CN102215043A - Wireless communication module - Google Patents
Wireless communication module Download PDFInfo
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- CN102215043A CN102215043A CN2010101430583A CN201010143058A CN102215043A CN 102215043 A CN102215043 A CN 102215043A CN 2010101430583 A CN2010101430583 A CN 2010101430583A CN 201010143058 A CN201010143058 A CN 201010143058A CN 102215043 A CN102215043 A CN 102215043A
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Abstract
The invention belongs to the field of mobile communication, and relates to a wireless communication module, in particular to a high-performance small-sized module of a code division multiple access (CDMA) evolution-data optimized (EV-DO) mobile terminal. The small-sized module is applicable to a third generation (3G) user terminal. The wireless communication module is characterized in that: board-level connection is carried out by ball grid array (BGA) package; the level of integration is high; the size is small; good electrical performance and an external interface function are realized; and requirements of a customer can be well met. The wireless communication module comprises a radio frequency front end, a transmitting and receiving channel, a base band processing part, a memory and a power manager, wherein the base band processing part and the radio frequency front end are placed on a top layer of a circuit board; a shielding cover is arranged on the top layer to guarantee an excellent electromagnetic compatibility function of the module; the memory is placed on a bottom layer of the circuit board; and the bottom layer adopts an advanced BGA technology to guarantee reliable connection during the application of the module.
Description
Technical field
The invention belongs to moving communicating field, relate to a kind of wireless communication module, be specifically related to a kind of based on CDMA2000 mobile communication system terminal module.
Background technology
Along with the development of mobile communication technology, the user is more and more higher to the requirement of personal communication, and mobile communication also develops into 3G by 2G, 2.5G, and the application of portable terminal is also increasingly extensive.
CDMA2000 (Code Division Multiple Access 2000, code division multiple access) 1x EV-DO standard originates from HDR (the high data rate of QualCom company the earliest, high speed data transfer) technology, after this through constantly improving and testing and submitted formal technical scheme with the title of CDMA2000 1x EV-DO to 3GPP2 (3rd Generation Partnership Project 2, third generation partner program 2) in March, 2000.The meaning of 1xEV is " Evolution ", also represent the development of standard, the meaning of DO is Data Only, had afterwards in order to express the implication of this technology better, Data Only is changed into Data Optimized, and expression EV-DO technology is in an effective enhancements that provides aspect the data service to CDMA2000 1X network.
At present, the design of EVDO mobile communication module, usually adopt ways such as reducing components and parts spacing, increase layout density, increase stacks as high, reduce the components and parts spacing, increase layout density difficulty of processing is uprised, and reduced yields, increased stacks as high design is not met the demands.Simultaneously, the other problems of existing EVDO mobile communication module also is: volume is bigger, does not satisfy the requirement of flexible Application, and thickness is thicker, can not satisfy the requirement of ultra-thin hand-hold mobile product.
Summary of the invention
Technical problem to be solved by this invention provides a kind of new module that is used for portable terminal, and present mobile communication module volume is big to improve, thickness is thicker, can't satisfy flexible Application, and the problem of the requirement of ultra-thin hand-hold mobile product.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: comprise radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit, memory cell; Described Base Band Unit is electrically connected with radio frequency unit, memory cell, filter unit, crystal oscillator unit respectively; Described power subsystem provides electric power for radio frequency unit, crystal oscillator unit, filter unit, Base Band Unit, memory cell; Described radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit and memory cell are arranged on two faces of same circuit board and adopt BGA (Ball Grid Array Package, ball grid array) encapsulation.On two faces which unit is set respectively, have no particular limits, can adjust according to actual needs, as long as can be to reach the less purpose of used board area, various circuit units can be taked various combining forms, are separately positioned on two faces of circuit board.
The invention has the beneficial effects as follows: wireless communication module is adopted two-sided process technology, realize miniaturization Design with lower requirement on machining accuracy, each element in the wireless communication module is arranged on two faces of circuit board respectively and adopts the BGA encapsulation, reduced wire length, eliminate in the meticulous device because the coplane degree that causes and the problem of angularity, and can under other encapsulation conditions, provide more I/O quantity with homalographic, also reduced simultaneously the coupling effect in the electric property, can make wireless communication module integrated higher, volume is littler, thickness is thinner, power consumption is littler, for the miniaturization of portable terminal with multi-functionally provide wide design space, applying flexible, and, make it in limited space, design more circuit function for the secondary development user provides enough spaces.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit are arranged at the same one side of circuit board, and memory cell is arranged at the another side of circuit board.
Adopt the beneficial effect of above-mentioned further scheme to be, each element is put on circuit board rationally, saves the space.
