CN203118916U - Wafer processing device - Google Patents
Wafer processing device Download PDFInfo
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- CN203118916U CN203118916U CN 201220750337 CN201220750337U CN203118916U CN 203118916 U CN203118916 U CN 203118916U CN 201220750337 CN201220750337 CN 201220750337 CN 201220750337 U CN201220750337 U CN 201220750337U CN 203118916 U CN203118916 U CN 203118916U
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- groove lid
- gathering sill
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Abstract
The utility model discloses a wafer processing device, which is characterized by comprising a processing slot and a gripping and lifting device, wherein the processing slot is provided with an accommodating cavity which can be sealed, and the accommodating cavity is used for containing a treatment fluid so as to carry out treatment on a wafer; and the gripping and lifting device is arranged at one side of the processing slot, and used for conveying the wafer to the accommodating cavity of the processing slot. The wafer processing device disclosed by the utility model realizes automatic operation of a series of procedures through combining the gripping and lifting device with the processing slot, greatly improves the work efficiency, saves the labor cost, and improves the qualified rate of production.
Description
Technical field
The utility model relates to a kind of wafer-process device, particularly a kind of self-action wafer-process device.
Background technology
In the wafer production process, need carry out PROCESS FOR TREATMENT such as wetting, plating, etching.Crystal column surface can form blind hole.Easy stored-gas in the blind hole of crystal column surface.Directly put into electroplate liquid if will have the wafer of blind hole, then remaining gas can stop electroplate liquid to enter in the blind hole in the blind hole.Because the blind hole size is less, and the electroplate liquid surface tension is big, also can cause electroplate liquid to be difficult to enter in the blind hole.Can't electroplate in the blind hole of wafer, then can have a strong impact on the wafer electroplating quality.Therefore, for improving electroplating quality, wafer need be vacuumized to remove the gas in the blind hole, and fountain solution is entered in the blind hole.Fountain solution in the blind hole helps the electroplate liquid material to enter in the blind hole, improves the wafer electroplating quality.
And in the prior art, the series of processes of wafer-process device all needs manual operation, can reduce production efficiency on the one hand, improves production cost, also can cause the damage of wafer on the other hand because manual operation is improper, reduces the production qualification rate.Simultaneously, because manual operation causes wafer-process device requisite space big, space availability ratio is low.Manually-operated another drawback is that labour intensity is big, and efficient is low, can't satisfy the needs of large-scale production.Manual operation also can cause workman's contact plating liquid and to endanger the workman healthy.
The utility model content
The purpose of this utility model is in order to overcome deficiency of the prior art, a kind of wafer-process device easy to use to be provided.
For realizing above purpose, the utility model is achieved through the following technical solutions:
The wafer-process device is characterized in that, comprising:
Treatment trough, described treatment trough is provided with sealable cavity volume, and described cavity volume is used for holding treatment fluid so that wafer is handled;
Grasp lowering or hoisting gear, described extracting lowering or hoisting gear is arranged on described treatment trough one side, is used for wafer is transported in the cavity volume of described treatment trough.
Preferably, described wafer-process device also comprises be used to the wafer storage tank of depositing wafer.
Preferably, described extracting lowering or hoisting gear comprises grabbing device and lowering or hoisting gear; Described grabbing device is connected with lowering or hoisting gear, is used for grasping described wafer storage tank; Described lowering or hoisting gear liftably arranges, and is used for driving described grabbing device and carries out elevating movement.
Preferably, described lowering or hoisting gear comprises:
Fixing base;
Lifting drive, described elevator drive machine is arranged on the fixing base, is used for providing the lifting actuating force;
Transmission device, described transmission device are used for transmitting the lifting actuating force;
Described lifting drive and described grabbing device are in transmission connection by transmission device, and lifting drive is by the lifting of actuator drives grabbing device.
Preferably, described lowering or hoisting gear also comprises for the guider that leads when the grabbing device lifting; Described guider is connected with grabbing device with fixing base.
Preferably, described guider comprises guide rail and slide block, and described slide block is arranged on the guide rail and can be along lifting rail; Described guide rail is installed on the fixing base, and described slide block is connected with transmission device with grabbing device and is connected.
