CN107481961A - A kind of cup devices of one chip cleaning equipment - Google Patents
A kind of cup devices of one chip cleaning equipment Download PDFInfo
- Publication number
- CN107481961A CN107481961A CN201710725163.XA CN201710725163A CN107481961A CN 107481961 A CN107481961 A CN 107481961A CN 201710725163 A CN201710725163 A CN 201710725163A CN 107481961 A CN107481961 A CN 107481961A
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- CN
- China
- Prior art keywords
- cup
- lowering
- movable part
- wafer
- cup bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a kind of cup devices of one chip cleaning equipment, including cup bodies, cup bodies include movable part, fixed part and lowering or hoisting gear;Movable part is arranged in a part for the side of cup bodies, is moved under the driving of the lowering or hoisting gear, wafer is transferred into and out to the cavity of cup bodies;Fixed part is arranged in another part of the side of cup bodies, and fixed part forms the complete side of cup bodies with movable part.Technical scheme provided by the invention can fully be cleaned to wafer, can reduce unit frequency of delaying, and lift the production efficiency of board.
Description
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of cup devices of one chip cleaning equipment.
Background technology
With the development of semiconductor fabrication process, the characteristic size of semiconductor devices is less and less, for semiconductor structure
Cleaning it is more and more important, if it can not be made fully to be cleaned, it will have influence on the structure and performance of device.It is existing clear
Wash equipment cup devices in the process of running, can be run due to elevating lever inconsistent, cause board frequently to be delayed machine.Existing cleaning machine
The motion of cup devices by multiple cylinder elevating levers (typically by 3 or 3 with upper cylinder lifter group into) while moved up and down
Into, it is mass motion.If there is abnormal, whole device overall operation failure in one of elevating lever.
The content of the invention
In view of above-mentioned analysis, the present invention proposes a kind of cup devices of one chip cleaning equipment, to be filled to wafer
Distinguish during washing, reduce the unit frequency of delaying of board, improve the production efficiency of board.
To achieve the above object, the present invention adopts the following technical scheme that:
The present invention proposes a kind of cup devices of one chip cleaning equipment, including cup bodies, and the cup bodies include can
Move portion, fixed part and lowering or hoisting gear;The movable part is arranged in a part for the side of the cup bodies, described
Moved under the driving of lowering or hoisting gear, wafer is transferred into and out to the cavity of the cup bodies;The fixed part is arranged at
In another part of the side of the cup bodies, the fixed part forms the complete side of the cup bodies with the movable part
Face.
As a preferred embodiment, the size of the movable part is more than the size of wafer.
As a preferred embodiment, the quantity of the lowering or hoisting gear is one, the movable part is arranged at
At upper edge.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is one, the cup is passed in wafer
Before the cavity of body, the lowering or hoisting gear drives the movable part to rise;Before the cavity that wafer spreads out of the cup bodies,
The lowering or hoisting gear drives the movable part to decline.
As a preferred embodiment, the quantity of the lowering or hoisting gear is two, the movable part is arranged at
At lower edge, and it is separated by a pre-determined distance between two lowering or hoisting gears.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is two, the cup is passed in wafer
Before the cavity of body, the lowering or hoisting gear drives the movable part to decline;Before the cavity that wafer spreads out of the cup bodies,
The lowering or hoisting gear drives the movable part to rise.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is two, the cup is passed in wafer
Before the cavity of body, the lowering or hoisting gear drives the movable part to rise;Before the cavity that wafer spreads out of the cup bodies,
The lowering or hoisting gear drives the movable part to decline.
