CN203232451U - Full card payment smart card - Google Patents
Full card payment smart card Download PDFInfo
- Publication number
- CN203232451U CN203232451U CN 201320212122 CN201320212122U CN203232451U CN 203232451 U CN203232451 U CN 203232451U CN 201320212122 CN201320212122 CN 201320212122 CN 201320212122 U CN201320212122 U CN 201320212122U CN 203232451 U CN203232451 U CN 203232451U
- Authority
- CN
- China
- Prior art keywords
- smart card
- laminate
- card
- full
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model provides a full card payment smart card which comprises a full card payment smart card carrier band and a power induction sheet. The full card payment smart card carrier band is welded and connected with a pad contact which is led out from both ends of the power induction sheet through a pin pad, and then a PVC packaging technology is used to package the full card payment smart card carrier band and the power induction sheet into a whole body. According to the utility model, the power induction sheet of a small rigid flexible printed circuit board is directly arranged in the full card payment smart card carrier band; through a PVC packaging layer, the full card payment smart card carrier band and the power induction sheet are packaged into a whole body; and the smart card which is of the size of a smart card and has a short distance wireless communication function is formed.
Description
Technical field
The utility model relates to wireless communication technique, relates in particular to a kind of full card payment smart card.
Technical background
The card carrier band is the important raw and processed materials that is only second to chip in the smart card module core material, and be that directly a user oriented interface is divided into the two sides, surface of contact is used for making the machine-readable breath of winning the confidence of card back contact, make the user directly in the face of and use, another side is used for module package becomes encapsulating face, SIM card has only wireless telecommunications at present, identity recognition function, though and existing mobile payment antenna collection wireless near field communication and payment function under the 13.56MHZ frequency of operation, but payment induction antenna installation dimension is big, unsuitable I﹠M during use, operate defectives such as perishable, product weak point in serviceable life, and do not meet the development trend of miniaturization electronics product.
Summary of the invention
The purpose of this utility model is to provide a kind of power inductance sheet of the hard and soft printed circuit board of miniaturization that adopted to be directly installed on full card payment belt for smart card inside, the back is by the PVC encapsulated layer, to block payment belt for smart card and power inductance sheet entirely and be packaged into an integral body, formed the volume with smart card sized, but the smart card of collection close range wireless communication function, and the mobile payment antenna battery source that effectively improves under the 13.56MHZ frequency of operation disturbs the not enough defective not high with the environment suitability of the penetration power that exists, the installation dimension that has solved existing mobile payment antenna existence is big, unsuitable Operation and Maintenance during use, defectives such as product weak point in serviceable life.
To achieve these goals, the utility model provides a kind of full card payment smart card, it is characterized in that: comprise full card payment belt for smart card and a power inductance sheet, described power inductance sheet, comprise first printed circuit board and the coil that is wrapped on first printed circuit board, realize that by through hole circuit is connected between coil and first printed circuit board, the two ends of described coil are respectively equipped with to draw welds the contact; Described full card payment belt for smart card comprises second printed circuit board and chip, the pin of described intelligent chip is connected by the metallic copper conductor layer on the surface of second printed circuit board and the copper wire circuit that covers at the back side by via, described full card payment belt for smart card is welded to connect by the double-end weldering contact of pin pad and described power inductance sheet, and a PVC encapsulated layer will block the payment belt for smart card entirely and the power inductance sheet is packaged into an integral body.
Wherein, preferred version is: described first printed circuit board comprises first laminate, second laminate and central core, wherein first laminate, second laminate are distributed in the levels of central core respectively, described ground floor, second laminate are coated in FR-4 layer, metallic copper conductor layer, the coverlay of the upper and lower surface of central core respectively successively, wherein, described central core is that the center of BT resin is filled with a ferrite, and described coverlay is the polyimide film.
Wherein, preferred version is: described second printed circuit board comprises first laminate, second laminate and substrate layer, and wherein first laminate, second laminate are distributed in the levels of substrate layer respectively, and described substrate layer is the BT resin bed, and its thickness is 0.2mm.
Wherein, preferred version is: described first and second laminate is coated in the upper surface metallic copper conductor layer of substrate layer respectively successively, its thickness is: 45 microns, one gold medal/nickel dam on the described metallic copper conductor layer, thickness is the 3-5 micron, and the printing ink solder mask on one gold medal/nickel dam, its thickness is the 10-15 micron.
