CN203311866U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203311866U CN203311866U CN2013203066923U CN201320306692U CN203311866U CN 203311866 U CN203311866 U CN 203311866U CN 2013203066923 U CN2013203066923 U CN 2013203066923U CN 201320306692 U CN201320306692 U CN 201320306692U CN 203311866 U CN203311866 U CN 203311866U
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Abstract
The utility model discloses a transparent conductive film. The conductive film comprises a transparent substrate, a conductive circuit, a first conductive layer, a second conductive layer, first wiring electrodes and second wiring electrodes. The transparent substrate includes a main body and a flexible base plate. The width of the flexible base plate is smaller than that of the main body. The main body includes an induction area and a border area arranged on the periphery of the induction area. The conductive circuit is arranged on the flexible transparent substrate. The first conductive layer and the second conductive layer are arranged on two opposite sides of the induction area. The first conductive layer is provided with intersectant first conductive threads, and the second conductive layer is provided with intersectant second conductive threads. The first wiring electrodes and the second wiring electrodes are arranged in the border area. The first conductive layer is electrically connected with the conductive circuit through the first wiring electrodes. The second conductive layer is electrically connected with the conductive circuit through the second wiring electrodes. According to the transparent conductive film provided by the utility model, the first conductive layer, the second conductive layer and the conductive circuit are arranged on the same transparent substrate so as to form a conductive film and a flexible circuit board, so that the conductive film and the flexible circuit board are not needed to be bonded, increasing the production efficiency.
Description
Technical field
The utility model relates to the touch-screen field, particularly relates to a kind of nesa coating.
Background technology
Nesa coating is a kind of film that has satisfactory electrical conductivity and have high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
Flexible PCB is to take polyimides or polyester film a kind ofly to have height reliability, an excellent flexible printed circuit as what base material was made.Be called for short soft board or FPC(Flexible Printed Circuit), have that distribution density is high, lightweight, the characteristics of thin thickness.Nesa coating is connected with external circuits by FPC, thereby the position signalling of nesa coating perception is transferred in processor, identifies, and determines touch location.
Traditional, when nesa coating is connected with external circuits by FPC, first by the laminating of the lead-in wire of FPC and nesa coating zone, then and printed circuit board (Printed Circuit Board, PCB) be connected, cause production efficiency lower.
The utility model content
Based on this, be necessary the nesa coating that provides a kind of production efficiency high.
A kind of nesa coating comprises:
Transparent substrates, described transparent substrates comprise body and the flexible base, board extended to form from described body one side, and the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate;
Be located at latticed first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at latticed second conductive layer of described induction zone and the relative side of described the first conductive layer, described the second conductive layer comprises cross one another the second conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to; And
Be located at the second lead-in wire electrode of described rim area opposite side, described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and are electrically connected to.
In embodiment, two surfaces that described induction zone is relative offer respectively the first groove and the second groove therein, and described the first conductive layer is contained in described the first groove, and described the second conductive layer is contained in described the second groove.
In embodiment, described the first bottom portion of groove is nonplanar structure therein, and described the second bottom portion of groove is nonplanar structure.
In embodiment, the width of described the first groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m therein, and the ratio of height and width is greater than 1;
The width of described the second groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
In embodiment, described the first lead-in wire electrode and described the second lead-in wire electrode are embedded at respectively two relative surfaces of described rim area therein; Or
Described the first lead-in wire electrode or described the second lead-in wire electrode directly are located at respectively two relative surfaces of described rim area.
In embodiment, also comprise the first hypothallus therein, described first hypothallus corresponding with induction zone offers the first groove away from the surface of described transparent substrates, and described the first conductive layer is contained in described the first groove.
In embodiment, described the first lead-in wire electrode is embedded at the surface of described first hypothallus corresponding with described rim area away from described transparent substrates therein; Or
Described the first lead-in wire electrode directly is located at the surface of described first hypothallus corresponding with described rim area away from described transparent substrates.
In embodiment, also comprise the second hypothallus therein, described second hypothallus corresponding with described induction zone offers the second groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second groove.
In embodiment, described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described rim area away from described transparent substrates therein; Or
Described the second lead-in wire electrode directly is located at the surface of described second hypothallus corresponding with described rim area away from described transparent substrates.
