CN202977398U - Novel intelligent radiator - Google Patents
Novel intelligent radiator Download PDFInfo
- Publication number
- CN202977398U CN202977398U CN201220552104XU CN201220552104U CN202977398U CN 202977398 U CN202977398 U CN 202977398U CN 201220552104X U CN201220552104X U CN 201220552104XU CN 201220552104 U CN201220552104 U CN 201220552104U CN 202977398 U CN202977398 U CN 202977398U
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- CN
- China
- Prior art keywords
- absorber plate
- novel intelligent
- fan
- hot side
- conduit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of radiation devices and especially relates to a novel intelligent radiator. The novel intelligent radiator can effectively save power resources by driving a fan through a heat source heating on a chip to cool a desktop computer chip. The novel intelligent radiator comprises the fan and semiconductor generation assemblies. The semiconductor generation assemblies are electrically connected with the fan. The two ends of each semiconductor generation assembly are respectively provided with a heat face absorber plate and a cold face absorber plate. The heat face absorber plates are arranged on the chip. The heat face absorber plates are connected with the semiconductor generation assemblies through a first guide pipe. The cold face absorber plates are connected with the semiconductor generation assemblies through a second guide pipe. Heat face radiating fins are arranged on the first guide pipe. Cold face radiating fins are arranged on the second guide pipe.
Description
Technical field
The utility model relates to the bulk loading device technical field, particularly relates to a kind of novel intelligent radiator.
Background technology
As everyone knows, radiator is a kind of heat abstractor, is widely used on the device of needs heat radiation, especially the chip place of desktop computer, due to long-term work, the temperature at its chip place is very high, existing heat dissipation technology is mainly to pass through fan for cooling, but be generally directly to be electrified stream to fan in fan for cooling, open switch, fan is directly in the face of chip, reach the cooling purpose, this mode is no doubt effective, but needs external power supply, thereby causes having wasted electric power resource.
The utility model content
For solving the problems of the technologies described above, the utility model provides a kind of can carry out the cooling of desktop computer chip by the thermal source drive fan of chip place's heating, has effectively saved the novel intelligent radiator of electric power resource.
novel intelligent radiator of the present utility model, comprise fan, also comprise the semiconductor electrification component, described semiconductor electrification component and fan are electrically connected, the two ends of described semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and described hot side absorber plate is arranged on chip, described hot side absorber plate is connected with the semiconductor electrification component by the first conduit, described huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with the semiconductor electrification component by the second conduit, and be provided with the hot side radiating fin on the first conduit, be provided with the huyashi-chuuka (cold chinese-style noodles) radiating fin on the second conduit.
Novel intelligent radiator of the present utility model is provided with overheating protection circuit on described semiconductor electrification component.
Novel intelligent radiator of the present utility model, described the first conduit and the second conduit are copper pipe.
Novel intelligent radiator of the present utility model, described hot side absorber plate are copper hot side absorber plate, and described huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
Compared with prior art the beneficial effects of the utility model are: the semiconductor electrification component is set, semiconductor electrification component and fan are electrically connected, the two ends of semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and the hot side absorber plate is arranged on chip, the hot side absorber plate is connected with the semiconductor electrification component by the first conduit, the huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with the semiconductor electrification component by the second conduit, and be provided with the hot side radiating fin on the first conduit, be provided with the huyashi-chuuka (cold chinese-style noodles) radiating fin on the second conduit; Like this, after by the hot side absorber plate, chip being absorbed heat, the semiconductor electrification component has produced voltage, and for starting fan, carry out augmentation of heat transfer by hot side radiating fin and huyashi-chuuka (cold chinese-style noodles) radiating fin, electric current better is provided, carries out the cooling of desktop computer chip thereby reach by the thermal source drive fan of chip place's heating, effectively saved electric power resource.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
As shown in Figure 1, novel intelligent radiator of the present utility model, comprise fan 1, also comprise semiconductor electrification component 2, semiconductor electrification component and fan are electrically connected, the two ends of semiconductor electrification component arrange respectively installs hot side absorber plate 3 and huyashi-chuuka (cold chinese-style noodles) absorber plate 4, and the hot side absorber plate is arranged on chip, the hot side absorber plate is connected with the semiconductor electrification component by the first conduit 5, the huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with the semiconductor electrification component by the second conduit 6, and be provided with huyashi-chuuka (cold chinese-style noodles) radiating fin 8 being provided with on the first conduit on hot side radiating fin 7, the second conduits; Like this, after by the hot side absorber plate, chip being absorbed heat, the semiconductor electrification component has produced voltage, and for starting fan, carry out augmentation of heat transfer by hot side radiating fin and huyashi-chuuka (cold chinese-style noodles) radiating fin, electric current better is provided, carries out the cooling of desktop computer chip thereby reach by the thermal source drive fan of chip place's heating, effectively saved electric power resource.
