CN103777722A - Novel intelligent heat dissipation device - Google Patents
Novel intelligent heat dissipation device Download PDFInfo
- Publication number
- CN103777722A CN103777722A CN201210413821.9A CN201210413821A CN103777722A CN 103777722 A CN103777722 A CN 103777722A CN 201210413821 A CN201210413821 A CN 201210413821A CN 103777722 A CN103777722 A CN 103777722A
- Authority
- CN
- China
- Prior art keywords
- absorber plate
- novel intelligent
- hot side
- fan
- conduit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of heat dissipation devices, in particular to a novel intelligent heat dissipation device. According to the novel intelligent heat dissipation device, a heating heat source on the chip portion can drive a fan to cool a desktop computer chip, so that the electric power resource is effectively saved. The novel intelligent heat dissipation device comprises the fan and a semiconductor power generation assembly electrically connected with the fan. A hot surface heat absorption plate and a cold surface heat absorption plate are arranged at the two ends of the semiconductor power generation assembly respectively, the hot surface heat absorption plate is installed on the chip and connected with the semiconductor power generation assembly through a first guide pipe, and the cold surface heat absorption plate is connected with the semiconductor power generation assembly through a second guide pipe. The first guide pipe is provided with hot surface heat dissipation fins, and the second guide pipe is provided with cold surface heat dissipation fins.
Description
Technical field
The present invention relates to bulk loading device technical field, particularly relate to a kind of novel intelligent heating radiator.
Background technology
As everyone knows, heating radiator is a kind of heat abstractor, is widely used on the device of needs heat radiation, especially the chip place of desktop computer, due to long-term work, the temperature at its chip place is very high, existing heat dissipation technology is mainly to pass through fan for cooling, but in fan for cooling, be to be generally directly electrified stream to fan, open switch, fan is directly in the face of chip, reach cooling object, this mode is no doubt effective, but needs external power supply, thereby causes having wasted electric power resource.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of thermal source drive fan that can generate heat by chip place and carry out the cooling of desktop computer chip, effectively save the novel intelligent heating radiator of electric power resource.
Novel intelligent heating radiator of the present invention, comprise fan, also comprise semiconductor electrification component, described semiconductor electrification component and fan are electrically connected, the two ends of described semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and described hot side absorber plate is arranged on chip, described hot side absorber plate is connected with semiconductor electrification component by the first conduit, described huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with semiconductor electrification component by the second conduit, and on the first conduit, be provided with hot side radiating fin, on the second conduit, be provided with huyashi-chuuka (cold chinese-style noodles) radiating fin.
Novel intelligent heating radiator of the present invention, is provided with overheating protection circuit on described semiconductor electrification component.
Novel intelligent heating radiator of the present invention, described the first conduit and the second conduit are copper pipe.
Novel intelligent heating radiator of the present invention, described hot side absorber plate is copper hot side absorber plate, described huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
Compared with prior art beneficial effect of the present invention is: semiconductor electrification component is set, semiconductor electrification component and fan are electrically connected, the two ends of semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and hot side absorber plate is arranged on chip, hot side absorber plate is connected with semiconductor electrification component by the first conduit, huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with semiconductor electrification component by the second conduit, and on the first conduit, be provided with hot side radiating fin, on the second conduit, be provided with huyashi-chuuka (cold chinese-style noodles) radiating fin; Like this, after chip being absorbed heat by hot side absorber plate, semiconductor electrification component has produced voltage, and for starting fan, carry out augmentation of heat transfer by hot side radiating fin and huyashi-chuuka (cold chinese-style noodles) radiating fin, electric current is better provided, carries out the cooling of desktop computer chip thereby reach the thermal source drive fan of generating heat by chip place, effectively saved electric power resource.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1, novel intelligent heating radiator of the present invention, comprise fan 1, also comprise semiconductor electrification component 2, semiconductor electrification component and fan are electrically connected, the two ends of semiconductor electrification component arrange respectively installs hot side absorber plate 3 and huyashi-chuuka (cold chinese-style noodles) absorber plate 4, and hot side absorber plate is arranged on chip, hot side absorber plate is connected with semiconductor electrification component by the first conduit 5, huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with semiconductor electrification component by the second conduit 6, and on the first conduit, be provided with on hot side radiating fin 7, the second conduits and be provided with huyashi-chuuka (cold chinese-style noodles) radiating fin 8; Like this, after chip being absorbed heat by hot side absorber plate, semiconductor electrification component has produced voltage, and for starting fan, carry out augmentation of heat transfer by hot side radiating fin and huyashi-chuuka (cold chinese-style noodles) radiating fin, electric current is better provided, carries out the cooling of desktop computer chip thereby reach the thermal source drive fan of generating heat by chip place, effectively saved electric power resource.