Advantage of the present utility model is: because the power inductance sheet of the hard and soft printed circuit board of the utility model miniaturization is directly installed on full card payment intelligent card carrier band inside, the back is by the PVC encapsulated layer, to block payment belt for smart card and power inductance sheet entirely and be packaged into an integral body, formed the volume with smart card sized, but the smart card of collection close range wireless communication function is used multiple advantages such as convenience, long service life.
Description of drawings
Fig. 1 is the front view (FV) of a kind of full card payment smart card of the utility model.
Fig. 2 is the sectional view of a kind of full card payment smart card of the utility model.
Fig. 3 is a kind of full card payment smart card of the utility model and the connection description figure of components and parts on it.
Embodiment
Describe embodiment of the present utility model in detail below in conjunction with accompanying drawing.
As shown in Figure 1: a kind of full card payment smart card 1 of the present invention comprises full card payment belt for smart card 10 and a power inductance sheet 20, described power inductance sheet 20, comprise first printed circuit board 21 and the coil 22 that is wrapped on first printed circuit board 21, realize that by the through hole (not shown) circuit is connected between described coil 22 and first printed circuit board 21, the two ends of described coil 22 are respectively equipped with to draw welds contact 23; Described full card payment belt for smart card 10 comprises second printed circuit board 11 and chip 12, the pin of described intelligent chip 12 is connected by multiple-plate metallic copper conductor layer of second printed circuit board 11 and the copper wire circuit that covers at the back side by via hole, and described full card payment belt for smart card 10 comprises that the double-end weldering contact 23 of pad 13 and described power inductance sheet 20 is welded to connect.
Fig. 2 blocks the sectional view of paying smart card entirely for the utility model, as shown in Figure 2: described first printed circuit board 21 is the double layer printed circuit plate, wherein, described first printed circuit board 21 comprises first laminate 211, second laminate 212 and central core 213, and wherein first laminate 211, second laminate 212 are distributed in the levels of central core 213 respectively.
Wherein, described central core 213 is for the center of resin is filled with a ferrite, and its thickness is 0.27mm, and this central core 213 is realized the effect of electromagnetic induction by the ferrite surface.Wherein resin is the BT resin.
Wherein, described first laminate 211 is coated in FR-4 (epoxy glass fabric insulcrete) layer of the upper surface of central core 213 successively, thickness: 75 microns, metallic copper conductor layer, and its thickness is: 50 microns; Gold/nickel dam on the FR-4 layer; thickness is the coverlay on 3-5 micron and the one gold medal/nickel dam, and its thickness is 0.0275mm, wherein; by the FR-4 layer described central core 13 and metallic copper conductor layer are separated; the metallic copper conductor layer plays the conducting function layer, and gold/nickel dam is for being welded to connect layer, and described coverlay does not come out the part that described metallic copper conductor layer does not need to weld; protection circuit is not corroded by external environment condition; play the protection insulating effect, wherein, described coverlay is the polyimide film.
In like manner second laminate 212 is consistent with the structure of first laminate 211, the FR-4 layer of the lower surface of central core 213 successively, thickness: 75 microns; Metallic copper conductor layer on the FR-4 layer, its thickness is: 50 microns; Gold/nickel dam on the metallic copper conductor layer, thickness are the coverlay on 3-5 micron and the one gold medal/nickel dam, and its thickness is 0.0275mm
Wherein, described second printed circuit board 11 comprises first laminate 111, second laminate 112 and substrate layer 113, wherein first laminate 111, second laminate 112 are distributed in the levels of substrate layer 113 respectively, and described substrate layer 113 is the BT resin bed, and its thickness is 0.2mm.
Wherein, 111 of described first laminates are coated in the upper surface metallic copper conductor layer of substrate layer 113 successively; its thickness is: 45 microns; one gold medal/nickel dam on the described metallic copper conductor layer; thickness is the 3-5 micron; and the printing ink solder mask on one gold medal/nickel dam; its thickness is the 10-15 micron; wherein; the metallic copper conductor layer plays the conducting function layer; gold/nickel dam is for being welded to connect layer, and described printing ink solder mask does not come out the part that described metallic copper conductor layer does not need to weld, and protection circuit is not corroded by external environment condition; play the protection insulating effect; described second laminate 112 is arranged at the lower surface of substrate layer 113, and is identical with first laminate, is distributed with the metallic copper conductor layer successively; gold/nickel dam and printing ink solder mask.
