CN107481961A - A kind of cup devices of one chip cleaning equipment - Google Patents

A kind of cup devices of one chip cleaning equipment Download PDF

Info

Publication number
CN107481961A
CN107481961A CN201710725163.XA CN201710725163A CN107481961A CN 107481961 A CN107481961 A CN 107481961A CN 201710725163 A CN201710725163 A CN 201710725163A CN 107481961 A CN107481961 A CN 107481961A
Authority
CN
China
Prior art keywords
cup
lowering
movable part
wafer
cup bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710725163.XA
Other languages
Chinese (zh)
Inventor
李恒甫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Center for Advanced Packaging Co Ltd
Original Assignee
National Center for Advanced Packaging Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Center for Advanced Packaging Co Ltd filed Critical National Center for Advanced Packaging Co Ltd
Priority to CN201710725163.XA priority Critical patent/CN107481961A/en
Publication of CN107481961A publication Critical patent/CN107481961A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67023Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a kind of cup devices of one chip cleaning equipment, including cup bodies, cup bodies include movable part, fixed part and lowering or hoisting gear;Movable part is arranged in a part for the side of cup bodies, is moved under the driving of the lowering or hoisting gear, wafer is transferred into and out to the cavity of cup bodies;Fixed part is arranged in another part of the side of cup bodies, and fixed part forms the complete side of cup bodies with movable part.Technical scheme provided by the invention can fully be cleaned to wafer, can reduce unit frequency of delaying, and lift the production efficiency of board.

