CN203181403U - PCB multilayer board with blind via - Google Patents
PCB multilayer board with blind via Download PDFInfo
- Publication number
- CN203181403U CN203181403U CN 201320145635 CN201320145635U CN203181403U CN 203181403 U CN203181403 U CN 203181403U CN 201320145635 CN201320145635 CN 201320145635 CN 201320145635 U CN201320145635 U CN 201320145635U CN 203181403 U CN203181403 U CN 203181403U
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- CN
- China
- Prior art keywords
- layer
- blind hole
- multilayer board
- top layer
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a PCB multilayer board with a blind via. The PCB multilayer board comprises a top layer, a power layer, a ground layer and a bottom layer which are successively bonded from top to bottom. The PCB multilayer board with the blind via is provided with the blind via which is arranged from the top layer to the bottom layer or from the bottom layer to the top layer. By using the PCB multilayer board of the utility model, through setting the blind via on the PCB multilayer board, uniformity of stress on the multilayer board during compacting the multilayer board is increased; simultaneously, positioning and installation fixing can be conveniently performed on the multilayer board; a yield and efficiency of usage and the installation of the multilayer board are increased.
Description
Technical field
The utility model relates to a kind of pcb board, particularly a kind of PCB multi-layer sheet.
Background technology
The English of blind hole is Blind Via, is surface at plank Yi Bian this hole has, pass within the plank then till.Namely connect top layer and internal layer and do not connect the via of justifying.Blind hole is positioned at top layer and the bottom surface of printed substrate, has certain depth, is used for being connected of top layer circuit and following internal layer circuit, and the degree of depth in hole is no more than certain ratio (aperture) usually.For common multi-layer PCB board owing to only need carry out lamination one time, can say that plate is designed to symmetrical structure so that when lamination the stressed unanimity of pcb board all directions, thereby make multi-layer sheet adhere to specification.And during the multi-layer sheet lamination, owing in pressing process, be easy to cause pcb board to scrap because structure is asymmetric former thereby seesaw takes place.
Summary of the invention
For addressing the above problem, the utility model discloses a kind of band blind hole PCB multi-layer sheet, by at the PCB multi-layer sheet blind hole being set, when having improved the multi-layer sheet compacting, the uniformity that multi-layer sheet is stressed, also be convenient to simultaneously multi-layer sheet is positioned and installs and fixes, improved rate of finished products and multi-layer sheet and used the efficient of installing.
The disclosed band blind hole of the utility model PCB multi-layer sheet comprises from top to bottom top layer, bus plane, stratum and the bottom of bonding setting in turn, and band blind hole PCB multi-layer sheet is provided with the blind hole of being offered or being offered to top layer by bottom to bottom by top layer.
The multiple-plate a kind of improvement of the disclosed band blind hole of the utility model PCB, by the blind hole that top layer is offered to bottom, its opening and connects the three ply board that comprises top layer at the most to the bottom direction on top layer.
The disclosed band blind hole of the utility model PCB multiple-plate another improve, by the blind hole that bottom is offered to top layer, its opening and connects the three ply board that comprises bottom at the most to the top layer direction on bottom.
The disclosed band blind hole of the utility model PCB multi-layer sheet, by at the PCB multi-layer sheet blind hole being set, for the PCB multi-layer sheet provides extra stressed and pressure releasing structure, thereby when making the multi-layer sheet compacting, improved the stressed uniformity of multi-layer sheet, reduced the possibility that seesaw takes place in the PCB pressing process, reduced multiple-plate percent defective, reduce the multiple-plate production cost of PCB and saved the production material, also be convenient to multi-layer sheet is positioned and installs and fixes by the blind hole that arranges simultaneously, improved multiple-plate use installation effectiveness.
Description of drawings
Fig. 1, the multiple-plate structural representation of the disclosed band blind hole of the utility model PCB.
Accompanying drawing is indicated tabulation:
1, top layer; 2, bus plane; 3, stratum;
4, bottom; 5, blind hole
Embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the utility model, should understand following embodiment and only be used for explanation the utility model and be not used in restriction scope of the present utility model.Need to prove, word " preceding ", " back ", " left side ", " right side ", the "up" and "down" used are described below refer to the direction in the accompanying drawing, word " interior " and " outward " refer to respectively towards or away from the direction of specific features geometric center.
As shown in Figure 1, the disclosed band blind hole of the utility model PCB multi-layer sheet, the top layer 1, bus plane 2, stratum 3 and the bottom 4 that comprise from top to bottom bonding setting in turn, band blind hole PCB multi-layer sheet are provided with the blind hole 5 of being offered or being offered to top layer 1 by bottom 4 to bottom 4 by top layer 1.
As a kind of preferred, by the blind hole 5 that top layer 1 is offered to bottom 4, its opening and connects the three ply board that comprises top layer 1 to bottom 4 directions at the most on top layer 1.
As a kind of preferred, by the blind hole 5 that bottom 4 is offered to top layer 1, its opening and connects the three ply board that comprises bottom 4 to top layer 1 direction at the most on bottom 4.
The disclosed band blind hole of the utility model PCB multi-layer sheet, by at the PCB multi-layer sheet blind hole being set, for the PCB multi-layer sheet provides extra stressed and pressure releasing structure, thereby when making the multi-layer sheet compacting, improved the stressed uniformity of multi-layer sheet, reduced the possibility that seesaw takes place in the PCB pressing process, reduced multiple-plate percent defective, reduce the multiple-plate production cost of PCB and saved the production material, also be convenient to multi-layer sheet is positioned and installs and fixes by the blind hole that arranges simultaneously, improved multiple-plate use installation effectiveness.
The disclosed technological means of the utility model scheme is not limited only to the disclosed technological means of above-mentioned technological means, also comprises the technical scheme of being made up of above technical characterictic combination in any.
Claims (3)
1. band blind hole PCB multi-layer sheet comprises from top to bottom it is characterized in that top layer, bus plane, stratum and the bottom of bonding setting in turn: described band blind hole PCB multi-layer sheet is provided with the blind hole of being offered or being offered to top layer by bottom to bottom by top layer.
2. band blind hole PCB multi-layer sheet according to claim 1 is characterized in that: the described blind hole of being offered to bottom by top layer, its opening and connect the three ply board that comprises top layer at the most to the bottom direction on top layer.
3. band blind hole PCB multi-layer sheet according to claim 1 is characterized in that: the described blind hole of being offered to top layer by bottom, its opening and connect the three ply board that comprises bottom at the most to the top layer direction on bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320145635 CN203181403U (en) | 2013-03-28 | 2013-03-28 | PCB multilayer board with blind via |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320145635 CN203181403U (en) | 2013-03-28 | 2013-03-28 | PCB multilayer board with blind via |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203181403U true CN203181403U (en) | 2013-09-04 |
Family
ID=49078055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320145635 Expired - Fee Related CN203181403U (en) | 2013-03-28 | 2013-03-28 | PCB multilayer board with blind via |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203181403U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016119825A1 (en) | 2016-10-18 | 2018-04-19 | HELLA GmbH & Co. KGaA | circuit board |
-
2013
- 2013-03-28 CN CN 201320145635 patent/CN203181403U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016119825A1 (en) | 2016-10-18 | 2018-04-19 | HELLA GmbH & Co. KGaA | circuit board |
| US11452214B2 (en) | 2016-10-18 | 2022-09-20 | HELLA GmbH & Co. KGaA | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20140328 |