CN203085638U - 立体led白光器件 - Google Patents

立体led白光器件 Download PDF

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Publication number
CN203085638U
CN203085638U CN2012207040491U CN201220704049U CN203085638U CN 203085638 U CN203085638 U CN 203085638U CN 2012207040491 U CN2012207040491 U CN 2012207040491U CN 201220704049 U CN201220704049 U CN 201220704049U CN 203085638 U CN203085638 U CN 203085638U
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Prior art keywords
fluorescent powder
led white
white light
substrate
light
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Expired - Fee Related
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CN2012207040491U
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Inventor
朱晓飚
胡建红
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ZHEJIANG Z-LIGHT OPTOELECTRONICS Co Ltd
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ZHEJIANG Z-LIGHT OPTOELECTRONICS Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Luminescent Compositions (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型公开了一种立体LED白光器件,包括透明基板,设置于所述基板上的LED晶片,金线以及荧光粉体,所述基板的两端粘合有引线端子,所述金线两端分别与所述LED晶片和引线端子连接,所述的荧光粉体内填充有透明硅胶,所述基板固设在所述荧光粉体内,所述荧光粉体内包括带有钇铝石榴石或氮化物的荧光粉和透光性能材料。本实用新型可以在发光形态上,接近传统灯具的灯丝发光效果。

Description

立体LED白光器件
技术领域
本实用新型涉及一种立体LED白光器件。 
背景技术
目前,市场上的LED白光均采用在蓝光晶片上涂敷荧光胶来激发的发式生产。此种生产工艺,决定了LED的出光无法完全实现全周光。采用此种光源生产的LED灯具,也无法实现类似传统白炽灯的灯丝发光、荧光灯的管状发光效果。在很多的场合,照明效果无法与传统灯具比拟,使得LED灯具替换传统光源的便利性、舒适度等方面存在缺陷。 
发明内容
为了克服现有LED白光存在的无法实现全周光从而在便利性和舒适度上不能完全取代传统光源的缺点,本实用新型提供一种立体LED白光器件。 
本实用新型采用的技术方案是: 
立体LED白光器件,包括透明基板,设置于所述基板上的LED晶片,金线以及荧光粉体,所述基板的两端粘合有引线端子,所述金线两端分别与所述LED晶片和引线端子连接,所述的荧光粉体内填充有透明硅胶,其特征在于:所述基板固设在所述荧光粉体内,所述荧光粉体内包括带有钇铝石榴石或氮化物的荧光粉和透光性能材料。 
进一步,所述的透光性能材料为聚甲基丙烯酸甲酯、聚碳酸酯或有机硅材料。 
进一步,所述的荧光粉体还包括无机化合物粉剂,所述的无机化合物粉剂为Si、Al或Ti元素中的一种,所述无机化合物粉剂的粒径为10nm~10um。 
进一步,所述的荧光粉体表面设有微结构体,所述的微结构体可以是球形、菱形或方形,所述微结构体的粒径为10nm~10um。 
进一步,所述的荧光粉体可以是圆柱形、菱形、方形或球形。 
进一步,所述基板是SiO2或Al2O3制成。 
本实用新型所述透明硅胶的折射率在1.4~1.7之间,具有高透光性,与外部荧光粉体,能形成无缝粘合,增加晶片的光取出效率,同时达到保护LED晶片的作用。晶片发出的光,经过荧光粉体的激发,可形成色温从2000K~15000K范围内的、符合照明需求的白光颜色。 
本实用新型的有益效果体现在: 
1、白光器件的出光形态,由外部荧光粉体决定,可以是圆柱形、菱形、方体、球体,实现方便; 
2、透明材质的基板,使得LED晶片六个面的出光,均得到充分激发,发光效率远超传统工艺生产的LED白光器件; 
3、可以在发光形态上,接近传统灯具的灯丝发光效果。 
附图说明
图1是本实用新型正视图。 
图2是本实用新型侧视图。 
具体实施方式
参照图1和图2,立体LED白光器件,包括透明基板1,设置于所述基板1上的LED晶片2,金线3以及荧光粉体5,所述基板1的两端粘合有引线端子4,所述金线3两端分别与所述LED晶片2和引线端子4连接,所述的荧光粉体5内填充有透明硅胶7,所述基板1固设在所述荧光粉体5内,所述荧光粉体5内包括带有钇铝石榴石或氮化物的荧光粉和透光性能材料。 
进一步,所述的透光性能材料为聚甲基丙烯酸甲酯、聚碳酸酯或有机硅材料。 
进一步,所述的荧光粉体5还包括无机化合物粉剂,所述的无机化合物粉剂为Si、Al或Ti元素中的一种,所述无机化合物粉剂的粒径为10nm~10um。 
进一步,所述的荧光粉体5表面设有微结构体6,所述的微结构体6可以是球形、菱形或方形,所述微结构体6的粒径为10nm~10um。 
进一步,所述的荧光粉体5可以是圆柱形、菱形、方形或球形。 
进一步,所述基板1是SiO2或Al2O3制成。 
本实用新型所述透明硅胶7的折射率在1.4~1.7之间,具有高透光性,与外部荧光粉体,能形成无缝粘合,增加晶片的光取出效率,同时达到保护LED晶片的作用。晶片发出的光,经过荧光粉体的激发, 可形成色温从2000K~15000K范围内的、符合照明需求的白光颜色。 
本说明书实施例所述的内容仅仅是对发明构思的实现形式的列举,本实用新型的保护范围不应当被视为仅限于实施例所陈述的具体形式,本实用新型的保护范围也及于本领域技术人员根据本实用新型构思所能够想到的等同技术手段。 

Claims (6)

1.立体LED白光器件,包括透明基板,设置于所述基板上的LED晶片,金线以及荧光粉体,所述基板的两端粘合有引线端子,所述金线两端分别与所述LED晶片和引线端子连接,所述的荧光粉体内填充有透明硅胶,其特征在于:所述基板固设在所述荧光粉体内,所述荧光粉体内包括带有钇铝石榴石或氮化物的荧光粉和透光性能材料。 
2.如权利要求1所述的立体LED白光器件,其特征在于:所述的透光性能材料为聚甲基丙烯酸甲酯、聚碳酸酯或有机硅材料。 
3.如权利要求2所述的立体LED白光器件,其特征在于:所述的荧光粉体还包括无机化合物粉剂,所述的无机化合物粉剂为Si、Al或Ti元素中的一种,所述无机化合物粉剂的粒径为10nm~10um。 
4.如权利要求3所述的立体LED白光器件,其特征在于:所述的荧光粉体表面设有微结构体,所述的微结构体可以是球形、菱形或方形,所述微结构体的粒径为10nm~10um。 
5.如权利要求4所述的立体LED白光器件,其特征在于:所述的荧光粉体可以是圆柱形、菱形、方形或球形。 
6.如权利要求1~5之一所述的立体LED白光器件,其特征在于:所述基板是SiO2或Al2O3制成。 
CN2012207040491U 2012-12-18 2012-12-18 立体led白光器件 Expired - Fee Related CN203085638U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035820A (zh) * 2012-12-18 2013-04-10 浙江中宙光电股份有限公司 立体led白光器件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035820A (zh) * 2012-12-18 2013-04-10 浙江中宙光电股份有限公司 立体led白光器件

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