CN203118944U - 一种led灯的封装结构 - Google Patents

一种led灯的封装结构 Download PDF

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Publication number
CN203118944U
CN203118944U CN2013201092548U CN201320109254U CN203118944U CN 203118944 U CN203118944 U CN 203118944U CN 2013201092548 U CN2013201092548 U CN 2013201092548U CN 201320109254 U CN201320109254 U CN 201320109254U CN 203118944 U CN203118944 U CN 203118944U
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China
Prior art keywords
led
sealing structure
circuit board
lamp
utility
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Expired - Fee Related
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CN2013201092548U
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English (en)
Inventor
江向东
江浩澜
郭运昌
吴小军
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ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
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ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN2013201092548U priority Critical patent/CN203118944U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种LED灯的封装结构，包括电路板和若干颗LED芯片，其特征在于：所述的若干颗LED芯片底部涂有底胶，并通过底胶固定在电路板上，所述的若干颗LED芯片周围填充荧光胶体，所述电路板中间位置设有承接座。本实用新型具有色区色温一致，工艺简单、成本低的优点。

Description

一种LED灯的封装结构
技术领域
 本实用新型涉及一种LED灯，具体涉及一种LED灯的封装结构。
背景技术
随着国内外节能减排政策的执行，白光LED光源应用在照明领域的比例日益增大，越来越广泛。LED生产效率、色温一致性，工艺、成本、性价比方面的表现依然是关注点。而目前的LED灯在封装后色区色温无法得到一致性，从而影响着照明效果。
发明内容
本实用新型所要解决的技术问题在于提供一种色区色温一致，工艺简单、成本低的一种LED灯的封装结构。
本实用新型所要解决的技术问题采用以下技术方案来实现。
一种LED灯的封装结构，包括电路板和若干颗LED芯片，其特征在于：所述的若干颗LED芯片底部涂有底胶，并通过底胶固定在电路板上，所述的若干颗LED芯片周围填充荧光胶体，所述电路板中间位置设有承接座。
本实用新型的有益效果是：色区色温一致，工艺简单、成本低。
附图说明
图1为本实用新型结构示意图。
具体实施方式
为了使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本实用新型。
如图1所示，一种LED灯的封装结构，包括电路板1和若干颗LED芯片2，若干颗LED芯片2底部涂有底胶3，并通过底胶3固定在电路板1上，若干颗LED芯片2周围填充荧光胶体4，电路板1中间位置设有承接座5。
以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解，本实用新型不受上述实施例的限制，上述实施例和说明书中描述的只是说明本实用新型的原理，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。

Claims (1)

1.一种LED灯的封装结构，包括电路板和若干颗LED芯片，其特征在于：所述的若干颗LED芯片底部涂有底胶，并通过底胶固定在电路板上，所述的若干颗LED芯片周围填充荧光胶体，所述电路板中间位置设有承接座。
CN2013201092548U 2013-03-12 2013-03-12 一种led灯的封装结构 Expired - Fee Related CN203118944U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013201092548U CN203118944U (zh) 2013-03-12 2013-03-12 一种led灯的封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013201092548U CN203118944U (zh) 2013-03-12 2013-03-12 一种led灯的封装结构

Publications (1)

Publication Number Publication Date
CN203118944U true CN203118944U (zh) 2013-08-07

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CN2013201092548U Expired - Fee Related CN203118944U (zh) 2013-03-12 2013-03-12 一种led灯的封装结构

Country Status (1)

Country Link
CN (1) CN203118944U (zh)

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C14 Grant of patent or utility model
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130807

Termination date: 20210312

CF01 Termination of patent right due to non-payment of annual fee