Preferably, described number may is two, and slide block is two; A slide block is set on each guide rail, and two slide blocks all are connected with lifting base; Lifting base is connected with transmission device.
Preferably, described lowering or hoisting gear also comprises the induction stopping means, and described induction stopping means is arranged on the described fixing base, is used for the described grabbing device of induction and whether arrives assigned address, and send the signal of telecommunication after grabbing device arrives assigned address.
Preferably, described lifting drive is motor.
Preferably, described transmission device be among driving-belt, driving-chain, travelling gear, the feed screw nut any one.
Preferably, described grabbing device comprises two handgrips, and described two handgrips can move or opposing setting movably in opposite directions; The described wafer storage tank of clamping when described two handgrips move in opposite directions.
Preferably, described grabbing device also comprises the extracting drive unit, and described extracting drive unit is connected with at least one described handgrip, drives at least one reciprocating motion.
Preferably, described extracting drive unit is first cylinder; Described first cylinder is provided with the first piston bar; At least one described handgrip is connected with the piston rod of described first cylinder.
Preferably, described at least one handgrip is provided with holding tank, and described holding tank is towards another handgrip.
Preferably, the sidewall of described holding tank is provided with first guiding surface; Described crystal storage tank is provided with second guiding surface; Described first guiding surface is corresponding with described second guiding surface.
Preferably, described treatment trough comprises cell body and groove lid; Described cell body is provided with cavity volume; Described groove lid is arranged on described cell body upper end cover residence and states cavity volume and can arrange movably with respect to described cell body; Open described cavity volume after described groove lid is mobile.
Preferably, described groove lid can move and turning being arranged on the cell body with respect to cell body.
Preferably, described treatment trough also comprises guider, and described guider is provided with for the gathering sill that limits groove lid moving direction; Described groove cover back-end is arranged by gathering sill restriction moving rail slash.
Preferably, described groove cover back-end is provided with guide post, and described guide post one end is connected with the groove lid, and the other end is positioned at described gathering sill and can arranges movably along gathering sill.
Preferably, the described guide post other end is provided with clutch shaft bearing, and described clutch shaft bearing is arranged in the described gathering sill and can rollably arranges along described gathering sill.
Preferably, also comprise groove lid drive unit, described groove lid drive unit and described groove lid are in transmission connection by transmission device, drive described groove lid and move along the track that limits with respect to described cell body.
Preferably, the actuating force of described groove lid drive unit output rectilinear direction, described transmission device can be converted to linear drives power the described groove lid of promotion and arrange movably along curvilinear path.
Preferably, described drive unit is connected with described groove lid by connecting rod; Described connecting rod one end is rotatably installed on the cell body, and the other end is connected with described groove lid front end; Described drive unit is connected between the described connecting rod two ends, drives described connecting rod and rotates.
Preferably, the described connecting rod other end is connected rotationally with described groove lid front end.
Preferably, described groove lid front end is provided with the cylindrical bar that protrudes from the groove lid; Described connecting rod is connected by second bearing rotationally with described cylindrical bar.
Preferably, described gathering sill restriction groove lid moves in the cell body one side process and arranges turningly.
Preferably, described gathering sill comprises horizontal guide slot and vertical gathering sill, and described vertical gathering sill stretches downwards perpendicular to described processing cell body opening surface; Described horizontal guide slot is communicated with by deep-slotted chip breaker with vertical gathering sill.
Preferably, described groove lid drive unit is second cylinder.
Preferably, described wafer storage tank is provided with the extracting handle, and described extracting handle top is provided with card-bit part, and described card-bit part along continuous straight runs is given prominence to described extracting handle top.
Preferably, described extracting handle is provided with second guiding surface.