Therein in embodiment, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, and the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
In embodiment, described conducting circuit is latticed or strip therein, and latticed described conducting circuit is intersected to form by the conducting silk thread.
In embodiment, also comprise protective clear layer therein, described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
In embodiment, the visible light transmissivity of described nesa coating is not less than 86% therein.
The transparent substrates of above-mentioned nesa coating comprises body and flexible base, board, thereby the first conductive layer, the second conductive layer and conducting circuit are arranged on same transparent substrates and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to fit, above-mentioned nesa coating does not need attaching process, has improved production efficiency.
The accompanying drawing explanation
Fig. 1 is the cross-sectional view of the nesa coating of an execution mode along the first conductive layer;
Fig. 2 is the cross-sectional view of the nesa coating of an execution mode along the second conductive layer;
Fig. 3 is the cross-sectional view of the nesa coating of an embodiment;
Fig. 4 is the structural representation of the bottom portion of groove of an execution mode;
Fig. 5 is the structural representation of the conductive grid of an embodiment;
Fig. 6 is the structural representation of the conductive grid of another embodiment;
Fig. 7 is the cross-sectional view of the nesa coating of another embodiment;
Fig. 8 is the cross-sectional view of the nesa coating of another embodiment;
Fig. 9 is the cross-sectional view of the nesa coating of another embodiment.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present utility model more comprehensively thorough.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present utility model understand usually identical.The term used in specification of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.
Please refer to Fig. 1 to Fig. 3, the nesa coating 100 of an execution mode, comprise transparent substrates 10, the first conductive layer 20, the second conductive layer 30, the first lead-in wire electrode 40, the second lead-in wire electrode 50 and conducting circuit 60.
The material of transparent substrates can be PETG (Polyethylene terephthalate, PET) or thermoplastic.Thermoplastic can be Merlon (Polycarbonate, PC) or polymethyl methacrylate (polymethylmethacrylate, PMMA).
Transparent substrates comprises body 110 and the flexible base, board 120 extended to form from body 110 1 sides.The width of flexible base, board 120 is less than the width of body 110, the rim area 114 that body 110 comprises induction zone 112 and is positioned at the induction zone edge.
Two surfaces that induction zone 112 is relative offer respectively the first groove and the second groove.Two relative surfaces of rim area 114 offer respectively the 3rd groove and the 4th groove.The first groove and the 3rd groove are positioned at homonymy, and the second groove and the 4th groove are positioned at homonymy.
Flexible base, board 120 is at least one.When flexible base, board 120 was one, flexible base, board 120 offered the 5th groove.The 5th groove can also can the second groove homonymy with the first groove groove.Certainly, when flexible base, board 120 was one, flexible base, board 120 also can offer respectively on two relative surfaces the 5th groove and the 6th groove.In the 5th groove and the 6th groove one with the first groove homonymy, another and the second groove homonymy.In the present embodiment, flexible base, board 120 is 2.2 flexible base, boards 120 offer respectively the 5th groove and the 6th groove.In the 5th groove and the 6th groove one with the first groove homonymy, another and the second groove homonymy.
For convenience of description, in case of no particular description, the first groove, the second groove, the 3rd groove, the 4th groove, the 5th groove and the 6th groove are referred to as groove.In conjunction with Fig. 4, bottom portion of groove is non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Trench bottom is arranged to " V " font, " W " font, arc or waveform, after electric conducting material is filled in to groove, during dry solidification, can be reduced the contraction of electric conducting material.Electric conducting material is filled in to groove and solidify to form the first conductive thread, the second conductive thread, the first conductive lead wire, the second conductive lead wire and conducting silk thread, the performance of electric conducting material is had good protective effect and prevents electric conducting material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The first conductive layer 20 is contained in the first groove.The first conductive layer 20 is latticed.In conjunction with Fig. 5 to Fig. 6, the grid of the first conductive layer 20 can be regular grid (Fig. 5) or random grid (Fig. 6).The first conductive layer 20 comprises cross one another the first conductive thread.The first conductive layer is solidify to form by the electric conducting material that is filled in the first groove.The material of the first conductive layer can be conducting metal, and conducting metal can be silver or copper.
