CN203118994U

CN203118994U - Substrate device

Info

Publication number: CN203118994U
Application number: CN 201320038182
Authority: CN
Inventors: 徐向阳; 欧阳杰; 欧阳伟
Original assignee: GREAT ELECTRONICS (XIAMEN) CO Ltd; RIYUE ILLUMINATION APPLIANCES CO Ltd JIANGSE
Current assignee: GREAT ELECTRONICS (XIAMEN) CO Ltd; RIYUE ILLUMINATION APPLIANCES CO Ltd JIANGSE
Priority date: 2013-01-24
Filing date: 2013-01-24
Publication date: 2013-08-07
Anticipated expiration: 2023-01-24

Abstract

The utility model discloses a substrate device, which comprises a heat conduction layer and an FR4 or FPC plate. The FR4 or FPC plate comprises a first copper-clad plate and a second copper-clad plate. The second copper-clad plate is connected with the heat conduction layer in a welding way. The substrate device prevents problems that excessive glue for making the FR4 or FPC plate connected with the heat conduction layer leads to glue-spilling phenomena and further pollutes a heat-conducting welding disc and results in adverse heat conduction; insufficient glue adopted for glue-spilling phenomena prevention and convenient operations leads to peeling-off phenomena due to the fact that the FR4 or FPC plate is not firmly attached; meanwhile adopted glue for a bonding purpose during a using process leads to a warped FR4 or FPC plate due to the heat expansion and cold contraction phenomena; and an LED lamp is thus damaged. Furthermore, the FR4 or FPC plate itself has relatively high peel strength. The problem that the welding disc is easily peeled is solved. Meanwhile, the problem that a lead is easily welded on a circuit board is further solved. The service lifetime of the whole substrate device is thus ensured.

Description

A kind of board device

Technical field

The utility model relates to the LED application, relates to a kind of board device in particular, and it has the characteristics of long service life.

Background technology

In order to realize the application of high-powered LED lamp, the applicant painstakingly specifically please be seen a kind of LED that application for a patent for invention 201110354239.5 relates to for details and take into account the device of heat conduction and dielectric voltage withstand and be right after thereafter a kind of device of taking into account heat conduction and dielectric voltage withstand that also improved application for a patent for invention 201210075838.8 relates to.

Shown in Figure 1A to Fig. 1 D, it forms the schematic diagram of LED lighting device for utilizing FR4 plate or FPC plate 11 to link to each other with temperature-uniforming plate 12, it is that FR4 plate or FPC plate 11 are fixedly linked with temperature-uniforming plate 12 by viscose glue, on the one hand owing to have on FR4 plate or the FPC plate 11 for the hollow hole 111 that improves LED luminous element 13 heat dispersions, so when realizing that FR4 plate or FPC plate are connected with heat-conducting layer, if glue too much can occur overflowing the glue phenomenon and pollute thermal land, and causes heat conduction bad; If the glue and easy to operate that prevents from overflowing, reduce the glue use amount, what can cause FR4 plate or FPC plate 11 to be consolidated because being pasted not strongly causing sticks up the skin phenomenon.On the other hand because LED luminous element 13 meeting persistent fevers, so make viscose glue be under the environmental change of higher temperature and low temperature always, too frequent owing to expand with heat and contract with cold, FR4 plate or 11 perks of FPC plate appear easily, make FR4 plate or FPC plate 11 break away from temperature-uniforming plate 12, and can directly cause the damage of LED luminous element 13.

See also shown in Fig. 2 A to Fig. 2 D, it is that circuit layer 21 is printed directly on the temperature-uniforming plate 22, so can solve the above-mentioned problem that causes FR4 plate or FPC plate and temperature-uniforming plate 22 to break away from and damage the LED luminous element because of viscose glue.But, when with wire bonds after on the pad 23, for allow be connected between lead and the pad 23 enough firm, all need to adopt epoxide-resin glue to fix, because of variations in temperature and because epoxide-resin glue includes the ebonite acrylic, so in use can constantly pull pad 23, and finally cause pad 23 to come off, greatly reduce the useful life of whole LED lighting device.

In view of this, the inventor has this case to produce at above-mentioned defective further investigation of the prior art then.

The utility model content

The purpose of this utility model is to provide a kind of board device, troublesome poeration and because FR4 plate or the easy perk of FPC plate and pad break away from the problem that causes lack useful life easily when having production and processing to solve prior art.

In order to reach above-mentioned purpose, solution of the present utility model is:

A kind of board device comprises heat-conducting layer and FR4 plate or FPC plate, and this FR4 plate or FPC plate have the hollow hole that heat transmits for the LED luminous element directly contacts with heat-conducting layer; Wherein, this FR4 plate or FPC plate have branch and are arranged on first copper-clad plate and second copper-clad plate of both sides up and down, are printed with circuit in this first copper-clad plate, and this second copper-clad plate then is weldingly connected with heat-conducting layer.

Further, this second copper-clad plate is welded on the heat-conducting layer by tin cream.

Further, this heat-conducting layer is aluminium base, copper base or temperature-uniforming plate.

