CN203150536U - A graphite film with high thermal conductivity - Google Patents
A graphite film with high thermal conductivity Download PDFInfo
- Publication number
- CN203150536U CN203150536U CN 201320140301 CN201320140301U CN203150536U CN 203150536 U CN203150536 U CN 203150536U CN 201320140301 CN201320140301 CN 201320140301 CN 201320140301 U CN201320140301 U CN 201320140301U CN 203150536 U CN203150536 U CN 203150536U
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- CN
- China
- Prior art keywords
- graphite film
- graphite
- adhesive tape
- high conductive
- thermal conductivity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model provides a graphite film with high thermal conductivity. The graphite film with high thermal conductivity is mounted on a CPU chip and comprises a graphite basic body, a double-face adhesive tape, and an insulating layer. One surface of the double-face adhesive tape is pasted on one surface of the graphite basic body. The other surface of the double-face adhesive tape is pasted on the CPU chip. The other surface of the graphite basic body is pasted on one surface of the insulating layer. Clamping portions convenient for clamping is disposed on the sides of the graphite basic body. The uneven structure of the clamping portions is matched with the fingers of a person in order to convenient for clamping the whole graphite film with high thermal conductivity with fingers. The graphite film with high thermal conductivity is not easy to drop when installed and prevents single structure of a conventional graphite film so as to achieve beautiful appearance.
Description
Technical field
The utility model relates to heat radiation Heat Conduction Material application, relates in particular to a kind of high conductive graphite film.
Background technology
In recent years, continuous development along with electronic technology, electronic product is brought in constant renewal in and is regenerated, the size of its work package is more and more littler, speed and the efficient of work are more and more higher, and its caloric value is also increasing, therefore not only require it to be equipped with corresponding heat abstractor, to guarantee that also heat abstractor has stronger heat-sinking capability, with the reliability that guarantees properties of product with prolong its useful life.
High conductive graphite film is because its distinctive low-density (with respect to metal species) and high heat radiation conductive coefficient and low thermal resistance become the preferred material that the hyundai electronics series products solves heat radiation heat conduction technology.Then, general high conductive graphite membrane structure is more single, and no matter the side smoother in the time of on being installed in electronic product, is also to be to use clamping device by the high conductive graphite film of staff clamping, all very inconvenient, has the potential safety hazard of landing.
The utility model content
The purpose of this utility model is to overcome the defective of prior art, and a kind of simple in structure, high conductive graphite film of being convenient to clamping is provided.
The utility model is achieved in that a kind of high conductive graphite film, be installed on the cpu chip, described high conductive graphite film comprises graphite matrix, double faced adhesive tape and insulating barrier, the one side of described double faced adhesive tape is pasted with the one side of described graphite matrix, the another side of described double faced adhesive tape sticks on the described cpu chip, the another side of described graphite matrix and the one side of described insulating barrier are pasted, and described graphite matrix side is provided with the clamping part of being convenient to clamping.
Particularly, the curved shape of described clamping part.
Particularly, the size dimension of described double faced adhesive tape is corresponding with the size dimension of described insulating barrier.
Particularly, the gauge of described double faced adhesive tape is less than 0.01mm, and the gauge of described insulating barrier is less than 0.01mm.
Particularly, described graphite matrix is synthetic graphite.
Particularly, described graphite matrix is tabular.
The utility model provides a kind of high conductive graphite film, by be provided with the clamping part of being convenient to clamping at the graphite matrix side, concaveconvex structure and the finger of clamping part are complementary, make things convenient for the whole high conductive graphite film of finger gripping, when mounted, be difficult for causing landing, and avoided conventional graphite film single structure, profile is more attractive in appearance.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The high conductive graphite membrane structure figure that Fig. 1 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
As Fig. 1, the utility model embodiment provides a kind of high conductive graphite film 1, is installed on the cpu chip (not shown), and being used for the cpu chip heat radiation, can certainly be applied on other electronic product also is the scope of the utility model protection.Described high conductive graphite film 1 comprises graphite matrix 11, double faced adhesive tape 12 and insulating barrier 13, and double faced adhesive tape 12 to be being used for that whole high conductive graphite film 1 is installed in cpu chip, fixes realizing; 11 main thermolysiss of graphite matrix, insulating barrier 13 can make the graphite matrix of conduction be hedged off from the outer world; The one side of described double faced adhesive tape 12 is pasted with the one side of described graphite matrix 11, the another side of described double faced adhesive tape 12 sticks on the described cpu chip, the one side of the another side of described graphite matrix 11 and described insulating barrier 13 is pasted, and described graphite matrix 11 sides are provided with the clamping part 110 of being convenient to clamping.Clamping part 110 set concaveconvex structure and fingers are complementary, and make things convenient for the whole high conductive graphite film of finger gripping, when mounted, are difficult for causing landing, and have avoided conventional graphite film single structure, and profile is more attractive in appearance.