Wafer-process device in the utility model has been realized the automatic operating of series of processes having promoted operating efficiency greatly by the combination of grasping lowering or hoisting gear and treatment trough, has saved cost of labor, has improved the production qualification rate.Grasp lowering or hoisting gear and cooperate running by grabbing device and lowering or hoisting gear, having avoided transporting the wafer that causes because manual operation is improper in the process at wafer damages, improved production efficiency and production qualification rate, the while has also eliminated workman's contact plating liquid in the manual operation and has endangered the healthy possibility of workman; Wherein, grabbing device is more stable than manual operation, has improved production stability; Lowering or hoisting gear can be converted to vertical space by the horizontal space that manual operation is shared, has dwindled the production usage space, has improved the space availability ratio of process units greatly.Treatment trough adopts driver promotion connecting rod to drive the groove lid, and the cell body circumference is opened or closure along handling, replaced high-intensity manual operation, operating efficiency and production qualification rate have been improved, simultaneously after the groove lid is opened fully, the parallel external side for the treatment of trough that is placed on treatment tank wall, dwindled because of the groove lid and opened the vertical space that takies, improved the space availability ratio of process units greatly.
Description of drawings
Fig. 1 is wafer-process device perspective view of the present utility model.
Fig. 2 is the extracting lowering or hoisting gear perspective view in the utility model.
Fig. 3 is the lowering or hoisting gear perspective view in the utility model.
Fig. 4 is the grabbing device open configuration perspective view in the utility model.
Fig. 5 is the grabbing device closure state perspective view in the utility model.
Fig. 6 is the grabbing device handgrip perspective view in the utility model.
Fig. 7 is the treatment trough closure state perspective view in the utility model.
Fig. 8 is the treatment trough closure state schematic side view in the utility model.
Fig. 9 is the treatment trough open mode perspective view in the utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail:
As shown in Figure 1, the wafer-process device comprises and grasps lowering or hoisting gear 2 and treatment trough 3; Treatment trough 3 is provided with sealable cavity volume 311, and described cavity volume is used for holding treatment fluid so that wafer is handled; Grasp the side that lowering or hoisting gear 2 is arranged on treatment trough 3, be used for wafer is transported to cavity volume 311 inside.
As shown in Figure 1, the wafer-process device also comprises wafer storage tank 1, is used for depositing wafer, realizes that wafer carries out batch process.
As shown in Figure 2, be the extracting lowering or hoisting gear 2 of wafer-process device, comprise lowering or hoisting gear 21 and grabbing device 22; Grabbing device 22 is connected with lowering or hoisting gear 21, and lowering or hoisting gear 21 is done the liftable setting, and drive grabbing device 22 moves up and down.
As shown in Figure 3, be the lowering or hoisting gear 21 of wafer-process device, comprise fixing base 218, transmission device 212 and lifting drive 211; Lifting drive 211 is arranged on the fixing base 218, is used for providing the lifting actuating force; Transmission device 212 is in transmission connection lifting drive 211 and grabbing device 22, is used for driving grabbing device and moves up and down.Wherein, drive unit 211 is motor, and transmission device 212 is driving-belt, and driving-belt one end is connected with motor, and the other end is connected with the fixed pulley 214 that is arranged on fixing base 218, by the transmission of motor-driven driving-belt.Transmission device also can select for use driving-chain, travelling gear or feed screw nut to play gearing.
As shown in Figure 3, lowering or hoisting gear 21 also comprises guider, comprises guide rail 215 and slide block 219, and slide block 219 is arranged on the guide rail 215 and can be along guide rail 215 liftings; Described guide rail 215 is installed on the fixing base 218, and slide block 219 is connected with grabbing device 22 and is connected with transmission device 212.Its middle guide 215 quantity are two, be symmetricly set on the fixing base 218, each guide rail 215 is provided with a slide block 219, and two slide blocks 219 all are connected with lifting base 213, lifting base 213 is connected with transmission device 212 by anchor clamps 216, when the 212 lifting transmissions of lifting drive 211 drive transmissions, lifting base 213 is followed transmission device 212 and is moved up and down together.
As shown in Figure 3, lowering or hoisting gear 21 also comprises induction stopping means 217, and induction stopping means 217 is arranged on the fixing base 218, and is in the below of lifting base 213, is used for induction lifting base 213 and whether arrives assigned address.Wherein, the induction stopping means is laser range sensor, its Laser emission mouth is concordant with treatment trough 3 edge of opening levels, move up and down in the process at lifting base 213, measure the vertical distance of lifting base 215 and treatment trough 3 edge of opening in real time, when lifting base 213 liftings during to assigned address, send the signal of telecommunication to the control centre of wafer-process device, make lifting drive 211 stop to drive, thereby avoid lifting base 213 in lifting process, to bump with other devices, or getaway 215.