Further, the outside in the circuit board one side that is provided with radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit is provided with screening cover, and screening cover is provided with opening.
Adopt the beneficial effect of above-mentioned further scheme to be, effective shield electromagnetic interference, and have good performance of heat dissipation.
Further, described screening cover is the metallic shield lid.
Further, described screening cover is the tinplate screening cover.
Adopt the beneficial effect of above-mentioned further scheme to be, make that screening cover is corrosion-resistant, nontoxic, intensity is high.
Further, be provided with the peripheral region of the one side of radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit, be provided with solder mask at circuit board.
Adopt the beneficial effect of above-mentioned further scheme to be, on the structure, make that the welding of screening cover is more reliable, on electric property, the upper berth copper of screening cover and circuit board fully welds, and guarantees the abundant ground connection of screening cover, and effect is covered in favourable enhancing frequently.
Further, be provided with the one side place of memory cell at circuit board, be provided with the hole groove, memory cell is embedded in the groove of hole.
Adopt the beneficial effect of above-mentioned further scheme to be, memory cell is embedded in the groove of hole can reduces the height of memory cell, thereby make wireless communication module become thinner.
Further, be provided with the one side place of memory cell at circuit board, be provided with pin, pin provides interface for the outer member link.
Adopt the beneficial effect of above-mentioned further scheme to be, adopt the BGA encapsulation, have good physics and be electrically connected performance, all pins are arranged on the same one side of circuit board, and the direct paster of wireless communication module is used.
Further, the position of described pin is higher than memory cell.
Adopt the beneficial effect of above-mentioned further scheme to be, when having avoided the pin welding, memory cell touches base circuit board and causes the out-of-flatness when wireless communication module is connected with other circuit boards and the bad generation of conducting electricity.
Further, described interface comprises main antenna interface, diversity antenna interface, universal asynchronous reception/transmission interface, USB interface, subscriber identification module interface, SD card, audio interface, power-management interface, universal input/output interface, pulse code modulation interface and jtag test and upgrade interface.
Further, described wireless communication module is the EVDO mobile communication module.
The present invention is practical, can satisfy the application of various wireless terminals; Power consumption is little, is well positioned to meet energy-conservation and environmental requirement; In light weight, can finely satisfy the application of handheld device.
Description of drawings
Fig. 1 is an embodiment of the invention EVDO mobile communication module top level structure schematic diagram;
Fig. 2 is an embodiment of the invention EVDO mobile communication module fabric schematic diagram;
Fig. 3 is the side cross-sectional schematic of embodiment of the invention EVDO mobile communication module;
Fig. 4 is an embodiment of the invention EVDO mobile communication module logic diagram of circuit;
Fig. 5 is the internal circuit logic diagram of TQM613029 chip in the embodiment of the invention EVDO mobile communication module radio frequency unit 101.
In the accompanying drawing, the list of parts of each label representative is as follows:
101, radio frequency unit, 102, filter unit, 103, the crystal oscillator unit, 104, power subsystem, 105, Base Band Unit, 106, solder mask, 107, screening cover, 201, pin, 202, memory cell, 203, filtering decoupling unit, 204, hole groove, 301, main antenna, 302, divided antenna, 303, interface, 10101, duplexer, 10102, receiving filter, 10103, emission filter, 10104, first amplifier, 10105, second amplifier
Embodiment
Below in conjunction with accompanying drawing principle of the present invention and feature are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
The wireless communication module of present embodiment is the EVDO mobile communication module, this module length-width ratio is 5: 3, adopt the circuit board of BGA encapsulation, this circuit board adopts 6 layers of epoxy glass fiber plate board structure of circuit, the two-sided electronic component of putting, and adopt the 2+2+2 stepped construction to design, element adopts SMD (SurfaceMounted Device, surface mount device) form entirely, is convenient to large-scale production, improved production efficiency, saved production cost, top layer adopts unique screening cover design, has improved EMC (the Electromagnetic Compatibility of product, Electro Magnetic Compatibility) performance makes this module to use under various complex electromagnetic environments environment.External interface all is positioned at the bottom of circuit board, adopts the encapsulation of ball grid array row, can be used for direct paster and use.
In the wireless communication module of the present invention, the chip that is in the circuit board top layer all adopts the bottom package pin mode to be connected with circuit board.Screening cover adopts tinplate, and is corrosion-resistant, nontoxic, intensity is high, is welded in around the top layer of circuit board, has guaranteed present embodiment EVDO mobile communication module Electro Magnetic Compatibility preferably, and the top is provided with foursquare opening, has good performance of heat dissipation; The module employing nation that is arranged at the circuit board bottom decides mode and is connected with circuit board by bonding line; External interface partly is positioned at the bottom of circuit board, adopts leg to draw.
