CN202839586U - 一种采用弹性装置的无外引脚扁平半导体封装结构 - Google Patents

一种采用弹性装置的无外引脚扁平半导体封装结构 Download PDF

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CN202839586U
CN202839586U CN2012204689912U CN201220468991U CN202839586U CN 202839586 U CN202839586 U CN 202839586U CN 2012204689912 U CN2012204689912 U CN 2012204689912U CN 201220468991 U CN201220468991 U CN 201220468991U CN 202839586 U CN202839586 U CN 202839586U
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徐振杰
陶少勇
何錦文
曹周
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Great Team Backend Foundry Dongguan Co Ltd
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Abstract

本实用新型公开了一种采用弹性装置的无外引脚扁平半导体封装结构，其包括：引线框架，晶片，连接片，弹性散热板，胶体，胶体包覆于引线框架、晶片和弹性散热板，晶片座的底面、内引脚的外表面、弹性散热板的顶面均外露于胶体。本实用新型采用弹性散热板实现了弹性的半导体封装，在防止弹性散热板顶面溢胶的同时更保证了晶片在封装时不被上、下模具合模时产生的压力压碎，有效的保护了晶片，提高了封装结构的良率；晶片座既可做为晶片的承载体又可以作为底部的散热板，采用弹性散热板及底部的晶片座的结构获得了双面散热的效果，使封装结构散热效果更好，更适合集成化、小型化程度较高的无引脚扁平封装结构。