Novel intelligent heating radiator of the present invention, is provided with overheating protection circuit 9 on semiconductor electrification component, like this, can better protect hot side semiconductor electrification component and huyashi-chuuka (cold chinese-style noodles) semiconductor electrification component.
Novel intelligent heating radiator of the present invention, the first conduit and the second conduit are copper pipe, and like this, heat transfer effect is better.
Novel intelligent heating radiator of the present invention, hot side absorber plate is copper hot side absorber plate, huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
Novel intelligent heating radiator of the present invention, generate electricity by thermals source such as cpu chip or video card chips, restarting fan lowers the temperature to cpu chip or video card chip, form the general layout heating with heat, and cpu chip or video card chip hotter in, the power supply providing to fan is more stable, thereby the effect of fan running cooling is better, when cpu chip or video card chip be not when being awfully hot, fan running speed is slower, thereby reach intelligent cooling effect, fan in novel intelligent heating radiator of the present invention is rated at 1.5V and opens and turn, and CPU, GPU, north and south bridge chip working temperature is all more than 40 degree, ultimate temperature is in 90 degree left and right, in the time that temperature reaches 50 degree, fan starts automatically to semiconductor and chip cooling.Temperature stabilization is in 45 about degree, like this when temperature is lower than 40 degree time, and the fan stall of not working.Starting fan heat radiation when exceeding 50 degree, every 1V voltage is just equivalent to continue cooling 33 degree, effect highly significant to chip.
Novel intelligent heating radiator of the present invention, the application on household appliances can saves energy, and such as the use of desktop computer, when its use can be accomplished intelligent heat dissipation, saves energy, to lighten the load to national grid, is benefited the nation and the people.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (4)
1. a novel intelligent heating radiator, comprise fan, it is characterized in that, also comprise semiconductor electrification component, described semiconductor electrification component and fan are electrically connected, the two ends of described semiconductor electrification component arrange respectively installs hot side absorber plate and huyashi-chuuka (cold chinese-style noodles) absorber plate, and described hot side absorber plate is arranged on chip, described hot side absorber plate is connected with semiconductor electrification component by the first conduit, described huyashi-chuuka (cold chinese-style noodles) absorber plate is connected with semiconductor electrification component by the second conduit, and on the first conduit, be provided with hot side radiating fin, on the second conduit, be provided with huyashi-chuuka (cold chinese-style noodles) radiating fin.
2. novel intelligent heating radiator as claimed in claim 1, is characterized in that, on described semiconductor electrification component, is provided with overheating protection circuit.
3. novel intelligent heating radiator as claimed in claim 1, is characterized in that, described the first conduit and the second conduit are copper pipe.
