023

Pledgee: Bank of Nanjing Limited by Share Ltd. Nanjing branch

Pledgor: NANJING SUNFULL ELECTRONIC CIRCUIT Co.,Ltd.

Registration number: 2018320000219

PE01 Entry into force of the registration of the contract for pledge of patent right
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Granted publication date: 20131023

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