The second conductive layer 30 is contained in the second groove.The second conductive layer 30 is latticed.In conjunction with Fig. 5 to Fig. 6, the grid of the second conductive layer 30 can be regular grid (Fig. 5) or random grid (Fig. 6).The second conductive layer 30 comprises cross one another the second conductive thread.The second conductive layer is solidify to form by the electric conducting material that is filled in the second groove.The material of the second conductive layer 30 can be conducting metal, and conducting metal can be silver or copper.
The first lead-in wire electrode 40 and the second lead-in wire electrode 50 are contained in respectively the 3rd groove and the 4th groove.The first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The first conductive layer 20 and conducting circuit 60 are electrically connected to by the first lead-in wire electrode 40.The second lead-in wire electrode 50 and the second conductive layer 30 homonymies.The second conductive layer 30 and conducting circuit 60 are electrically connected to by the second lead-in wire electrode 50.The first conductive layer 20 and conducting circuit 60 are electrically connected to by the first lead-in wire electrode 40, and the second conductive layer 30 and conducting circuit 60 are electrically connected to by the second lead-in wire electrode 50, are passed to conducting circuit 60 with the touch signal that induction zone is detected.
The first lead-in wire electrode 40 can be latticed or strip.The second lead-in wire electrode 50 also can be latticed or strip.
Latticed the first lead-in wire electrode 40 comprises cross one another the first conductive lead wire.In conjunction with Fig. 5 to Fig. 6, the grid of the first lead-in wire electrode 40 can be regular grid (Fig. 5) or random grid (Fig. 6).The first lead-in wire electrode 40 is solidify to form by the electric conducting material that is filled in the 3rd groove.The material of the first lead-in wire electrode 40 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the first lead-in wire electrode 40 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
Latticed the second lead-in wire electrode 50 comprises cross one another the second conductive lead wire.In conjunction with Fig. 5 to Fig. 6, the grid of the second lead-in wire electrode 50 can be regular grid (Fig. 5) or random grid (Fig. 6).The second lead-in wire electrode 50 is solidify to form by the electric conducting material be filled in the 4th groove.The material of the second lead-in wire electrode 50 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the second lead-in wire electrode 50 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
In the present embodiment, conducting circuit 60 is 2, is contained in respectively the 5th groove and the 6th groove.Conducting circuit 60 can be latticed or strip.
Latticed conducting circuit 60 comprises cross one another conducting silk thread.In conjunction with Fig. 5 to Fig. 6, the grid of conducting circuit 60 can be regular grid (Fig. 5) or random grid (Fig. 6).Conducting circuit 60 is solidify to form by the electric conducting material that is filled in the 5th groove and the 6th groove.The material of conducting circuit 60 can be conducting metal, and conducting metal can be silver or copper.
As shown in Figure 7, the first lead-in wire electrode 40 can also directly be located at the surface of rim area, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.Now, the first lead-in wire electrode 40 forms by silk screen printing, exposure imaging or inkjet printing.The second lead-in wire electrode 50 also can directly be located at the surface of rim area, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.Now, the second lead-in wire electrode 50 forms by silk screen printing, exposure imaging or inkjet printing.
Certainly, in other embodiments, the first lead-in wire electrode 40 and the second arranging of electrode 50 of lead-in wire can also be following mode:
(1) first lead-in wire electrode 40 can directly be located at the surface of rim area, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The second lead-in wire electrode 50 is contained in the 4th groove of rim area, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.Now, the first lead-in wire electrode 40 forms by silk screen printing, exposure imaging or inkjet printing.The electric conducting material of the second lead-in wire electrode 50 in being filled in the 4th groove solidify to form.
(2) first lead-in wire electrodes 40 are contained in the 3rd groove of rim area, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The second lead-in wire electrode 50 directly is located at the surface of rim area, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.Now, the electric conducting material of the first lead-in wire electrode 40 in being filled in the 3rd groove solidify to form.The second lead-in wire electrode 50 forms by silk screen printing, exposure imaging or inkjet printing.
In another embodiment as shown in Figure 8, nesa coating 100 also comprises the first hypothallus 70 and the second hypothallus 80.The first hypothallus 70 is separately positioned on two relative surfaces of transparent substrates 10 with the second hypothallus 80.
The material of the first hypothallus 70 can be UV glue, impression glue or Merlon.
The material of the second hypothallus 80 can be UV glue, impression glue or Merlon.