The utility model comprises that also a PVC encapsulated layer 30 will block the payment belt for smart card entirely and the power inductance sheet is packaged into an integral body.
Following for this utility model block full the payment smart card be illustrated, as Fig. 3 and shown in Figure 2: as described in full card payment smart card comprise carrier band 10 and power inductance sheet 20, described power inductance sheet 20 is welded to the frequency modulation capacitor C 15 on the metallic copper conductor layer that contact on the metallic copper conductor layer of first laminate 111 of card carrier band 10 is connected to first laminate 111, on the C5, described carrier band 10 comprises frequency modulation capacitor C 15, C5 is connected to filtering impedance capacitor C 14 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C9, C10, C13, C11, C14 is connected on the managing chip 12, wherein filtering impedance capacitor C 14 is connected to the 2nd pin of intelligent chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C9 is connected to the 3rd pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C10 is connected to the 4th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C13 is connected to the 5th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C12 is connected to the 6th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C16 is connected to the 9th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C11 is connected to the 10th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, C4 is connected to the 12nd pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, the management of chip 12 is by peripheral circuit R2, C17, C8 realizes basic function, wherein C17 is by metallic copper conductor layer and chip 12 the 13rd pin of first laminate 111 of second printed circuit board 11,27 pin link to each other, C8 is connected to the 27th pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, R2 is connected to the 22nd pin of chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, R2 links to each other with operation chip 12 the 1st pin by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11 in addition, managing chip 12 the 23rd pin links to each other with the 3rd pin of operation chip 12 by the metallic copper conductor layer of first laminate 111 of second printed circuit board 11, managing chip 12 the 25th pin links to each other with chip 12 the 4th pin by first laminate, the 111 metallic copper conductor layers of second printed circuit board 11, the metallic copper conductor layer of the metallic copper conductor layer of first laminate 111 of chip 12 the 5th pin by second printed circuit board 11 and second laminate 112 of second printed circuit board 11 links to each other, metallic copper conductor layer and the filter capacitor C1 of first laminate 111 by second printed circuit board 11, C2 links to each other, C1, C2 links to each other with the metallic copper conductor layer of second laminate 112 of second printed circuit board 11 by via hole, chip 12 the 6th and the 7th pin by first laminate 111 of second printed circuit board 11 the metallic copper conductor layer and the metallic copper conductor layer of second laminate 112 of second printed circuit board 11 link to each other.
Advantage of the present utility model is: because the power inductance sheet of the hard and soft printed circuit board of the utility model miniaturization is directly installed on full card payment belt for smart card inside, the back is by the PVC encapsulated layer, to block payment belt for smart card and power inductance sheet entirely and be packaged into an integral body, formed the volume with smart card sized, but the smart card of collection close range wireless communication function is used multiple advantages such as convenience, long service life.
The above person is the utility model most preferred embodiment only, is not for restriction scope of the present utility model, and all equivalences of doing according to the utility model claim change or modify, and are all the utility model and contain.
Claims (8)
1. a full card is paid smart card, it is characterized in that: comprise full card payment belt for smart card and a power inductance sheet, described power inductance sheet, comprise first printed circuit board and the coil that is wrapped on first printed circuit board, realize that by through hole circuit is connected between coil and first printed circuit board, the two ends of described coil are respectively equipped with to draw welds the contact; Described full card payment belt for smart card comprises second printed circuit board and chip, the pin of described intelligent chip is connected by the surface metal copper conductor layer of second printed circuit board and the copper wire circuit that covers at the back side by via, described full card payment belt for smart card is welded to connect by the double-end pad contact of pin pad and described power inductance sheet, will block the payment belt for smart card entirely by the PVC encapsulated layer again and the power inductance sheet is packaged into an integral body.
2. full card as claimed in claim 1 is paid smart card, it is characterized in that: described first printed circuit board comprises first laminate, second laminate and central core, wherein first laminate, second laminate are distributed in the levels of central core respectively, and described ground floor, second laminate are coated in FR-4 layer, metallic copper conductor layer, the coverlay of the upper and lower surface of central core respectively successively.
3. full card as claimed in claim 2 is paid smart card, and it is characterized in that: described central core is that the center of BT resin is filled with a ferrite.
4. full card as claimed in claim 2 is paid smart card, and it is characterized in that: comprise one gold medal/nickel dam between described metallic copper conductor layer and the coverlay, thickness is the 3-5 micron.