As shown in Figure 1, be present embodiment EVDO mobile communication module top level structure schematic diagram, radio frequency unit 101, filter unit 102, crystal oscillator unit 103, power subsystem 104, Base Band Unit 105 are arranged at this layer.Wherein Base Band Unit 105 adopts the QSC6085 chip; Crystal oscillator unit 103 provides clock signal for Base Band Unit 105.Power subsystem 104 is whole EVDO mobile communication module power supply and filtering.For solder mask 106 is set, be used for the welding of screening cover around the top layer circuit board surface.
As shown in Figure 2, fabric schematic diagram for present embodiment EVDO mobile communication module, mainly the distribute memory cell 202 of pin 201 and Bang Ding of bottom, be distributed with pin two 01 around the memory cell 202, pin two 01 has 101, length direction is 19, Width is 11, in order to guarantee the superperformance of memory cell 202,203 pairs of memory cells in filtering decoupling unit 202 carry out filtering and decoupling, this ball grid permutation pad design is eliminated in the meticulous device because the coplane degree that causes and the problem of angularity, and can under other encapsulation conditions, provide more I/O quantity with homalographic, simultaneously also reduced the coupling effect in the electric property, also helped reliability and heat radiation that module connects, for the EVDO mobile communication module provides assurance at high temperature or the application under the environment of vibration.
Shown in Figure 3, be the side cross-sectional schematic of present embodiment EVDO mobile communication module, the height of present embodiment EVDO mobile communication module is 2.5mm, this ultra-thin size can satisfy the user has the occasion of requirement at thickness application.Screening cover 107 is welded in around the circuit board top, and radio frequency unit 101, filter unit 102, crystal oscillator unit 103, power subsystem 104, Base Band Unit 105 all paster are welded on the circuit board top layer; The bottom of the circuit board that pin two 01, memory cell 202 are arranged at.The circuit board bottom is provided with hole groove 203, during manufacturing, the bare chip of memory cell 202 is positioned in the groove 203 of hole, an and employing point glue bond, deciding technology with nation again links to each other with circuit board section with the bare chip of gold thread with memory cell 202, cover the black adhesive curing of one deck then around the bare chip with memory cell 202, bare chip and gold thread are embedded in black glue the inside.Pin two 01 can adopt shapes such as BGA soldered ball or copper post, adopt the BGA solder ball shape in the present embodiment, and the height of pin two 01 is higher than memory cell 202, when avoiding pin two 01 welding, memory cell 202 touches the circuit board that welded of bottom and out-of-flatness when causing wireless communication module and the institute soldered circuit board being connected, even conducts electricity bad generation.
As shown in Figure 4, be the logic diagram of circuit of present embodiment EVDO mobile communication module, present embodiment EVDO mobile communication module circuit is divided into receiving unit, radiating portion and power pack.Receiving unit mainly comprises main antenna interface and diversity antenna interface.As shown in Figure 4, main antenna 301 is electrically connected with radio frequency unit 101 through main antenna receipts/Power Generation Road, be electrically connected between radio frequency unit 101 and the Base Band Unit 105, divided antenna 302 receives through divided antenna and is electrically connected with filter unit 102, be electrically connected between filter unit 102 and the Base Band Unit 105, be electrically connected between Base Band Unit 105 and the memory cell 202, the interface 303 of EVDO mobile communication module mainly comprises subscriber identification module interface, audio interface, SD card, universal asynchronous reception/dispensing device interface, USB interface, universal input/output interface.Wherein, the subscriber identification module interface meets ISO 7816-3 standard, can manage and upgrade the data on the card by the wireless air interface mode, can be to User Recognition and communication encryption, all right storing phone number, personal information such as information, in the present embodiment, in the corresponding pin 201,, use during for application for the user provides 6 link pins; Audio interface unit provides the input and output of 3 pairs of audio frequency, and every pair of voice band line all adopts the mode of difference cabling to realize, to guarantee good sound quality and little noise; The SD card is provided convenience for the user carries out storage, in order to realize this memory function, this enforcement provides 9 pins, make things convenient for the expanded application (simultaneously in present embodiment memory cell 202 also for user provide small quantity of memory space) of user to the storage data, if the user need expand this function, link these 9 pins on request and get final product; Realize the conversion transmission of serial data and parallel data for special user, present embodiment provides 4 pins to realize universal asynchronous reception/transmission data communication for the user, meet the RS-232 interface agreement, support 4 bit-serial bus interfaces or 2 line serial line interfaces, can carry out serial communication and instruction input etc. by this interface and the external world; USB adopts 4 line interfaces, supports the USB2.0 host-host protocol, satisfies the usb signal transmission rate of low speed 1.5Mbps and full speed 12Mbps, and the USB interface data line adopts the difference cabling mode to realize, overcomes interference, to guarantee reliability of data communication; For the user may use other functions, present embodiment provides 5 universal input/output interface pins, and the user connects this interface pin and gets final product if realize other controlled function.
