CN203072244U - Conductive copper foil substrate for mobile phone circuit board - Google Patents
Conductive copper foil substrate for mobile phone circuit board Download PDFInfo
- Publication number
- CN203072244U CN203072244U CN 201220683544 CN201220683544U CN203072244U CN 203072244 U CN203072244 U CN 203072244U CN 201220683544 CN201220683544 CN 201220683544 CN 201220683544 U CN201220683544 U CN 201220683544U CN 203072244 U CN203072244 U CN 203072244U
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- China
- Prior art keywords
- copper foil
- mobile phone
- conductive copper
- circuit board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A conductive copper foil substrate for a mobile phone circuit board includes conductive copper foil, a double-sided adhesive tape, a PET release film and a protective film; the conductive copper foil is covered at the lower surface of the double-sided adhesive tape, and the protective film is coated on the conductive copper foil; and the upper surface of the double-sided adhesive tape is provided with a layer of PET release film. The conductive copper foil substrate for the mobile phone circuit board of the utility model is molded with one step through a molding die cutting machine, such that the conductivity of the mobile phone circuit board is greatly improved, and the service life of a mobile phone can be prolonged. The vibration resistance and impact resistance of the conductive copper foil substrate both are improved obviously, such that the conductive copper foil substrate can satisfy requirements of high-performance products; and moreover, the conductive copper foil substrate is advantageous in low cost, easiness in implement, excellent effect in implement and broad market prospect.
Description
Technical field
The utility model relates to a kind of copper-foil conducting electricity with conductivity, especially relates to a kind of copper-foil conducting electricity substrate for circuit board of mobile phone.
Background technology
The existing circuit board that is used for mobile phone is because the many electronic component of top carrying and must be fixedly mounted in the equipment, therefore, must have certain thickness and mechanical strength, requirement to copper clad laminate in the circuit board is very high, along with the high performance of electronic product is more and more higher to the requirement of copper foil of circuit board substrate.In the prior art, the substrate of Copper Foil is double-deck flexible base plate, the cost of manufacture height, and intensity and precision can not satisfy the needs of premium quality product.Copper-foil conducting electricity is as the extraordinary Copper Foil that is used for strengthening in the circuit board of mobile phone conductivity, have yellow opaque, conductivity and be normal 5 times of conductions above etc. characteristics, be applicable to that circuit board of mobile phone strengthens conductivity.Now be widely used in circuit board of mobile phone; But when copper-foil conducting electricity carried out cross cutting, technological difficulties such as wrinkle, surface oxidation appearred in product easily.
Summary of the invention
The utility model purpose provides a kind of copper-foil conducting electricity substrate for circuit board of mobile phone.Wrinkle, easily oxidation of surface, low, the more high technical problem of cost of intensity appear easily to solve the existing in prior technology die cutting product.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of copper-foil conducting electricity substrate for circuit board of mobile phone comprises copper-foil conducting electricity, two-sided tape, PET fractal film, diaphragm; Described copper-foil conducting electricity covers the two-sided tape lower surface, and wherein diaphragm is coated on the copper-foil conducting electricity; Described two-sided tape upper surface is provided with one deck PET fractal film.
As preferably, described copper-foil conducting electricity by special moulding machine from this copper-foil conducting electricity upper surface one-step punching forming.
As preferably, the cutter of described mould machine is mountain cutter in the import, and is straight tiltedly outer in this cutter, knife up 3.0mm, 30 ° of angles.
The utility model wrinkle can not occur during cross cutting by the die-cutting machine one-shot forming, and it has significantly promoted the electric conductivity of circuit board of mobile phone, prolongs mobile phone useful life.Resistance to vibration and anti-impact force all obviously improve, and can satisfy the needs of premium quality product.And, with low cost, easy to implement, and implementation result is good.Market prospects are wide.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is further described in detail.
Fig. 1 is structural representation of the present utility model.As shown in Figure 1, a kind of copper-foil conducting electricity substrate for circuit board of mobile phone mainly is made up of copper-foil conducting electricity 3, two-sided tape 2, PET fractal film 1, diaphragm 4 etc.; Wherein copper-foil conducting electricity 3 covers two-sided tape 2 lower surfaces, and diaphragm 4 is coated on the copper-foil conducting electricity 3; Described two-sided tape 2 upper surfaces are provided with one deck PET fractal film 1.Copper-foil conducting electricity 3 by special moulding machine from these copper-foil conducting electricity 3 upper surface one-step punching forming.The cutter of mould machine is mountain cutter in the import, and is straight tiltedly outer in this cutter, knife up 3.0mm, 30 ° of angles.
During use, tear the PET fractal film 1 of two-sided tape 2 upper surfaces earlier, then directly copper-foil conducting electricity subsides 3 are combined in the circuit board of mobile phone the inside by taking the photograph son, it is bonded together securely, thereby overcome the indeterminable technical problem of prior art.
Claims (3)
1. a copper-foil conducting electricity substrate that is used for circuit board of mobile phone comprises copper-foil conducting electricity, two-sided tape, PET fractal film, diaphragm; It is characterized in that described copper-foil conducting electricity covers the two-sided tape lower surface, wherein diaphragm is coated on the copper-foil conducting electricity; Described two-sided tape upper surface is provided with one deck PET fractal film.
2. a kind of copper-foil conducting electricity substrate for circuit board of mobile phone according to claim 1 is characterized in that, described copper-foil conducting electricity passes through the mould machine from this copper-foil conducting electricity upper surface one-step punching forming.
3. a kind of copper-foil conducting electricity substrate for circuit board of mobile phone according to claim 2 is characterized in that, the cutter of described mould machine is middle mountain cutter, and is straight tiltedly outer in this cutter, knife up 3.0mm, 30 ° of angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220683544 CN203072244U (en) | 2012-12-12 | 2012-12-12 | Conductive copper foil substrate for mobile phone circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220683544 CN203072244U (en) | 2012-12-12 | 2012-12-12 | Conductive copper foil substrate for mobile phone circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203072244U true CN203072244U (en) | 2013-07-17 |
Family
ID=48770983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220683544 Expired - Fee Related CN203072244U (en) | 2012-12-12 | 2012-12-12 | Conductive copper foil substrate for mobile phone circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203072244U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571534A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Prevent ultra-thin copper foil cross cutting spare preparation of dew copper and use cutting device |
-
2012
- 2012-12-12 CN CN 201220683544 patent/CN203072244U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571534A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Prevent ultra-thin copper foil cross cutting spare preparation of dew copper and use cutting device |
| CN114571534B (en) * | 2020-11-30 | 2024-04-19 | 上海昊佰智造精密电子股份有限公司 | Die cutting device for manufacturing copper exposure-preventing ultrathin copper foil die cutting piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20151212 |
|
| EXPY | Termination of patent right or utility model |