5. as the arbitrary described full card payment smart card of claim 3-4, it is characterized in that: described coverlay is the polyimide film.
6. full card as claimed in claim 1 is paid smart card, and it is characterized in that: described second printed circuit board comprises first laminate, second laminate and substrate layer, and wherein first laminate, second laminate are distributed in the levels of substrate layer respectively.
7. full card as claimed in claim 6 is paid smart card, and it is characterized in that: described substrate layer is the BT resin bed, and its thickness is 0.2mm.
8. full card as claimed in claim 6 is paid smart card, it is characterized in that: described first and second laminate is coated in the upper surface metallic copper conductor layer of substrate layer respectively successively, its thickness is: 45 microns, one gold medal/nickel dam on the described metallic copper conductor layer, thickness is the 3-5 micron, and the printing ink solder mask on one gold medal/nickel dam, its thickness is the 10-15 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320212122 CN203232451U (en) | 2013-04-22 | 2013-04-22 | Full card payment smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320212122 CN203232451U (en) | 2013-04-22 | 2013-04-22 | Full card payment smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203232451U true CN203232451U (en) | 2013-10-09 |
Family
ID=49288562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320212122 Expired - Fee Related CN203232451U (en) | 2013-04-22 | 2013-04-22 | Full card payment smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203232451U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104732385A (en) * | 2013-12-18 | 2015-06-24 | 北京同方微电子有限公司 | Full card with communication protocol integrated in radio-frequency chip and using method thereof |
| CN105529537A (en) * | 2014-10-21 | 2016-04-27 | 英飞凌科技股份有限公司 | Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement |
| CN105978594A (en) * | 2016-06-16 | 2016-09-28 | 北京握奇智能科技有限公司 | Active payment module and payment device |
| CN109034789A (en) * | 2017-06-08 | 2018-12-18 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
-
2013
- 2013-04-22 CN CN 201320212122 patent/CN203232451U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104732385A (en) * | 2013-12-18 | 2015-06-24 | 北京同方微电子有限公司 | Full card with communication protocol integrated in radio-frequency chip and using method thereof |
| CN105529537A (en) * | 2014-10-21 | 2016-04-27 | 英飞凌科技股份有限公司 | Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement |
| CN105978594A (en) * | 2016-06-16 | 2016-09-28 | 北京握奇智能科技有限公司 | Active payment module and payment device |
| CN109034789A (en) * | 2017-06-08 | 2018-12-18 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
| CN109034789B (en) * | 2017-06-08 | 2022-02-15 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9922938B2 (en) | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same | |
| US10277071B2 (en) | Wireless power receiver and method of manufacturing the same | |
| CN104067389B (en) | Semiconductor device including electromagnetic absorption and shielding | |
| CN101800215B (en) | Wireless communication module package structure | |
| CN203232451U (en) | Full card payment smart card | |
| CN109427461A (en) | Inductor components | |
| US10438889B2 (en) | Semiconductor package device and method of manufacturing the same | |
| CN103260354A (en) | Power inductive chip of rigid and soft printed circuit board and preparation method thereof | |
| CN102215043A (en) | Wireless communication module | |
| CN108878407A (en) | Semiconductor encapsulation device and its manufacturing method | |
| CN104081885B (en) | Substrate having built-in components | |
| CN105529537A (en) | Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement | |
| US20150188354A1 (en) | Intergrally encapsulated wireless charging device | |
| CN103050779A (en) | NFC (Near Field Communication) antenna, manufacturing method thereof and NFC communication device | |
| CN103915681B (en) | Antenna | |
| CN110364496A (en) | A kind of chip-packaging structure and its packaging method | |
| CN205670539U (en) | A kind of organic substrate superintegrated three-dimensional microwave circuit structure | |
| CN203312286U (en) | All card payment smart card carrying belt | |
| CN105703068B (en) | A kind of anti-interference type NFC antenna and preparation method thereof | |
| CN105684215B (en) | Antenna assembly and electronic equipment | |
| CN102237885A (en) | Wireless communication module | |
| CN207082629U (en) | A kind of flexible dual-band radio-frequency antenna, flexible strap and intelligent watch | |
| CN203039106U (en) | NFC (near field communication) antenna and NFC device | |
| US10332849B2 (en) | Semiconductor package device and method of manufacturing the same | |
| CN103268872A (en) | Payment-by -pure-card intelligent card loading belt and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131009 Termination date: 20190422 |