As shown in Figure 4, be the grabbing device 22 of wafer-process device, comprise that 224, two handgrips 224 of two handgrips can move or opposing movement in opposite directions, and clamping wafer storage tank 1 when moving in opposite directions.
As shown in Figure 4, grabbing device 22 also comprises extracting drive unit 222; Grasp drive unit 222 and be connected with handgrip 224, the opening and closing actuating force of handgrip 224 is provided.
As Fig. 4, shown in Figure 5, grasping drive unit 222 is first double-acting cylinder, and being provided with two-way ram bar 223, two-way ram bar 223 is connected with a handgrip 223 at least, does mobile in opposite directions or opposing movement by the flexible drive handgrip 224 of piston rod 223.
As shown in Figure 3, double-acting cylinder 222 is fixed on to be hung on the arm 221, hang arm 221 and be connected with lifting base 213, thereby realization grabbing device 22 is followed lowering or hoisting gear 21 and is moved up and down.
As Fig. 4, shown in Figure 6, handgrip 224 is provided with holding tank, and the holding tank of two handgrips 224 is oppositely arranged, and handgrip 224 is provided with first guiding surface 2241 at the holding tank sidewall; Crystal storage tank 1 is provided with second guiding surface 111 corresponding with first guiding surface 2241, guarantees that handgrip 224 stablizes grasping silicon wafer storage tank 1 when closure.
As Fig. 7, shown in Figure 9, be the treatment trough 3 of wafer-process device, treatment trough 3 comprises cell body 31 and groove lid 32; Cell body 31 is provided with cavity volume 311; Groove lid 32 is arranged on cell body 31 upper ends and covers cavity volume 311 and can arrange movably with respect to cell body 31; After moving, groove lid 32 opens cavity volume 311; Wherein, groove lid 32 is done movement in a curve with respect to handling cell body 31, and when opening cavity volume 311 fully, groove lid 32 is placed on cell body 31 outsides with cell body 31 parallel sidewalls.
As Fig. 7, shown in Figure 9, treatment trough 3 also comprises guider 34, and guider 34 is provided with for limiting the gathering sill 341 that groove covers 32 moving directions; Described groove covers 32 rear ends and moves along gathering sill 341.Groove covers 32 rear ends and is provided with guide post 322, and guide post 322 1 ends are connected with groove lid 32, and the other end is positioned at gathering sill 341 and can moves along gathering sill.Guide post 322 other ends are provided with clutch shaft bearing 352, and clutch shaft bearing 352 is arranged in the gathering sill 341, and can roll along gathering sill 341.Wherein, clutch shaft bearing 352 is rolling bearing.Gathering sill 341 comprises horizontal guide slot 3411, deep-slotted chip breaker 3413 and vertical gathering sill 3412.Horizontal guide slot 3411 and vertical gathering sill 3412 are communicated with by deep-slotted chip breaker 3413.Vertically gathering sill 3412 is perpendicular to plane, cell body 31 cavity volumes, 311 opening place and stretching, extension downwards.
As shown in Figure 8, treatment trough 3 also comprises groove lid drive unit 35, and groove lid drive unit 35 and 32 grooves lid are in transmission connection by transmission device 33, and driver slot lid 32 moves along the track that limits with respect to cell body 31.The actuating force F of groove lid drive unit 35 output rectilinear directions, transmission device 33 can be converted to linear drives power F and promote the actuating force that groove lid 32 moves along curvilinear path.Wherein, groove lid drive unit 35 is second double-acting cylinder.
As Fig. 7, shown in Figure 8, linkage 33 is connecting rod 33, and groove lid drive unit 35 is connected with groove lid 32 by connecting rod 33; Connecting rod 33 1 ends are rotatably installed on the cell body 31, and the other end covers 32 front ends with groove and is connected; Groove lid drive unit 35 is connected between 33 connecting rod ends A, the B, and drive link 33 is rotated.Groove covers 32 front ends and is provided with the cylindrical bar 321 that protrudes from the groove lid, and connecting rod 33 is connected by second bearing 331 rotationally with cylindrical bar 321; Cell body 31 lateral walls are provided with bearing spider 333, and connecting rod 33 is connected by the 3rd bearing 332 rotationally with cell body 31.Wherein, second bearing 331 and the 3rd bearing 332 are rolling bearing.