Technical solution of the present invention has the following advantages that:
The invention provides a kind of cup devices of one chip cleaning equipment, including cup bodies, cup bodies include removable
Portion, fixed part and lowering or hoisting gear;Movable part is arranged in a part for the side of cup bodies, in the drive of the lowering or hoisting gear
Moved under dynamic, wafer is transferred into and out to the cavity of cup bodies;Fixed part is arranged at the another of the side of cup bodies
In part, fixed part forms the complete side of cup bodies with movable part.Above-mentioned technical proposal provided by the invention, can be right
Wafer is fully cleaned, and reduces unit frequency of delaying, and lifts the production efficiency of board.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of a specific example of the cup devices of one chip cleaning equipment in the embodiment of the present invention;
Fig. 2 is the schematic diagram of another specific example of the cup devices of one chip cleaning equipment in the embodiment of the present invention.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to which the orientation of the instruction such as explanation, term " on ", " under " or position relationship are base
In orientation shown in the drawings or position relationship, description description of the invention and simplified, rather than instruction or hint are for only for ease of
Signified device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The limitation of invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It is be combined with each other into conflict can.
The embodiments of the invention provide a kind of cup of one chip cleaning equipment (cup cover) device, as shown in figure 1, including cup
Body, the cup bodies include movable part 1, fixed part 2 and lowering or hoisting gear 3;Movable part 1 is arranged at the side of above-mentioned cup bodies
In the part in face, moved under the driving of lowering or hoisting gear 3, wafer is transferred into and out to the cavity of above-mentioned cup bodies;
Fixed part 2 is arranged in another part of the side of above-mentioned cup bodies, and fixed part 2 forms above-mentioned cup bodies with movable part 1
Complete side.The cup devices of one chip cleaning equipment provided in an embodiment of the present invention, wafer can fully be cleaned,
Reduction is delayed unit frequency, lifts the production efficiency of board.
As a preferred embodiment, the size of above-mentioned movable part 1 is more than the size of wafer, it is easy to wafer to be passed to
Or the cavity of the above-mentioned cup bodies of outflow.
As a preferred embodiment, as shown in figure 1, the quantity of above-mentioned lowering or hoisting gear 3 be one, be arranged at above-mentioned
At the upper edge of movable part 1.
When the quantity of lowering or hoisting gear 3 is one, before wafer is passed to the cavity of above-mentioned cup bodies, lowering or hoisting gear 3 drives
Movable part 1 rises, and wafer is passed to the cavity of above-mentioned cup bodies, and wafer, lowering or hoisting gear 3 are fixed by vacuum or press claw device
Driving movable part 1 declines, and fixation portions is 2-in-1 is integrated, and cleaning is carried out to wafer.In technical process, cleaning is brilliant
Chemical liquids used in circle in the cavity of above-mentioned cup bodies, avoid dirt of the chemical liquids to other devices of wafer periphery by beam
Dye.After the completion of cleaning, above-mentioned lowering or hoisting gear 3 drives movable part 1 to rise, and wafer is spread out of the cavity of above-mentioned cup bodies,
Complete a wafer cleaning process cycle.
As a preferred embodiment, as shown in Fig. 2 the quantity of above-mentioned lowering or hoisting gear 3 be two, be arranged at removable
At the lower edge in dynamic portion 1, and it is separated by a pre-determined distance between two above-mentioned lowering or hoisting gears 3.
When the quantity of lowering or hoisting gear 3 is two, before wafer is passed to the cavity of above-mentioned cup bodies, lowering or hoisting gear 3 drives
Movable part 1 is risen or fallen, and wafer is passed to the cavity of above-mentioned cup bodies, and wafer, lifting are fixed by vacuum or press claw device
Device 3 drives movable part down or up, and fixation portions is 2-in-1 is integrated, and cleaning is carried out to wafer.Technical process
In, the chemical liquids used in cleaning wafer in the cavity of above-mentioned cup bodies, avoid chemical liquids to other dresses of wafer periphery by beam
The pollution put.After the completion of cleaning, above-mentioned lowering or hoisting gear 3 drives movable part 1 to rise or fall, and makes wafer outflow above-mentioned
The cavity of cup bodies, complete a wafer cleaning process cycle.