Description

一种采用弹性装置的无外引脚扁平半导体封装结构
技术领域
本实用新型涉及半导体封装技术领域，特别是涉及一种采用弹性装置的无外引脚扁平半导体封装结构。
背景技术
半导体封装是指将通过测试的晶圆按照产品型号及功能需求加工得到独立芯片的过程。封装过程为：来自晶圆通过划片工艺后被切割为小的晶片，然后将切割好的晶片用胶水贴装到相应的基板架的小岛上，再利用超细的金属导线或者导电性树脂将晶片的接合焊盘连接到基板的相应引脚,并构成所要求的电路；然后再对独立的晶片用塑料外壳加以封装保护。
随着微电子技术的迅速发展，集成电路复杂度的增加，要求半导体封装结构具有更小的外形，更高的性能。
现有技术的半导体封装结构中，导线架是常用的元件之一，且应用于多种封装产品，以导线架的类型而言，四方扁平封装可分为I型引脚的四方扁平封装、J型引脚的四方扁平封装及四方扁平无引脚封装，四方扁平无引脚封装的导线架的引脚不超出封装结构的边缘，故其具有较小的体积。此外，四方扁平无引脚封装具有较短的信号传递路径及较快的信号传递速度，然而四方扁平无引脚封装结构的散热片只能设置在封装结构的表面，因此，要么不设散热装置，要么在单面设置散热片，随着半导体封装结构的小型化和复杂程度的增加，上述的散热结构的散热效果满足不了现有半导体封装结构的要求。
发明内容
本实用新型的目的在于避免现有技术中的不足之处而提供一种采用弹性装置的无外引脚扁平半导体封装结构，其散热效果好，有利于半导体封装结构的小型化和集成化，在注塑合模时保护晶片不被压坏，同时在注塑时还可防止溢胶。 
本实用新型的目的通过以下技术方案实现：
一种采用弹性装置的无外引脚扁平半导体封装结构，包括：
引线框架，包括至少一个晶片座和多个位于晶片座周围的内引脚，内引脚具有内表面和外表面；
晶片，晶片位于晶片座的上表面，并与内引脚电性连接；
连接片，晶片与内引脚通过连接片连接，连接片的一段固接于晶片的上表面，其另一段与内引脚的内表面固接；
弹性散热板，弹性散热板固接于连接片的上表面；
胶体，胶体包覆于引线框架、晶片和弹性散热板，晶片座的底面、内引脚的外表面、弹性散热板的顶面均外露于胶体。
进一步，弹性散热板包括散热板和弹性脚，弹性脚固接于散热板。
进一步，弹性脚设置为两个Z字形的弹性脚，分别为第一Z字形的弹性脚和第二Z字形的弹性脚，其中，第一Z字形的弹性脚反向设置，第二Z字形的弹性脚正向设置；第一Z字形的弹性脚的上部与散热板的一端相接，第二Z字形的弹性脚的上部与散热板的另一端相接。
进一步，散热板和Z字形的弹性脚一体成型设置。
进一步，散热板的顶面边缘开设有防止溢胶的防溢胶槽。
进一步，弹性散热板为金属的弹性散热板。
进一步，所述晶片与晶片座之间接合固定。
进一步，晶片座的底面边缘和内引脚的顶面边缘均设有防止水汽进入的挡凸。
进一步，连接片为铜片。
进一步，晶片座与晶片之间，晶片与连接片之间，连接片与弹性散热板之间，连接片与内引脚之间接合固接。 
本实用新型的有益效果：
本实用新型的一种采用弹性装置的无外引脚扁平半导体封装结构，采用弹性散热板实现了弹性的半导体封装，在防止弹性散热板顶面溢胶的同时更保证了晶片在封装时不被上、下模具合模时产生的压力压碎，有效的保护了晶片，提高了封装结构的良率；晶片座既可做为晶片的承载体又可以作为底部的散热板，采用弹性散热板及底部的晶片座的结构获得了双面散热的效果，使封装结构散热效果更好，更适合集成化、小型化程度较高的无引脚扁平封装结构。
附图说明　
利用附图对本实用新型做进一步说明，但附图中的内容不构成对本实用新型的任何限制。
图1是本实用新型的一种采用弹性装置的无外引脚扁平半导体封装结构主视图；
图2是图1中A-A处的结构示意图；
图3是图1的侧视图；
图4是本实用新型的一种采用弹性装置的无外引脚扁平半导体封装结构另一视角的结构示意图。
在图1至图4中包括有：
引线框架100、晶片座110、内引脚120、
晶片300、
弹性散热板400、散热板410、弹性脚420、
胶体500、
防溢胶槽600、挡凸610、
连接片700、
锡球800。
具体实施方式
结合以下实施例对本实用新型作进一步说明。
本实用新型所述的一种采用弹性装置的无外引脚半导体扁平封装结构，如图1至图4所示包括：引线框架100包括至少一个晶片座110和多个位于晶片座110周围的内引脚120，内引脚120具有内表面和外表面。晶片300位于晶片座110的上表面，并与内引脚120电性连接。晶片300与内引脚120通过连接片700连接，连接片700的一段固接于晶片300的上表面，其另一段与内引脚120的内表面固接。弹性散热板400固接于连接片700的上表面。胶体500，胶体500包覆于引线框架100、晶片300、弹性散热板400，晶片座110的底面、内引脚120的外表面、弹性散热板400的顶面外露于胶体500。弹性散热板400用于将晶片300产生的热量导出封装结构外部，内引脚120用于与其他元件电连接。
具体的，在灌胶封装之前，上、下模具需要先合模，合模时上模与下模之间产生压力，如果想要得到双面散热的无外引脚扁平封装结构，晶片300上部的散热板410需要与上模紧紧挨着，以达到灌胶后散热板410顶面露出胶体500外部的目的，且不用增加除胶工序，然而刚性的散热板410容易在合模时受到上、下模的压力而将晶片300压碎。因此，采用弹性散热板400可以避免在上、下模合模时压碎晶片300的现象产生，并且可以达到使散热板410顶面与上模内表面紧紧挨在一起，灌胶时防止溢胶，直接得到双面散热的无外引脚扁平封装结构，使散热效果最大化，减少除胶工序。
弹性散热板400包括散热板410和弹性脚420，弹性脚420固接于散热板410底面。
弹性脚420设置为两个Z字形的弹性脚420，分别为第一Z字形的弹性脚420和第二Z字形的弹性脚420，其中，第一Z字形的弹性脚420反向设置，第二Z字形的弹性脚420正向设置；第一Z字形的弹性脚420的上部与散热板410的一端相接，第二Z字形的弹性脚420的上部与散热板410的另一端相接。
散热板410和Z字形的弹性脚420一体成型设置。弹性散热板400可以为一张金属片经过弯折而成。
散热板410的顶面边缘开设有防止溢胶的防溢胶槽600。进一步有效地防止散热板410的顶面溢胶。
弹性散热板400为金属的弹性散热板400。金属导热效率高，散热效果好，成型效果好，且具有良好的弹性形变回复性。
晶片300与晶片座110之间通过锡球800或者其他接合材接合固定。晶片座110第一可作为承载晶片300的载体，第二可作为底部散热板，与晶片300上部的弹性散热板400一起实现双面散热的效果，第三作为内引脚。
晶片座110的顶面边缘和内引脚120的顶面边缘均设有防止水汽进入的挡凸610。防止水汽进入封装体，提高产品的可靠性。
晶片300与内引脚120通过连接片700连接，连接片700的一段位于晶片300上表面和弹性散热板400之间，其另一段与内引脚120的内表面固接。使内引脚120设置更为灵活多变。
晶片座110与晶片300之间，晶片300与连接片700之间，连接片700与弹性散热板400之间，连接片700与内引脚120之间通过接合材料固接。内部结构稳固连接，便于灌胶封装，使封装后的结构整体性好，性能稳定。
最后应说明的是：以上仅为本实用新型的优选实施例而已，并不用于限制本实用新型，尽管参照实施例对本实用新型进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。