As Fig. 8, shown in Figure 9, when groove lid drive unit 35 was exported the actuating force F of rectilinear directions, transmission device 33 can be converted to linear drives power F and promote the actuating force that groove lid 32 moves along the track of gathering sill 341 in the guider 34.Groove lid 32 is subjected to gathering sill 341 restrictions and overturns in cell body one side shifting process.When groove lid 32 cavity volumes 311 that move to cell body 31 were opened fully, groove lid 32 turned over and turn 90 degrees back and vertical gathering sill 3412 parallel cell body 31 1 sides that are positioned at.
As shown in Figure 5, wafer storage tank 1 is provided with and grasps handle 11, the top of grasping handle 11 is provided with card-bit part 12, outstanding handle 11 top that grasp of card-bit part 12 along continuous straight runs, when handgrip 224 closures are caught extracting handle 11, card-bit part 12 edges are held up by handgrip 224 tops, have avoided handgrip 224 and have grasped the relative slip of generation between the handle 11.Wherein, grasp handle 11 and be provided with second guiding surface 111.
Pending wafer is placed in the wafer storage tank 1, transport tape by automatic production line is transferred to treatment trough 3 tops in the wafer-process device, by the extracting handle 11 on the handgrip 224 grasping silicon wafer storage tanks 1 of grabbing device 22, handgrip 224 with grasp handle 11 on be respectively equipped with the first corresponding guiding surface 2241 and second guiding surface 111, make handgrip 224 when grasping silicon wafer storage tank 1, can steady closure, guaranteed the stability of wafer.Behind the grabbing device 22 grasping silicon wafer storing units 1, drive grabbing device 22 by lowering or hoisting gear 21 and do descending motion, and by responding to cavity volume 311 bottoms whether stop 217 induction wafer storage tanks drop to processing cell body 31, if arrive, induction stop 217 sends the signal of telecommunication to treatment trough control centre, the order lifting drive stops to drive, and has so just avoided wafer storage tank 1 to bump with other devices in the decline process and has caused damage; After wafer storage tank 1 was down to cavity volume 311 bottoms safely, handgrip 224 opened to break away from and grasps handle 11, and lowering or hoisting gear 21 drives grabbing device 22 and rises to wafer-process device top.After grabbing device 22 rises to wafer-process device top, groove lid drive unit 35 drive link 33 for the treatment of trough 3 are inwardly rotated, the groove lid placed with cell body 31 parallel sidewalls 32 is moved along gathering sill 341 circumference, the opening of closed cavity volume 311, encapsulation process cell body 31, and begin wafer is handled; After treating that wafer-process finishes, groove lid drive unit 35 drive link 33 are outwards rotated, thereby driving groove lid 32 moves along gathering sill 341 circumference, finally open cavity volume 311 openings, and make groove lid 32 be positioned over cell body 31 outsides with cell body 31 parallel sidewalls, save the vertical space that takies when groove lid 32 is opened, improved the space availability ratio of wafer-process device; Simultaneously, the junction of connecting rod and groove lid 32, cell body 31 and groove lid 32 are equipped with rolling bearing with the junction of gathering sill 341, make groove lid 32 resistance in the process of open closed reduce, and it is more unobstructed to move, improve operating efficiency, prolonged the useful life for the treatment of trough 3.After container 311 was opened fully, lowering or hoisting gear 21 drove grabbing device 22 again and descends and grasping silicon wafer storage tank 1, the wafer that disposes is lifted out cavity volume 311, and transfers to next process by the transport tape of automatic production line.A work period to this wafer-process device finishes, and enters next work period automatically.
Embodiment in the utility model only is used for the utility model is described, and does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in the utility model protection range.
Claims (30)
1. the wafer-process device is characterized in that, comprising:
Treatment trough, described treatment trough is provided with sealable cavity volume, and described cavity volume is used for holding treatment fluid so that wafer is handled;
Grasp lowering or hoisting gear, described extracting lowering or hoisting gear is arranged on described treatment trough one side, is used for wafer is transported in the cavity volume of described treatment trough.