After adopting said structure, a kind of board device that the utility model relates to, it utilizes second copper-clad plate of FR4 plate or FPC plate downside directly to be welded on the heat-conducting layer, so compared with prior art, avoided causing because viscose glue expands with heat and contract with cold frequently the problem of FR4 plate or the perk of FPC plate and LED luminous element damage; Utilize the higher characteristics of self peeling force of FR4 plate or FPC plate simultaneously, can solve the problem that pad is stripped from easily, guaranteed the useful life of whole base plate device.

Description of drawings

Figure 1A is the structural representation of FR4 plate or FPC plate in the prior art;

Figure 1B is the structural representation of temperature-uniforming plate in the prior art;

The schematic diagram of Fig. 1 C when FR4 plate or FPC plate are linked together with temperature-uniforming plate employing glue;

Fig. 1 D is the schematic diagram after the LED luminous element in Fig. 1 C assembling;

Fig. 2 A is the structural representation of prior art layer printed circuit board on temperature-uniforming plate;

Fig. 2 B is the cutaway view of Fig. 2 A;

Fig. 2 C is the schematic diagram that the LED luminous element is gone up in assembling among Fig. 2 A;

Fig. 2 D is the cutaway view of Fig. 2 C;

Fig. 3 relates to a kind of structural representation of board device for the utility model;

Fig. 3 A is the cutaway view of Fig. 3;

Structural representation when Fig. 4 assembles the LED luminous element for Fig. 3;

Fig. 4 A is the cutaway view of FR4 plate or FPC plate concrete structure among Fig. 3 and Fig. 4.

Among the figure:

FR4 plate or FPC plate 11 hollow holes 111

Temperature-uniforming plate 12 LED luminous elements 13

Circuit layer 21 temperature-uniforming plates 22

Pad 23

Board device 30 heat-conducting layers 31

FR4 plate or FPC plate 32 hollow holes 321

First copper-clad plate, 322 second copper-clad plates 323

LED luminous element 33.

Embodiment

In order further to explain the technical solution of the utility model, the utility model is elaborated below by specific embodiment.

Shown in Fig. 3 and Fig. 3 A, the utility model relates to a kind of board device 30, comprise heat-conducting layer 31 and FR4 plate or FPC plate 32, this FR4 plate or FPC plate 32 have building emptying aperture 321, this building emptying aperture 321 directly contacts with heat-conducting layer 31 for LED luminous element 33, thereby the heat that makes LED luminous element 33 produce can directly be passed in the heat-conducting layer 31 rapidly, and in the present embodiment, this heat-conducting layer 31 is temperature-uniforming plate; Certainly this heat-conducting layer 31 can also adopt aluminium base or copper base.

Main improvements of the present utility model are, this FR4 plate or FPC plate 32 have branch and are arranged on first copper-clad plate 322 and second copper-clad plate 323 of both sides up and down, be printed with circuit in this first copper-clad plate 322,323 of this second copper-clad plates and heat-conducting layer 31 are weldingly connected.Particularly, this second copper-clad plate 323 is welded on the heat-conducting layer 31 by tin cream, and it is to adopt the mode of infrared reflow weldering to make second copper-clad plate 323 be fixedly linked with heat-conducting layer 31.

Like this, a kind of board device 30 that the utility model relates to, it utilizes second copper-clad plate 323 of FR4 plate or FPC plate 32 downsides directly to be welded on the heat-conducting layer 31, so compared with prior art, the utility model has avoided causing because viscose glue expands with heat and contract with cold frequently the problem of FR4 plate or 32 perks of FPC plate and 33 damages of LED luminous element on the one hand; Utilize FR4 plate or the higher characteristics of FPC plate 32 self peeling force on the other hand, can solve the problem that pad is stripped from easily, guaranteed the useful life of whole base plate device 30.

Need to prove, FR4 plate of the prior art or FPC plate 32, just have the structure of double face copper on it, so make the utility model implement very convenient, core of the present utility model is following second copper-clad plate 323 is used as weld layer, it has produced the beyond thought technique effect of those skilled in the art, overcome the technology prejudice that second copper-clad plate 323 only can be used as printed circuit, generally speaking, if only need use single-side coated copper plate also to need wherein one side is milled.

Above-described embodiment and graphic and non-limiting product form of the present utility model and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present utility model to its suitable variation or modification of doing.

Claims

1. a board device comprises heat-conducting layer and FR4 plate or FPC plate, and this FR4 plate or FPC plate have the hollow hole that heat transmits for the LED luminous element directly contacts with heat-conducting layer; It is characterized in that this FR4 plate or FPC plate have branch and be arranged on first copper-clad plate and second copper-clad plate of both sides up and down, are printed with circuit in this first copper-clad plate, this second copper-clad plate then is weldingly connected with heat-conducting layer.

2. a kind of board device as claimed in claim 1 is characterized in that, this second copper-clad plate is welded on the heat-conducting layer by tin cream.

3. a kind of board device as claimed in claim 1 is characterized in that, this heat-conducting layer is aluminium base, copper base or temperature-uniforming plate.