In the present embodiment, Base Band Unit 105 is made up of three parts, radio frequency/simulation part, baseband portion, power management part.Wherein, radio frequency/simulation part branch has comprised variable gain amplifier, band pass filter, analog-to-digital conversion circuit, D/A conversion circuit, audio coding change-over circuit and local oscillation circuit etc.; Baseband portion has comprised processor, interface circuit, air interface circuit, internal memory support circuit etc.; Power management has partly comprised power management, Power Supply Monitoring and power-switching circuit etc.
Mainly adopted the TQM613029 chip in the radio frequency unit 101 of present embodiment, its logic diagram of circuit mainly comprises duplexer 10101, receiving filter 10102, emission filter 10103, first amplifier 10104, second amplifier 10105 as shown in Figure 5.Receiving filter 10102 and emission filter 10103 shared main antennas 301, radio frequency unit 101 separates with transmitting to received signal by duplexer 10101, outputs to 105 Base Band Unit through first amplifier 10104 after then received signal being amplified; Transmit then from the output of 105 Base Band Unit, through second amplifier 10105 amplify, duplexer 10101, be transmitted into after after emission filter 10103 filtering aerial.
As shown in Figure 4, receiving unit is divided into two-way in the present embodiment, and one the tunnel is main antenna 301, and another road is a divided antenna 302, promptly comes received signal with two reception antennas, to guarantee the reliability of signal transmission link.During concrete enforcement, main antenna 301 and divided antenna 302 need to isolate 1/2nd wavelength.As shown in Figure 4, the signal that receives of divided antenna 302 receive through divided antenna and filter unit 102 after directly be sent to Base Band Unit 105 and amplify and handle; The signal that main antenna 301 receives is sent to radio frequency unit 101 through main antenna receipts/Power Generation Road and amplifies, and main antenna 301 and divided antenna 302 two paths of signals are finally merged by Base Band Unit 105 to be handled and the signal demodulation.
The radiating portion of this circuit, with the audio interface is example, from the audio interface input audio signal of interface 303 parts to Base Band Unit 105,105 pairs of voice of Base Band Unit are gathered, compress, are encoded then, voice and signal modulation back are outputed to radio frequency unit 101 by Base Band Unit 105, carry out outputing to main antenna 301 through process main antenna receipts/Power Generation Road after the power amplification, be transmitted into aerial.
At power pack, present embodiment EVDO mobile communication module provides whole power supplies by power subsystem 104 and power supply is managed.
The characteristic of present embodiment EVDO mobile communication module is as shown in table 1.
Table 1
The working frequency range of present embodiment EVDO mobile communication module is as shown in table 2:
Table 2
Present embodiment EVDO mobile communication module is followed following standard:
[1] 3GPP TS 34.121 User Equipment (UE) conformance specification; Radio transmission and reception (FDD) (universal mobile telecommunications system terminal consistency rule, wireless transmission and reception-TDD mode)
[2] 3GPP TS 05.05 (digital cellular communication system 2, wireless transmission and reception)
[3] 3GPP TS 34.124 Electromagnetic compatibility (EMC) requirements for Mobile terminals and ancillary equipment (Electro Magnetic Compatibility of portable terminal and auxiliary device)
The present invention adopts two-sided processing and BGA encapsulation technology, realizes miniaturization Design with lower requirement on machining accuracy, and semiconductor chip can also be placed except passive devices such as resistance capacitance inductance in the module back side.Adopt semiconductor chip to be potted directly on the module substrate, packaged type can be nation's alignment or flip chip technology.
Present embodiment adopts the high baseband chip scheme of multi-functional integrated level, and integrated baseband modem, media engine, wireless transceiver and power management when reducing research and development, manufacturing and Material Cost, have also shortened the production time.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. a wireless communication module is characterized in that: comprise radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit, memory cell; Described Base Band Unit is electrically connected with radio frequency unit, memory cell, filter unit, crystal oscillator unit respectively; Described power subsystem provides electric power for radio frequency unit, crystal oscillator unit, filter unit, Base Band Unit, memory cell; Described radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit and memory cell are arranged on two faces of same circuit board and adopt the BGA encapsulation.