2. wafer-process device according to claim 1 is characterized in that, described wafer-process device also comprises be used to the wafer storage tank of depositing wafer.
3. wafer-process device according to claim 2 is characterized in that, described extracting lowering or hoisting gear comprises grabbing device and lowering or hoisting gear; Described grabbing device is connected with lowering or hoisting gear, is used for grasping described wafer storage tank; Described lowering or hoisting gear liftably arranges, and is used for driving described grabbing device and carries out elevating movement.
4. wafer-process device according to claim 3 is characterized in that, described lowering or hoisting gear comprises:
Fixing base;
Lifting drive, described elevator drive machine is arranged on the fixing base, is used for providing the lifting actuating force;
Transmission device, described transmission device are used for transmitting the lifting actuating force;
Described lifting drive and described grabbing device are in transmission connection by transmission device, and lifting drive is by the lifting of actuator drives grabbing device.
5. wafer-process device according to claim 4 is characterized in that, described lowering or hoisting gear also comprises for the guider that leads when the grabbing device lifting; Described guider is connected with grabbing device with fixing base.
6. wafer-process device according to claim 5 is characterized in that, described guider comprises guide rail and slide block, and described slide block is arranged on the guide rail and can be along lifting rail; Described guide rail is installed on the fixing base, and described slide block is connected with transmission device with grabbing device and is connected.
7. wafer-process device according to claim 5 is characterized in that, described number may is two, and slide block is two; A slide block is set on each guide rail, and two slide blocks all are connected with lifting base; Lifting base is connected with transmission device.
8. wafer-process device according to claim 4, it is characterized in that, described lowering or hoisting gear also comprises the induction stopping means, described induction stopping means is arranged on the described fixing base, be used for the described grabbing device of induction and whether arrive assigned address, and after described grabbing device arrives assigned address, send the signal of telecommunication.
9. wafer-process device according to claim 4 is characterized in that, described lifting drive is motor.
10. wafer-process device according to claim 4 is characterized in that, described transmission device be among driving-belt, driving-chain, travelling gear, the feed screw nut any one.
11. wafer-process device according to claim 3 is characterized in that, described grabbing device comprises two handgrips, and described two handgrips can move or opposing setting movably in opposite directions; The described wafer storage tank of clamping when described two handgrips move in opposite directions.
12. wafer-process device according to claim 11 is characterized in that described grabbing device also comprises the extracting drive unit, described extracting drive unit is connected with at least one described handgrip, drives at least one reciprocating motion.
13. wafer-process device according to claim 12 is characterized in that, described extracting drive unit is first cylinder; Described first cylinder is provided with the first piston bar; At least one described handgrip is connected with the piston rod of described first cylinder.
14. wafer-process device according to claim 11 is characterized in that, described at least one handgrip is provided with holding tank, and described holding tank is towards another handgrip.
15. wafer-process device according to claim 14 is characterized in that the sidewall of described holding tank is provided with first guiding surface; Described crystal storage tank is provided with second guiding surface; Described first guiding surface is corresponding with described second guiding surface.
16. wafer-process device according to claim 3 is characterized in that, described treatment trough comprises cell body and groove lid; Described cell body is provided with cavity volume; Described groove lid is arranged on described cell body upper end cover residence and states cavity volume and can arrange movably with respect to described cell body; Open described cavity volume after described groove lid is mobile.
17. wafer-process device according to claim 16 is characterized in that, described groove lid can move and turning being arranged on the cell body with respect to cell body.
18. wafer-process device according to claim 17 is characterized in that described treatment trough also comprises guider, described guider is provided with for the gathering sill that limits groove lid moving direction; Described groove cover back-end is arranged by gathering sill restriction moving rail slash.
19. wafer-process device according to claim 18 is characterized in that, described groove cover back-end is provided with guide post, and described guide post one end is connected with the groove lid, and the other end is positioned at described gathering sill and can arranges movably along gathering sill.
20. wafer-process device according to claim 19 is characterized in that, the described guide post other end is provided with clutch shaft bearing, and described clutch shaft bearing is arranged in the described gathering sill and can rollably arranges along described gathering sill.