Claims (10)

1.一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于，包括：
引线框架，包括至少一个晶片座和多个位于所述晶片座周围的内引脚，所述内引脚具有内表面和外表面；
晶片，所述晶片位于所述晶片座的上表面，并与所述内引脚电性连接；
连接片，所述晶片与所述内引脚通过所述连接片连接，所述连接片的一段固接于所述晶片的上表面，其另一段与所述内引脚的内表面固接；
弹性散热板，所述弹性散热板固接于所述连接片的上表面；
胶体，所述胶体包覆于所述引线框架、所述晶片和所述弹性散热板，所述晶片座的底面、所述内引脚的外表面、所述弹性散热板的顶面均外露于所述胶体。
2.根据权利要求1所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述弹性散热板包括散热板和弹性脚，所述弹性脚固接于所述散热板。
3.根据权利要求2所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述弹性脚设置为两个Z字形的弹性脚，分别为第一Z字形的弹性脚和第二Z字形的弹性脚，其中，所述第一Z字形的弹性脚反向设置，所述第二Z字形的弹性脚正向设置；所述第一Z字形的弹性脚的上部与所述散热板的一端相接，所述第二Z字形的弹性脚的上部与所述散热板的另一端相接。
4.根据权利要求3所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述散热板和所述Z字形的弹性脚一体成型设置。
5.根据权利要求2所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述散热板的顶面边缘开设有防止溢胶的防溢胶槽。
6.根据权利要求1所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述弹性散热板为金属的弹性散热板。
7.根据权利要求1所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述晶片与晶片座之间接合固定。
8.根据权利要求1所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述晶片座的底面边缘和所述内引脚的顶面边缘均设有防止水汽进入的挡凸。
9.根据权利要求1所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述连接片为铜片。
10.根据权利要求9所述的一种采用弹性装置的无外引脚扁平半导体封装结构，其特征在于：所述晶片座与晶片之间，所述晶片与连接片之间，所述连接片与弹性散热板之间，所述连接片与内引脚之间接合固接。
CN2012204689912U 2012-09-14 2012-09-14 一种采用弹性装置的无外引脚扁平半导体封装结构 Withdrawn - After Issue CN202839586U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102832183A (zh) * 2012-09-14 2012-12-19 杰群电子科技（东莞）有限公司 一种采用弹性装置的无外引脚扁平半导体封装结构
CN106558568A (zh) * 2015-09-30 2017-04-05 台达电子工业股份有限公司 封装结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102832183A (zh) * 2012-09-14 2012-12-19 杰群电子科技（东莞）有限公司 一种采用弹性装置的无外引脚扁平半导体封装结构
CN102832183B (zh) * 2012-09-14 2015-01-07 杰群电子科技（东莞）有限公司 一种采用弹性装置的无外引脚扁平半导体封装结构
CN106558568A (zh) * 2015-09-30 2017-04-05 台达电子工业股份有限公司 封装结构

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