2. wireless communication module according to claim 1 is characterized in that: described radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit are arranged at the same one side of circuit board, and described memory cell is arranged at the another side of circuit board.
3. wireless communication module according to claim 2 is characterized in that: the outside in the circuit board one side that is provided with radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit, be provided with screening cover, and screening cover is provided with opening.
4. wireless communication module according to claim 3 is characterized in that: described screening cover is the metallic shield lid.
5. wireless communication module according to claim 4 is characterized in that: described screening cover is the tinplate screening cover.
6. wireless communication module according to claim 2 is characterized in that: be provided with the peripheral region of the one side of radio frequency unit, crystal oscillator unit, filter unit, power subsystem, Base Band Unit at described circuit board, be provided with solder mask.
7. wireless communication module according to claim 2 is characterized in that: be provided with the one side place of memory cell at described circuit board, be provided with the hole groove, described memory cell is embedded in the groove of hole.
8. wireless communication module according to claim 2 is characterized in that: be provided with the one side place of memory cell at described circuit board, be provided with pin, described pin provides interface for the outer member link.
9. ask 8 described wireless communication modules according to right, it is characterized in that: the position of described pin is higher than memory cell.
10. wireless communication module according to claim 8 is characterized in that: described interface comprises main antenna interface, diversity antenna interface, universal asynchronous reception/transmission interface, USB interface, subscriber identification module interface, SD card, audio interface, power-management interface, universal input/output interface, pulse code modulation interface and jtag test and upgrade interface.
11. according to each described wireless communication module of claim 1 to 10, it is characterized in that: described wireless communication module is the EVDO mobile communication module.
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| CN2010101430583A CN102215043A (en) | 2010-04-09 | 2010-04-09 | Wireless communication module |
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| CN2010101430583A CN102215043A (en) | 2010-04-09 | 2010-04-09 | Wireless communication module |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102237885A (en) * | 2010-04-20 | 2011-11-09 | 国民技术股份有限公司 | Wireless communication module |
| CN103475387A (en) * | 2013-04-22 | 2013-12-25 | 江苏声立传感技术有限公司 | Method for improving signal detection sensitiveness of SAW (surface acoustic wave) wireless sensing |
| CN106057791A (en) * | 2016-07-22 | 2016-10-26 | 美的智慧家居科技有限公司 | System-level packaging chip and preparation method thereof and device comprising the same |
| CN106057770A (en) * | 2016-07-22 | 2016-10-26 | 美的智慧家居科技有限公司 | System-level packaging chip and preparation method thereof, and device comprising the same |
| CN106098682A (en) * | 2016-07-22 | 2016-11-09 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
| CN106129054A (en) * | 2016-07-22 | 2016-11-16 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
| CN106129055A (en) * | 2016-07-22 | 2016-11-16 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
| CN106169469A (en) * | 2016-07-22 | 2016-11-30 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
| CN109390313A (en) * | 2017-08-04 | 2019-02-26 | 三星电机株式会社 | The connection system of semiconductor package part |
| CN109803487A (en) * | 2019-02-18 | 2019-05-24 | 西安茂德通讯科技有限公司 | Microwave transmitting and receiving component |
| CN110933523A (en) * | 2019-12-19 | 2020-03-27 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111557063A (en) * | 2017-12-19 | 2020-08-18 | 三星电子株式会社 | Module comprising an antenna and an RF element and base station comprising a module |
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| CN106129055A (en) * | 2016-07-22 | 2016-11-16 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
| CN106057770A (en) * | 2016-07-22 | 2016-10-26 | 美的智慧家居科技有限公司 | System-level packaging chip and preparation method thereof, and device comprising the same |
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| CN106129054A (en) * | 2016-07-22 | 2016-11-16 | 美的智慧家居科技有限公司 | System in package chip and preparation method thereof and comprise the equipment of this chip |
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| CN109390313A (en) * | 2017-08-04 | 2019-02-26 | 三星电机株式会社 | The connection system of semiconductor package part |
| CN111557063A (en) * | 2017-12-19 | 2020-08-18 | 三星电子株式会社 | Module comprising an antenna and an RF element and base station comprising a module |
| US11682845B2 (en) | 2017-12-19 | 2023-06-20 | Samsung Electronics Co., Ltd. | Module comprising antenna and RF element, and base station including same |
| CN109803487A (en) * | 2019-02-18 | 2019-05-24 | 西安茂德通讯科技有限公司 | Microwave transmitting and receiving component |
| CN110933523A (en) * | 2019-12-19 | 2020-03-27 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
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Application publication date: 20111012 |