For convenience of description, in case of no particular description, the first groove, the second groove, the 3rd groove and the 4th groove are referred to as groove.In conjunction with Fig. 4, bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Trench bottom is arranged to " V " font, " W " font, arc or waveform, after electric conducting material is filled in to groove, during dry solidification, can be reduced the contraction of electric conducting material.Electric conducting material is filled in to groove and solidify to form the first conductive thread, the second conductive thread, the first conductive lead wire and the second conductive lead wire, the performance of electric conducting material is had in good protective effect and drying course, electric conducting material can not open circuit.The width of groove can be 0.2 μ m～5 μ m, highly can be 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The first conductive layer 20 is contained in the first groove.The first conductive layer 20 is latticed.In conjunction with Fig. 5 to Fig. 6, the grid of the first conductive layer 20 can be regular grid (Fig. 5) or random grid (Fig. 6).The first conductive layer 20 comprises cross one another the first conductive thread.The first conductive layer 20 is solidify to form by the electric conducting material that is filled in the first groove.The material of the first conductive layer 20 can be conducting metal, and conducting metal can be silver or copper.
The first lead-in wire electrode 40 is contained in the 3rd groove.The first lead-in wire electrode 40 can be latticed or strip.
Latticed the first lead-in wire electrode 40 comprises cross one another the first conductive lead wire.In conjunction with Fig. 5 to Fig. 6, the grid of the first lead-in wire electrode 40 can be regular grid (Fig. 5) or random grid (Fig. 6).The first lead-in wire electrode 40 is solidify to form by the electric conducting material that is filled in the 3rd groove.The material of the first lead-in wire electrode 40 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the first lead-in wire electrode 40 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
The second conductive layer 30 is contained in the second groove.The second conductive layer 30 is latticed.In conjunction with Fig. 5 to Fig. 6, the grid of the second conductive layer 30 can be regular grid (Fig. 5) or random grid (Fig. 6).The second conductive layer 30 comprises cross one another the second conductive thread.The second conductive layer 30 is solidify to form by the electric conducting material that is filled in the second groove.The material of the second conductive layer 30 can be conducting metal, and conducting metal can be silver or copper.
The second lead-in wire electrode 50 is contained in the 4th groove.The second lead-in wire electrode 50 can be latticed or strip.Latticed the second lead-in wire electrode 50 comprises cross one another the second conductive lead wire.In conjunction with Fig. 5 to Fig. 6, the grid of the second lead-in wire electrode 50 can be regular grid (Fig. 5) or random grid (Fig. 6).The second lead-in wire electrode 50 is solidify to form by the electric conducting material that is filled in the 4th groove.The material of the second lead-in wire electrode 50 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the second lead-in wire electrode 50 of strip can be 10 μ m～200 μ m, highly can be 5 μ m～20 μ m.
Be appreciated that as shown in Figure 9, the first lead-in wire electrode 40 can also directly be located at the surface of first hypothallus 70 corresponding with rim area, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The second lead-in wire electrode 50 also can directly be located at the surface of second hypothallus 80 corresponding with rim area, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.
In other embodiments, the first lead-in wire electrode 40 and the second arranging of electrode 50 of lead-in wire can also be following modes:
(1) first lead-in wire electrode 40 can directly be located at the surface of first hypothallus 70 corresponding with rim area, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The second lead-in wire electrode 50 is contained in the 4th groove, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.
(2) first lead-in wire electrodes 40 are contained in the 3rd groove, the first lead-in wire electrode 40 and the first conductive layer 20 homonymies.The second lead-in wire electrode 50 directly is located at the surface of the second hypothallus 80, the second lead-in wire electrode 50 and the second conductive layer 30 homonymies.
Above-mentioned nesa coating 100 can also comprise the protective clear layer (not shown), and protective clear layer coats transparent substrates 10, the first conductive layer 20, the second conductive layer 30, the first lead-in wire electrode 40, the second lead-in wire electrode 50 and conducting circuit 60 at least partly.The material of protective clear layer can be ultraviolet cured adhesive (UV glue), impression glue or Merlon.Nesa coating 100 is provided with the oxidation that protective clear layer can effectively prevent electric conducting material.
The visible light transmissivity of above-mentioned nesa coating 100 is not less than 86%.