Description

A kind of cup devices of one chip cleaning equipment
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of cup devices of one chip cleaning equipment.
Background technology
With the development of semiconductor fabrication process, the characteristic size of semiconductor devices is less and less, for semiconductor structure Cleaning it is more and more important, if it can not be made fully to be cleaned, it will have influence on the structure and performance of device.It is existing clear Wash equipment cup devices in the process of running, can be run due to elevating lever inconsistent, cause board frequently to be delayed machine.Existing cleaning machine The motion of cup devices by multiple cylinder elevating levers (typically by 3 or 3 with upper cylinder lifter group into) while moved up and down Into, it is mass motion.If there is abnormal, whole device overall operation failure in one of elevating lever.
The content of the invention
In view of above-mentioned analysis, the present invention proposes a kind of cup devices of one chip cleaning equipment, to be filled to wafer Distinguish during washing, reduce the unit frequency of delaying of board, improve the production efficiency of board.
To achieve the above object, the present invention adopts the following technical scheme that:
The present invention proposes a kind of cup devices of one chip cleaning equipment, including cup bodies, and the cup bodies include can Move portion, fixed part and lowering or hoisting gear;The movable part is arranged in a part for the side of the cup bodies, described Moved under the driving of lowering or hoisting gear, wafer is transferred into and out to the cavity of the cup bodies;The fixed part is arranged at In another part of the side of the cup bodies, the fixed part forms the complete side of the cup bodies with the movable part Face.
As a preferred embodiment, the size of the movable part is more than the size of wafer.
As a preferred embodiment, the quantity of the lowering or hoisting gear is one, the movable part is arranged at At upper edge.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is one, the cup is passed in wafer Before the cavity of body, the lowering or hoisting gear drives the movable part to rise;Before the cavity that wafer spreads out of the cup bodies, The lowering or hoisting gear drives the movable part to decline.
As a preferred embodiment, the quantity of the lowering or hoisting gear is two, the movable part is arranged at At lower edge, and it is separated by a pre-determined distance between two lowering or hoisting gears.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is two, the cup is passed in wafer Before the cavity of body, the lowering or hoisting gear drives the movable part to decline;Before the cavity that wafer spreads out of the cup bodies, The lowering or hoisting gear drives the movable part to rise.
As a preferred embodiment, when the quantity of the lowering or hoisting gear is two, the cup is passed in wafer Before the cavity of body, the lowering or hoisting gear drives the movable part to rise;Before the cavity that wafer spreads out of the cup bodies, The lowering or hoisting gear drives the movable part to decline.
Technical solution of the present invention has the following advantages that:
The invention provides a kind of cup devices of one chip cleaning equipment, including cup bodies, cup bodies include removable Portion, fixed part and lowering or hoisting gear;Movable part is arranged in a part for the side of cup bodies, in the drive of the lowering or hoisting gear Moved under dynamic, wafer is transferred into and out to the cavity of cup bodies;Fixed part is arranged at the another of the side of cup bodies In part, fixed part forms the complete side of cup bodies with movable part.Above-mentioned technical proposal provided by the invention, can be right Wafer is fully cleaned, and reduces unit frequency of delaying, and lifts the production efficiency of board.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of a specific example of the cup devices of one chip cleaning equipment in the embodiment of the present invention;
Fig. 2 is the schematic diagram of another specific example of the cup devices of one chip cleaning equipment in the embodiment of the present invention.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to which the orientation of the instruction such as explanation, term " on ", " under " or position relationship are base In orientation shown in the drawings or position relationship, description description of the invention and simplified, rather than instruction or hint are for only for ease of Signified device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this The limitation of invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other It is be combined with each other into conflict can.
The embodiments of the invention provide a kind of cup of one chip cleaning equipment (cup cover) device, as shown in figure 1, including cup Body, the cup bodies include movable part 1, fixed part 2 and lowering or hoisting gear 3;Movable part 1 is arranged at the side of above-mentioned cup bodies In the part in face, moved under the driving of lowering or hoisting gear 3, wafer is transferred into and out to the cavity of above-mentioned cup bodies; Fixed part 2 is arranged in another part of the side of above-mentioned cup bodies, and fixed part 2 forms above-mentioned cup bodies with movable part 1 Complete side.The cup devices of one chip cleaning equipment provided in an embodiment of the present invention, wafer can fully be cleaned, Reduction is delayed unit frequency, lifts the production efficiency of board.
As a preferred embodiment, the size of above-mentioned movable part 1 is more than the size of wafer, it is easy to wafer to be passed to Or the cavity of the above-mentioned cup bodies of outflow.
As a preferred embodiment, as shown in figure 1, the quantity of above-mentioned lowering or hoisting gear 3 be one, be arranged at above-mentioned At the upper edge of movable part 1.
When the quantity of lowering or hoisting gear 3 is one, before wafer is passed to the cavity of above-mentioned cup bodies, lowering or hoisting gear 3 drives Movable part 1 rises, and wafer is passed to the cavity of above-mentioned cup bodies, and wafer, lowering or hoisting gear 3 are fixed by vacuum or press claw device Driving movable part 1 declines, and fixation portions is 2-in-1 is integrated, and cleaning is carried out to wafer.In technical process, cleaning is brilliant Chemical liquids used in circle in the cavity of above-mentioned cup bodies, avoid dirt of the chemical liquids to other devices of wafer periphery by beam Dye.After the completion of cleaning, above-mentioned lowering or hoisting gear 3 drives movable part 1 to rise, and wafer is spread out of the cavity of above-mentioned cup bodies, Complete a wafer cleaning process cycle.
As a preferred embodiment, as shown in Fig. 2 the quantity of above-mentioned lowering or hoisting gear 3 be two, be arranged at removable At the lower edge in dynamic portion 1, and it is separated by a pre-determined distance between two above-mentioned lowering or hoisting gears 3.
When the quantity of lowering or hoisting gear 3 is two, before wafer is passed to the cavity of above-mentioned cup bodies, lowering or hoisting gear 3 drives Movable part 1 is risen or fallen, and wafer is passed to the cavity of above-mentioned cup bodies, and wafer, lifting are fixed by vacuum or press claw device Device 3 drives movable part down or up, and fixation portions is 2-in-1 is integrated, and cleaning is carried out to wafer.Technical process In, the chemical liquids used in cleaning wafer in the cavity of above-mentioned cup bodies, avoid chemical liquids to other dresses of wafer periphery by beam The pollution put.After the completion of cleaning, above-mentioned lowering or hoisting gear 3 drives movable part 1 to rise or fall, and makes wafer outflow above-mentioned The cavity of cup bodies, complete a wafer cleaning process cycle.
The motion of the cup devices of existing one chip cleaning equipment by multiple cylinder elevating levers (typically by 3 or 3 with On) move up and down simultaneously, it is mass motion.When exception occurs in one of cylinder elevating lever, it may appear that because cylinder lifts Bar operation is inconsistent to cause board frequently to be delayed the situation of machine, and so as to cause whole device operational failure, board can not be run.This hair The cup devices for the one chip cleaning equipment that bright embodiment provides are filled compared with above-mentioned prior art using one or two lifting The movable part 1 of 3 driving cup bodies is put, reduces the quantity of lowering or hoisting gear 3, so as to reduce the unit frequency of delaying of board, is improved The production efficiency of board.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or Among changing still in the protection domain of the invention.