In concrete the application, as Fig. 1, described clamping part 110 curved shapes are complementary with finger, and particularly, described clamping part 110 is " S " type, and clamping part 110 structures are integrated with monoblock graphite matrix 11, and are simple in structure, easily manufactured, good looking appearance.
Particularly, as Fig. 1, the size dimension of described double faced adhesive tape 12 is corresponding with the size dimension of described insulating barrier 13.More specifically, the gauge of described double faced adhesive tape 12 is less than 0.01mm, and the gauge of described insulating barrier 13 is less than 0.01mm.The gauge of described insulating barrier 13 can reach 0.001mm-0.01mm; greatly reduce the thermal resistance of graphite matrix 11; improved the heat radiation thermal conductivity of graphite matrix 11; thereby both strengthened the insulating properties of graphite film, the heat of product is shed timely and effectively, better guaranteed the performance of product; prolonged the useful life of product; saved production cost, simultaneously, also can shield to graphite matrix 11.Described insulating barrier 13 is by PET(Polyethylene terephthalate, polyethylene terephthalate) material makes.
Particularly, described graphite matrix 11 is synthetic graphites, and described graphite matrix is tabular.It has good heat dissipation effect, low cost and other advantages.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (6)
1. one kind high conductive graphite film, be installed on the cpu chip, it is characterized in that, described high conductive graphite film comprises graphite matrix, double faced adhesive tape and insulating barrier, the one side of described double faced adhesive tape is pasted with the one side of described graphite matrix, the another side of described double faced adhesive tape sticks on the described cpu chip, and the another side of described graphite matrix and the one side of described insulating barrier are pasted, and described graphite matrix side is provided with the clamping part of being convenient to clamping.
2. a kind of high conductive graphite film as claimed in claim 1 is characterized in that: the curved shape of described clamping part.
3. a kind of high conductive graphite film as claimed in claim 1, it is characterized in that: the size dimension of described double faced adhesive tape is corresponding with the size dimension of described insulating barrier.
4. a kind of high conductive graphite film as claimed in claim 3, it is characterized in that: the gauge of described double faced adhesive tape is less than 0.01mm, and the gauge of described insulating barrier is less than 0.01mm.
5. a kind of high conductive graphite film as claimed in claim 1, it is characterized in that: described graphite matrix is synthetic graphite.
6. a kind of high conductive graphite film as claimed in claim 1, it is characterized in that: described graphite matrix is tabular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320140301 CN203150536U (en) | 2013-03-25 | 2013-03-25 | A graphite film with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320140301 CN203150536U (en) | 2013-03-25 | 2013-03-25 | A graphite film with high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203150536U true CN203150536U (en) | 2013-08-21 |
Family
ID=48978044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320140301 Expired - Fee Related CN203150536U (en) | 2013-03-25 | 2013-03-25 | A graphite film with high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203150536U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747652A (en) * | 2013-12-19 | 2014-04-23 | 昆山欣海韵贸易有限公司 | Glass cement packaging graphite heat-radiating fin |
| CN105109161A (en) * | 2015-08-28 | 2015-12-02 | 努比亚技术有限公司 | Mobile phone |
| CN105470218A (en) * | 2014-09-28 | 2016-04-06 | 德克萨斯仪器股份有限公司 | Integration of backside heat spreader for thermal management |
-
2013
- 2013-03-25 CN CN 201320140301 patent/CN203150536U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747652A (en) * | 2013-12-19 | 2014-04-23 | 昆山欣海韵贸易有限公司 | Glass cement packaging graphite heat-radiating fin |
| CN105470218A (en) * | 2014-09-28 | 2016-04-06 | 德克萨斯仪器股份有限公司 | Integration of backside heat spreader for thermal management |
| CN105109161A (en) * | 2015-08-28 | 2015-12-02 | 努比亚技术有限公司 | Mobile phone |
| CN105109161B (en) * | 2015-08-28 | 2018-08-14 | 努比亚技术有限公司 | Mobile phone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20150325 |
|
| EXPY | Termination of patent right or utility model |