The transparent substrates of above-mentioned nesa coating 100 comprises body 110 and flexible base, board 120, by the first conductive layer 20, thereby the second conductive layer 30 and conducting circuit 60 are arranged on same transparent substrates and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to fit, above-mentioned nesa coating 100 does not need attaching process, improved production efficiency, when the flexible connection parts are connected with external equipment, can adopt laminating, or be provided with male end or female end at the flexible connection ends, direct and external equipment carries out socket connection.Simultaneously, owing to not needing attaching process, save manufacturing cost, improved the generation yield of product.Above-mentioned the first conductive layer 20 and the second conductive layer 30 are established respectively the both sides with transparent substrates, convenient during generation.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (13)
1. a nesa coating, is characterized in that, comprising:
Transparent substrates, described transparent substrates comprise body and the flexible base, board extended to form from described body one side, and the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate;
Be located at latticed first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at latticed second conductive layer of described induction zone and the relative side of described the first conductive layer, described the second conductive layer comprises cross one another the second conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to; And
Be located at the second lead-in wire electrode of described rim area opposite side, described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and are electrically connected to.
2. nesa coating according to claim 1, it is characterized in that, two surfaces that described induction zone is relative offer respectively the first groove and the second groove, and described the first conductive layer is contained in described the first groove, and described the second conductive layer is contained in described the second groove.
3. nesa coating according to claim 2, is characterized in that, described the first bottom portion of groove is nonplanar structure, and described the second bottom portion of groove is nonplanar structure.
4. nesa coating according to claim 2, is characterized in that, the width of described the first groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1;
The width of described the second groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
5. nesa coating according to claim 1, is characterized in that, described the first lead-in wire electrode is embedded at respectively two relative surfaces of described rim area with described the second lead-in wire electrode; Or
Described the first lead-in wire electrode or described the second lead-in wire electrode directly are located at respectively two relative surfaces of described rim area.
6. nesa coating according to claim 1, it is characterized in that, also comprise the first hypothallus, described first hypothallus corresponding with induction zone offers the first groove away from the surface of described transparent substrates, and described the first conductive layer is contained in described the first groove.
7. nesa coating according to claim 6, is characterized in that, described the first lead-in wire electrode is embedded at the surface of described first hypothallus corresponding with described rim area away from described transparent substrates; Or
Described the first lead-in wire electrode directly is located at the surface of described first hypothallus corresponding with described rim area away from described transparent substrates.
8. nesa coating according to claim 6, it is characterized in that, also comprise the second hypothallus, described second hypothallus corresponding with described induction zone offers the second groove away from the surface of described transparent substrates, and described the second conductive layer is contained in described the second groove.
9. nesa coating according to claim 8, is characterized in that, described the second lead-in wire electrode is embedded at the surface of described second hypothallus corresponding with described rim area away from described transparent substrates; Or
Described the second lead-in wire electrode directly is located at the surface of described second hypothallus corresponding with described rim area away from described transparent substrates.
10. nesa coating according to claim 1, it is characterized in that, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
11. nesa coating according to claim 1, is characterized in that, described conducting circuit is latticed or strip, and latticed described conducting circuit is intersected to form by the conducting silk thread.
12. nesa coating according to claim 1; it is characterized in that; also comprise protective clear layer, described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
13. nesa coating according to claim 1, is characterized in that, the visible light transmissivity of described nesa coating is not less than 86%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203066923U CN203311866U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203066923U CN203311866U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203311866U true CN203311866U (en) | 2013-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203066923U Expired - Lifetime CN203311866U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
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| CN (1) | CN203311866U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294272A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| CN103295670A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| EP3695237A4 (en) * | 2017-10-11 | 2020-12-30 | New Asia Group Holdings Limited | Sensing film with an integrated structure |
-
2013
- 2013-05-30 CN CN2013203066923U patent/CN203311866U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294272A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| CN103295670A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN103295670B (en) * | 2013-05-30 | 2015-11-25 | 南昌欧菲光科技有限公司 | Nesa coating |
| CN103294272B (en) * | 2013-05-30 | 2016-04-13 | 南昌欧菲光科技有限公司 | Nesa coating |
| EP3695237A4 (en) * | 2017-10-11 | 2020-12-30 | New Asia Group Holdings Limited | Sensing film with an integrated structure |
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