Novel intelligent radiator of the present utility model is provided with overheating protection circuit 9 on the semiconductor electrification component, like this, can better protect hot side semiconductor electrification component and huyashi-chuuka (cold chinese-style noodles) semiconductor electrification component.
Novel intelligent radiator of the present utility model, the first conduit and the second conduit are copper pipe, and like this, heat transfer effect is better.
Novel intelligent radiator of the present utility model, hot side absorber plate are copper hot side absorber plate, and the huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
novel intelligent radiator of the present utility model, generate electricity by thermals source such as cpu chip or video card chips, restarting fan lowers the temperature to cpu chip or video card chip, formed the general layout that heats with heat, and cpu chip or the video card chip hotter in, more stable to the power supply that fan provides, thereby the effect of fan running cooling is better, when cpu chip or video card chip when not being awfully hot, fan running speed is slower, thereby reached the intelligent cooling effect, fan in novel intelligent radiator of the present utility model is rated at 1.5V and opens and turn, and CPU, GPU, north and south bridge chip working temperature is all more than 40 degree, limiting temperature is about 90 degree, fan starts automatically to semiconductor and chip cooling when temperature reaches 50 degree.Temperature stabilization is in 45 about degree, like this when temperature is spent lower than 40, and the fan stall of not working.Starting fan heat radiation when surpassing 50 degree, every 1V voltage just is equivalent to continue cooling 33 degree, effect highly significant to chip.
Novel intelligent radiator of the present utility model, the application on household appliances can saves energy, and such as the use of desktop computer, when its use can be accomplished intelligent heat dissipation, saves energy was benefited the nation and the people in order to lighten the load to national grid.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.
Claims (4)
1. novel intelligent radiator, comprise fan, it is characterized in that, also comprise the semiconductor electrification component, described semiconductor electrification component and fan are electrically connected, the two ends of described semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and described hot side absorber plate is arranged on chip, described hot side absorber plate is connected with the semiconductor electrification component by the first conduit, described huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with the semiconductor electrification component by the second conduit, and be provided with the hot side radiating fin on the first conduit, be provided with the huyashi-chuuka (cold chinese-style noodles) radiating fin on the second conduit.
2. novel intelligent radiator as claimed in claim 1, is characterized in that, is provided with overheating protection circuit on described semiconductor electrification component.
3. novel intelligent radiator as claimed in claim 1, is characterized in that, described the first conduit and the second conduit are copper pipe.
4. novel intelligent radiator as claimed in claim 1, is characterized in that, described hot side absorber plate is copper hot side absorber plate, and described huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220552104XU CN202977398U (en) | 2012-10-26 | 2012-10-26 | Novel intelligent radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220552104XU CN202977398U (en) | 2012-10-26 | 2012-10-26 | Novel intelligent radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202977398U true CN202977398U (en) | 2013-06-05 |
Family
ID=48518441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220552104XU Expired - Fee Related CN202977398U (en) | 2012-10-26 | 2012-10-26 | Novel intelligent radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202977398U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777722A (en) * | 2012-10-26 | 2014-05-07 | 青海兰金电子科技有限公司 | Novel intelligent heat dissipation device |
| RU2796624C1 (en) * | 2023-01-31 | 2023-05-29 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
-
2012
- 2012-10-26 CN CN201220552104XU patent/CN202977398U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777722A (en) * | 2012-10-26 | 2014-05-07 | 青海兰金电子科技有限公司 | Novel intelligent heat dissipation device |
| RU2796624C1 (en) * | 2023-01-31 | 2023-05-29 | Общество с ограниченной ответственностью "Ботлихский радиозавод" | Thermoelectric device for heat removal from electronic equipment elements |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20131026 |