The motion of the cup devices of existing one chip cleaning equipment by multiple cylinder elevating levers (typically by 3 or 3 with
On) move up and down simultaneously, it is mass motion.When exception occurs in one of cylinder elevating lever, it may appear that because cylinder lifts
Bar operation is inconsistent to cause board frequently to be delayed the situation of machine, and so as to cause whole device operational failure, board can not be run.This hair
The cup devices for the one chip cleaning equipment that bright embodiment provides are filled compared with above-mentioned prior art using one or two lifting
The movable part 1 of 3 driving cup bodies is put, reduces the quantity of lowering or hoisting gear 3, so as to reduce the unit frequency of delaying of board, is improved
The production efficiency of board.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (7)
1. a kind of cup devices of one chip cleaning equipment, it is characterised in that including cup bodies, the cup bodies include removable
Dynamic portion (1), fixed part (2) and lowering or hoisting gear (3);
In a part for the side that the movable part (1) is arranged at the cup bodies, the driving in the lowering or hoisting gear (3)
Under move, wafer is transferred into and out to the cavity of the cup bodies;
In the another part for the side that the fixed part (2) is arranged at the cup bodies, the fixed part (2) with it is described removable
Dynamic portion (1) forms the complete side of the cup bodies.
2. cup devices according to claim 1, it is characterised in that the size of the movable part (1) is more than the chi of wafer
It is very little.
3. cup devices according to claim 1 or 2, it is characterised in that the quantity of the lowering or hoisting gear (3) is one, if
It is placed at the upper edge of the movable part (1).
4. cup devices according to claim 3, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute
Stating lowering or hoisting gear (3) drives the movable part (1) to rise;Before the cavity that wafer spreads out of the cup bodies, the lifting dress
Putting (3) drives the movable part (1) to decline.
5. cup devices according to claim 1 or 2, it is characterised in that the quantity of the lowering or hoisting gear (3) is two, if
It is placed at the lower edge of the movable part (1), and is separated by a pre-determined distance between two lowering or hoisting gears (3).
6. cup devices according to claim 5, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute
Stating lowering or hoisting gear (3) drives the movable part (1) to decline;Before the cavity that wafer spreads out of the cup bodies, the lifting dress
Putting (3) drives the movable part (1) to rise.
7. cup devices according to claim 5, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute
Stating lowering or hoisting gear (3) drives the movable part (1) to rise;Before the cavity that wafer spreads out of the cup bodies, the lifting dress
Putting (3) drives the movable part (1) to decline.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710725163.XA CN107481961A (en) | 2017-08-22 | 2017-08-22 | A kind of cup devices of one chip cleaning equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710725163.XA CN107481961A (en) | 2017-08-22 | 2017-08-22 | A kind of cup devices of one chip cleaning equipment |
Publications (1)
Publication Number | Publication Date |
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CN107481961A true CN107481961A (en) | 2017-12-15 |
Family
ID=60602033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710725163.XA Pending CN107481961A (en) | 2017-08-22 | 2017-08-22 | A kind of cup devices of one chip cleaning equipment |
Country Status (1)
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CN (1) | CN107481961A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101958228A (en) * | 2009-07-13 | 2011-01-26 | 弘塑科技股份有限公司 | Cleaning and etching bench with movable drain tank |
CN202072766U (en) * | 2011-05-19 | 2011-12-14 | 昆山西钛微电子科技有限公司 | Single-piece cup type rotating etching device |
CN203118916U (en) * | 2012-12-31 | 2013-08-07 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
CN103586230A (en) * | 2013-11-13 | 2014-02-19 | 上海华力微电子有限公司 | Single wafer cleaning device and application method thereof |
-
2017
- 2017-08-22 CN CN201710725163.XA patent/CN107481961A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101958228A (en) * | 2009-07-13 | 2011-01-26 | 弘塑科技股份有限公司 | Cleaning and etching bench with movable drain tank |
CN202072766U (en) * | 2011-05-19 | 2011-12-14 | 昆山西钛微电子科技有限公司 | Single-piece cup type rotating etching device |
CN203118916U (en) * | 2012-12-31 | 2013-08-07 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
CN103586230A (en) * | 2013-11-13 | 2014-02-19 | 上海华力微电子有限公司 | Single wafer cleaning device and application method thereof |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20171215 |