21. wafer-process device according to claim 17 is characterized in that, also comprises groove lid drive unit, described groove lid drive unit and described groove lid are in transmission connection by transmission device, drive described groove lid and move along the track that limits with respect to described cell body.
22. wafer-process device according to claim 21 is characterized in that, the actuating force of described groove lid drive unit output rectilinear direction, and described transmission device can be converted to linear drives power the described groove lid of promotion and arrange movably along curvilinear path.
23. wafer-process device according to claim 22 is characterized in that, described drive unit is connected with described groove lid by connecting rod; Described connecting rod one end is rotatably installed on the cell body, and the other end is connected with described groove lid front end; Described drive unit is connected between the described connecting rod two ends, drives described connecting rod and rotates.
24. wafer-process device according to claim 23 is characterized in that, the described connecting rod other end is connected rotationally with described groove lid front end.
25. wafer-process device according to claim 24 is characterized in that, described groove lid front end is provided with the cylindrical bar that protrudes from the groove lid; Described connecting rod is connected by second bearing rotationally with described cylindrical bar.
26. wafer-process device according to claim 22 is characterized in that, described gathering sill restriction groove lid moves in the cell body one side process and arranges turningly.
27. wafer-process device according to claim 26 is characterized in that, described gathering sill comprises horizontal guide slot and vertical gathering sill, and described vertical gathering sill stretches downwards perpendicular to described processing cell body opening surface; Described horizontal guide slot is communicated with by deep-slotted chip breaker with vertical gathering sill.
28. wafer-process device according to claim 21 is characterized in that, described groove lid drive unit is second cylinder.
29. wafer-process device according to claim 2 is characterized in that, described wafer storage tank is provided with the extracting handle, and described extracting handle top is provided with card-bit part, and described card-bit part along continuous straight runs is given prominence to described extracting handle top.
30. wafer-process device according to claim 29 is characterized in that, described extracting handle is provided with second guiding surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220750337 CN203118916U (en) | 2012-12-31 | 2012-12-31 | Wafer processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220750337 CN203118916U (en) | 2012-12-31 | 2012-12-31 | Wafer processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203118916U true CN203118916U (en) | 2013-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220750337 Expired - Lifetime CN203118916U (en) | 2012-12-31 | 2012-12-31 | Wafer processing device |
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| CN (1) | CN203118916U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN104600002A (en) * | 2013-10-31 | 2015-05-06 | 细美事有限公司 | Substrate treating apparatus, drive assembly, and drive member controlling method |
| CN107452660A (en) * | 2017-07-26 | 2017-12-08 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
| CN107481961A (en) * | 2017-08-22 | 2017-12-15 | 华进半导体封装先导技术研发中心有限公司 | A kind of cup devices of one chip cleaning equipment |
| CN107968060A (en) * | 2017-11-21 | 2018-04-27 | 长江存储科技有限责任公司 | Reactive tank for wafer etching |
-
2012
- 2012-12-31 CN CN 201220750337 patent/CN203118916U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN103046097B (en) * | 2012-12-31 | 2016-08-03 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN104600002A (en) * | 2013-10-31 | 2015-05-06 | 细美事有限公司 | Substrate treating apparatus, drive assembly, and drive member controlling method |
| US9915261B2 (en) | 2013-10-31 | 2018-03-13 | Semes Co., Ltd. | Substrate treating apparatus, drive assembly, and drive member controlling method |
| CN107452660A (en) * | 2017-07-26 | 2017-12-08 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
| CN107452660B (en) * | 2017-07-26 | 2018-07-03 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
| CN107481961A (en) * | 2017-08-22 | 2017-12-15 | 华进半导体封装先导技术研发中心有限公司 | A kind of cup devices of one chip cleaning equipment |
| CN107968060A (en) * | 2017-11-21 | 2018-04-27 | 长江存储科技有限责任公司 | Reactive tank for wafer etching |
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Effective date of registration: 20170915 Address after: 201616 Shanghai city Songjiang District Sixian Road No. 3600 Building No. 10 West 1 floor Patentee after: XINYANG GUIMI (SHANGHAI) SEMICONDUCTOR TECHNOLOGY CO.,LTD. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3600 Patentee before: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS Co.,Ltd. |
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