4. novel intelligent heating radiator as claimed in claim 1, is characterized in that, described hot side absorber plate is copper hot side absorber plate, and described huyashi-chuuka (cold chinese-style noodles) absorber plate is copper huyashi-chuuka (cold chinese-style noodles) absorber plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210413821.9A CN103777722A (en) | 2012-10-26 | 2012-10-26 | Novel intelligent heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210413821.9A CN103777722A (en) | 2012-10-26 | 2012-10-26 | Novel intelligent heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103777722A true CN103777722A (en) | 2014-05-07 |
Family
ID=50570078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210413821.9A Pending CN103777722A (en) | 2012-10-26 | 2012-10-26 | Novel intelligent heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103777722A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136212A (en) * | 2003-10-30 | 2005-05-26 | Toshiba Corp | Heat exchanger |
| CN2763756Y (en) * | 2004-08-26 | 2006-03-08 | 上海捷锐科技有限公司 | Semiconductor refrigerator |
| CN1780545A (en) * | 2004-11-23 | 2006-05-31 | 奇鋐科技股份有限公司 | Heating assembly with radiating structure |
| CN201498512U (en) * | 2009-09-10 | 2010-06-02 | 杭州升程高科技有限公司 | semiconductor refrigeration radiator |
| CN202977398U (en) * | 2012-10-26 | 2013-06-05 | 青海兰金电子科技有限公司 | Novel intelligent radiator |
-
2012
- 2012-10-26 CN CN201210413821.9A patent/CN103777722A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136212A (en) * | 2003-10-30 | 2005-05-26 | Toshiba Corp | Heat exchanger |
| CN2763756Y (en) * | 2004-08-26 | 2006-03-08 | 上海捷锐科技有限公司 | Semiconductor refrigerator |
| CN1780545A (en) * | 2004-11-23 | 2006-05-31 | 奇鋐科技股份有限公司 | Heating assembly with radiating structure |
| CN201498512U (en) * | 2009-09-10 | 2010-06-02 | 杭州升程高科技有限公司 | semiconductor refrigeration radiator |
| CN202977398U (en) * | 2012-10-26 | 2013-06-05 | 青海兰金电子科技有限公司 | Novel intelligent radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103762939A (en) | Method and device for improving photovoltaic power generation efficiency of crystalline silicon battery module | |
| CN104035459A (en) | Frequency converter and method for controlling temperature of frequency converter | |
| CN202978043U (en) | Semiconductor heat-dissipation system for power distribution cabinet | |
| CN108599623A (en) | A kind of modular thermo-electric generation radiator | |
| CN202940691U (en) | Radiating and cooling device for motor | |
| CN103855628A (en) | Semiconductor-based power distribution cabinet heat dissipation system | |
| Li et al. | Study on structure optimization of a dual IGBT module heat sink in a DC–DC converter under natural convection based on field synergy theory | |
| CN108874082A (en) | A kind of computer cabinet inside waste heat recovery plant | |
| CN202977398U (en) | Novel intelligent radiator | |
| CN202196771U (en) | Novel two-side cooler used for electromobile semiconductor | |
| CN207753612U (en) | A kind of energy-saving speed regulating frequency converter | |
| CN203120360U (en) | Circulating heat dissipation system of large power electric power electronic device | |
| CN202546853U (en) | Quick-heat-dissipation electromagnetic oven | |
| CN105120631A (en) | CPU cooling device with graphene thermal silicone grease cooling layer | |
| CN103777722A (en) | Novel intelligent heat dissipation device | |
| CN104020829A (en) | Efficient cooling device for computer case | |
| CN210429787U (en) | Heat dissipation assembly, frequency converter and air conditioning unit | |
| CN104182014A (en) | Thermoelectric power generation computer radiator | |
| CN106855738A (en) | A kind of computer cabinet | |
| TW201740661A (en) | Flexible high-power control device and motor assembly having same being conducted to control at least one high-power power generation/consumption device | |
| CN205068279U (en) | CPU (central processing unit) radiator | |
| CN204857705U (en) | Silicon controlled rectifier radiator | |
| CN204331610U (en) | A kind of notebook PC radiator utilizing the temperature difference to drive | |
| CN208608905U (en) | A kind of dedicated conductive radiator device of rectifier | |
| CN203423179U (en) | Three-phase fully-controlled bridge silicone-controlled rectifier assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140507 |
|
| WD01 | Invention patent application deemed withdrawn after publication |