CN202888155U - Metal substrate for being welded with power module - Google Patents
Metal substrate for being welded with power module Download PDFInfo
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- CN202888155U CN202888155U CN 201220438134 CN201220438134U CN202888155U CN 202888155 U CN202888155 U CN 202888155U CN 201220438134 CN201220438134 CN 201220438134 CN 201220438134 U CN201220438134 U CN 201220438134U CN 202888155 U CN202888155 U CN 202888155U
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- metal substrate
- plate body
- groove
- power module
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Abstract
The utility model relates to a metal substrate for being welded with a power module. The metal substrate comprises a plate body, and is characterized in that more than four position limiting projections for limiting the position of the outer periphery of a welding flux layer are arranged on the front face of the plate body, a groove is arranged on the bottom of the plate body, and the groove is filled with thermal conductive silicon grease. According to the utility model, the metal substrate is improved to obtain a reasonable structure, so that the welding flux layer can be conveniently positioned, and the welding reliability is increased; the metal substrate has good heat conductivity and can keep the heat conductivity of the power module constant, and the service life of the power module is prolonged.
Description
Technical field
The utility model relates to a kind of metal substrate for the bonding power module, belongs to technical field of semiconductors.
Background technology
Development along with the high-power electric and electronic technology, more and more IGBT power models are applied in the fields such as auto industry, solar energy, wind energy, locomotive traction, owing to be to be under large electric current and the large voltage operating mode, so can produce very large power consumption during the work of IGBT power model.But along with the increase of power semiconductor modular unit volume power consumption, can cause again device at when work excess Temperature and losing efficacy, so the heat dissipation technology of power semiconductor modular is the key of power semiconductor modular design and use.
Present domestic power semiconductor modular all adopts welding manner that each chip and each element are welded on the metal substrate, when chips welding, the chip bottom is by solder layer and metal substrate welding, because the uniformity of solder layer thickness can't be guaranteed, can there be certain deviation in its position when placing solder layer in addition, therefore so that solder layer can produce warpage and slope to a certain extent and cause failure welding, calorific value increases in the product use procedure and failure welding can cause, temperature raises and finally causes device failure, so the failure welding of chip is the poor reliability that causes semiconductor module, wherein a kind of factor that life-span is low.Moreover, when power model uses, although be to adopt copper base, but because the welding position of each chip is different, only can rely on the heat conductivility of copper base self to carry out heat conduction, moment heat-conducting effect bad, can cause the temperature distributing disproportionation on the copper base, because the copper base local temperature raises, finally can cause the power model life-span to descend or inefficacy.
Summary of the invention
The purpose of this utility model provides a kind of rational in infrastructure, can conveniently position solder layer, improves the metal substrate that is used for the bonding power module in soldering reliability and power model useful life.
The utility model is that the technical scheme that achieves the above object is: a kind of metal substrate for the bonding power module, comprise plate body, it is characterized in that: the front of described plate body is provided with carries out the spacing spacing preiection more than four to the solder layer neighboring, the plate body bottom is provided with groove, and is filled with heat-conducting silicone grease in the groove.
Wherein: the height of described plate body upper limit projection is greater than the height of solder layer.
Spacing preiection on the described plate body is circular columns or rectangular column.
Groove on the described plate body is square waveform groove or at least one transverse groove or at least one cannelure, and the groove depth of groove is 0.05-0.1 times of plate body thickness.
The utility model has the following advantages after adopting technique scheme:
1, the utility model is provided with spacing preiection in the plate body front of metal substrate, carry out spacing by spacing preiection to solder layer, prevent that chip from making the solder layer position be offset in welding process, make things convenient for control chip can not be offset, thereby to a certain degree solving because solder layer warpage and slope causing the bad problem of chips welding, the stability that also can keep solder layer thickness in the welding process simultaneously, chip and metal substrate welding quality have been improved, guarantee that chip is stable to the heat conduction of metal substrate, make metal substrate have better uniform temperature.
2, the utility model is provided with spacing preiection at metal substrate, the positioning fixture that alternative original metal substrate uses when chips welding can not only effectively reduce the percent defective that manual operation brings, and also makes technique simpler, the easy operating personnel operation, the manufacturing cost that also can save product.
3, the utility model is provided with groove in the plate body bottom, owing to be filled with heat-conducting silicone grease in the groove, make metal substrate have preferably heat conductivity, can keep the heat conductivity of power model consistent, because of the uniformity of temperature profile on the metal substrate, after being fixed on metal substrate on the radiator, the radiating effect of power model be can improve, thereby useful life and the reliability of power model improved.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described in further detail.