Claims (7)

1. a kind of cup devices of one chip cleaning equipment, it is characterised in that including cup bodies, the cup bodies include removable Dynamic portion (1), fixed part (2) and lowering or hoisting gear (3);
In a part for the side that the movable part (1) is arranged at the cup bodies, the driving in the lowering or hoisting gear (3) Under move, wafer is transferred into and out to the cavity of the cup bodies;
In the another part for the side that the fixed part (2) is arranged at the cup bodies, the fixed part (2) with it is described removable Dynamic portion (1) forms the complete side of the cup bodies.
2. cup devices according to claim 1, it is characterised in that the size of the movable part (1) is more than the chi of wafer It is very little.
3. cup devices according to claim 1 or 2, it is characterised in that the quantity of the lowering or hoisting gear (3) is one, if It is placed at the upper edge of the movable part (1).
4. cup devices according to claim 3, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute Stating lowering or hoisting gear (3) drives the movable part (1) to rise;Before the cavity that wafer spreads out of the cup bodies, the lifting dress Putting (3) drives the movable part (1) to decline.
5. cup devices according to claim 1 or 2, it is characterised in that the quantity of the lowering or hoisting gear (3) is two, if It is placed at the lower edge of the movable part (1), and is separated by a pre-determined distance between two lowering or hoisting gears (3).
6. cup devices according to claim 5, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute Stating lowering or hoisting gear (3) drives the movable part (1) to decline;Before the cavity that wafer spreads out of the cup bodies, the lifting dress Putting (3) drives the movable part (1) to rise.
7. cup devices according to claim 5, it is characterised in that before wafer is passed to the cavity of the cup bodies, institute Stating lowering or hoisting gear (3) drives the movable part (1) to rise;Before the cavity that wafer spreads out of the cup bodies, the lifting dress Putting (3) drives the movable part (1) to decline.
CN201710725163.XA 2017-08-22 2017-08-22 A kind of cup devices of one chip cleaning equipment Pending CN107481961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710725163.XA CN107481961A (en) 2017-08-22 2017-08-22 A kind of cup devices of one chip cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710725163.XA CN107481961A (en) 2017-08-22 2017-08-22 A kind of cup devices of one chip cleaning equipment

Publications (1)

Publication Number Publication Date
CN107481961A true CN107481961A (en) 2017-12-15

Family

ID=60602033

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710725163.XA Pending CN107481961A (en) 2017-08-22 2017-08-22 A kind of cup devices of one chip cleaning equipment

Country Status (1)

Country Link
CN (1) CN107481961A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958228A (en) * 2009-07-13 2011-01-26 弘塑科技股份有限公司 Cleaning and etching bench with movable drain tank
CN202072766U (en) * 2011-05-19 2011-12-14 昆山西钛微电子科技有限公司 Single-piece cup type rotating etching device
CN203118916U (en) * 2012-12-31 2013-08-07 上海新阳半导体材料股份有限公司 Wafer processing device
CN103586230A (en) * 2013-11-13 2014-02-19 上海华力微电子有限公司 Single wafer cleaning device and application method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958228A (en) * 2009-07-13 2011-01-26 弘塑科技股份有限公司 Cleaning and etching bench with movable drain tank
CN202072766U (en) * 2011-05-19 2011-12-14 昆山西钛微电子科技有限公司 Single-piece cup type rotating etching device
CN203118916U (en) * 2012-12-31 2013-08-07 上海新阳半导体材料股份有限公司 Wafer processing device
CN103586230A (en) * 2013-11-13 2014-02-19 上海华力微电子有限公司 Single wafer cleaning device and application method thereof

Similar Documents

Publication Publication Date Title
CN108380583A (en) A kind of manipulator for Wafer Cleaning
CN108088726A (en) A kind of multi-functional optional dyeing apparatus
CN107481961A (en) A kind of cup devices of one chip cleaning equipment
CN106089560A (en) Seat bottom type liftable tidal current energy generating equipment and elevating method
CN104749895B (en) A kind of double air supporting large substrate transmitting devices
CN218555096U (en) Touch control glass cleaning device
CN205313557U (en) Stomach cancer chromosome detects auxiliary assembly
CN208444811U (en) A kind of fixed device of wet process column tool promotion
CN209461475U (en) A kind of black silicon fluff making device of anti-sticking sheet
CN103737749B (en) Single mode tyre vulcanizer tire unloader
CN208962245U (en) A kind of oil cylinder adds the core pulling position limiting structure of inclined guide pillar
CN209296427U (en) Batch uses Wright's staining frame
CN208637386U (en) A kind of fixed device of spring magazine
CN203178289U (en) Microporous plate frame
CN209644651U (en) Steam box and automatic cooking apparatus
CN109841704A (en) A kind of black silicon fluff making device of anti-sticking sheet
CN206955201U (en) A kind of plate is connected transition mechanism
CN212834530U (en) Gloves belt cleaning device
JP3966848B2 (en) Substrate processing equipment
CN208037951U (en) A kind of operation console fork lift truck based on a high position
CN206189150U (en) Automatic whole machine that scalds of ready -made clothe
CN205488057U (en) Cyclic annular liquid collection device
CN211322979U (en) Plum washs quick drain device
CN206356315U (en) A kind of multiple-grooved ultrasonic cleaning equipment
CN205845914U (en) A kind of double absorption device improving the high-power thyristor life-span

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20171215