Fig. 1 is that the utility model is with the structural representation of chips welding on metal substrate.
Fig. 2 is the A-A sectional structure schematic diagram of Fig. 1.
Fig. 3 is the backsight structural representation of Fig. 1.
Fig. 4 is that the utility model is with the perspective view of chips welding at metal substrate.
Wherein: 1-plate body, 2-chip, 3-spacing preiection, 4-installing hole, 5-groove, 6-heat-conducting silicone grease, 7-solder layer.
Embodiment
See shown in Fig. 1～3 that the metal substrate for the bonding power module of the present utility model comprises plate body 1, plate body 1 is provided with installing hole 4, by securing member is convenient metal substrate is connected with shell, and metal substrate is connected with radiator, by radiator its heat is forced to discharge.
Shown in Fig. 1,2,4, plate body 1 front of the utility model metal substrate is provided with at least carries out the spacing spacing preiection more than four 3 to solder layer 7 neighborings, spacing preiection 3 height on the plate body 1 are greater than the height of solder layer 7, not only make things convenient for solder sheet is placed, also carry out by the scolder before and after the 3 pairs of meltings of spacing preiection simultaneously spacing, constant with the welding position of guaranteeing chip 2.As shown in Figure 1, spacing preiection 3 of the present utility model is circular columns, or this spacing preiection 3 is rectangular column, also can adopt the polygon post, can be provided with in each side of solder layer 7 two spacing preiections 3 or more spacing preiection 3, to make things convenient for the placement of solder layer 7, prevent chip 2 solder layer 7 positions skew in welding process.When needing to weld a plurality of chip on the metal substrate, be equipped with on the metal substrate each solder layer is carried out spacing a plurality of spacing preiections.
See Fig. 2, shown in 3, the utility model is provided with groove 5 in the bottom of metal substrate plate body 1, and be filled with heat-conducting silicone grease 6 in the groove 5, groove 5 on the utility model base plate is snakelike groove, square waveform groove as shown in Figure 2, or at least one transverse groove or at least one cannelure, the groove depth of groove 5 is 0.05-0.1 times of plate body 1 thickness, its groove width is 8-10 times of groove depth, the thickness of metal substrate adopts existing 3-8mm, such as the groove depth of groove 5 at 0.15mm, or 0.2mm, or 0.3mm, or 0.5mm, or 0.6mm and 0.8mm, and groove width can be between 1.2mm-8mm, such as 2mm, 4mm, 6mm etc. because groove 5 is positioned at chip 2 bottoms, therefore can make metal substrate have preferably heat conductivity by the heat-conducting silicone grease 6 in the groove 5, and also has preferably heat conductivity with radiator, at power model at work, the heat-conductive characteristic of metal substrate is consistent, and reaches the radiator of bottom by metal substrate.
Claims (4)
1. metal substrate that is used for the bonding power module, comprise plate body (1), it is characterized in that: the front of described plate body (1) is provided with at least carries out the spacing spacing preiection more than four (3) to solder layer (7) neighboring, plate body (1) bottom is provided with groove (5), and is filled with heat-conducting silicone grease (6) in the groove (5).
2. the metal substrate for the bonding power module according to claim 1 is characterized in that: the height of described plate body (1) upper limit projection (3) is greater than the height of solder layer (7).
3. the metal substrate for the bonding power module according to claim 1 and 2, it is characterized in that: the spacing preiection (3) on the described plate body (1) is circular columns or rectangular column.
4. the metal substrate for the bonding power module according to claim 1, it is characterized in that: the groove (5) on the described plate body (1) is square waveform groove or at least one transverse groove or at least one cannelure, and the groove depth of groove (5) is 0.05-0.1 times of plate body (1) thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220438134 CN202888155U (en) | 2012-08-31 | 2012-08-31 | Metal substrate for being welded with power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220438134 CN202888155U (en) | 2012-08-31 | 2012-08-31 | Metal substrate for being welded with power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888155U true CN202888155U (en) | 2013-04-17 |
Family
ID=48079550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220438134 Withdrawn - After Issue CN202888155U (en) | 2012-08-31 | 2012-08-31 | Metal substrate for being welded with power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832179A (en) * | 2012-08-31 | 2012-12-19 | 江苏宏微科技股份有限公司 | Metal base plate used for welding power module |
-
2012
- 2012-08-31 CN CN 201220438134 patent/CN202888155U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832179A (en) * | 2012-08-31 | 2012-12-19 | 江苏宏微科技股份有限公司 | Metal base plate used for welding power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130417 Effective date of abandoning: 20150429 |