CN202696842U - Circuit board of bluetooth headset - Google Patents
Circuit board of bluetooth headset Download PDFInfo
- Publication number
- CN202696842U CN202696842U CN 201220191822 CN201220191822U CN202696842U CN 202696842 U CN202696842 U CN 202696842U CN 201220191822 CN201220191822 CN 201220191822 CN 201220191822 U CN201220191822 U CN 201220191822U CN 202696842 U CN202696842 U CN 202696842U
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- layer
- ground
- bluetooth earphone
- circuit plate
- circuit board
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- Expired - Fee Related
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- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000009957 hemming Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000003068 static effect Effects 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides a circuit board of a bluetooth headset. The circuit board comprises a signal layer S1, a grounding layer G, a power supply layer P and a signal layer S2. The circuit board further comprises a top layer, a bottom layer and a lateral side edge. The top layer and the bottom layer are paved on the ground, the lateral side edge is a metal edge and is connected with a ground phase of the top layer and the bottom layer, and via holes over the ground are arranged at a spare position at a connecting position. The circuit board can provide a shortest path, guarantees that static can be conducted to each ground layer on a printed circuit board (PCB) fast, reduces static energy, and effectively improves tolerance of a bluetooth headset product on electronic static discharge (ESD).
Description
Technical field
The utility model relates to the bluetooth earphone technical field, more specifically, relates to the Bluetooth earphone circuit plate of a kind of bluetooth earphone static tolerance Enhancement Method and application the method.
Background technology
Bluetooth is a kind of short-distance wireless communication technology of low cost low-power consumption.Popularizing along with blue tooth products and applications of wireless technology in recent years, bluetooth earphone become at present most widely used in daily life Bluetooth technology, by bluetooth earphone, the cellphone subscriber can realize wireless handsfree function, and needn't hang down from the head as it is single line to mobile phone.
Because static noise can be affected to the tonequality of bluetooth earphone, so the antistatic effect of bluetooth earphone is one of key factor that ensures its tonequality.
Fig. 1 is the schematic diagram of existing bluetooth earphone internal circuit board.As shown in Figure 1, existing Bluetooth earphone circuit plate (PCB) is generally four-layer circuit board, and ground floor is signals layer S1, and the second layer is ground plane G, and the 3rd layer is bus plane P, and the 4th layer is signals layer S2.In order to improve the entire system service behaviour, make the impedance of element supply path as far as possible low, prevent system voltage, element voltage and interelement voltage is excessive falls, usually each layer all spread to be ground.
Because Bluetooth earphone circuit plate itself is smaller, the electrostatic pulse energy is very large again, if can not absorb as early as possible the electrostatic pulse energy with shortest path, will cause the original paper in the Bluetooth earphone circuit plate impaired with making, thereby causes the damage of bluetooth earphone product.
Although existing each layer of Bluetooth earphone circuit plate is ground, but the top layer of PCB and bottom are all by anti-welding covering, be insulating barrier, after static enters into interiors of products by the structural housing slit, can not directly discharge over the ground, select immediately part is discharged, thereby can cause the infringement to part, cause the loss of function of bluetooth earphone product.
The utility model content
In view of the above problems, the purpose of this utility model provides a kind of Bluetooth earphone circuit plate, comprises signals layer S1, ground plane G, bus plane P and signals layer S2, wherein,
Described circuit board also comprises top layer, bottom and side bound edge;
Described top layer and bottom floor file, described side bound edge adopts metal hemming edge, and described side bound edge is electrically connected with the ground of described top layer, bottom.
In addition, preferred structure is that the spare bits of the junction that described side bound edge is electrically connected with the ground of described top layer, bottom installs and is equipped with over the ground via hole.
In addition, preferred structure is that described over the ground via hole is through-hole type via hole or buried type via hole.
In addition, preferred structure is that described over the ground via hole is electrically connected with described ground plane G.
In addition, preferred structure is that in the application process of described Bluetooth earphone circuit plate, described side bound edge is located at the gap position of described bluetooth earphone shell.
Utilize above-mentioned according to Bluetooth earphone circuit plate of the present utility model, a shortest path can be provided, guarantee that static can conduct to rapidly each stratum on the PCB (printed circuit board (PCB)), weaken the energy of static, make product to ESD (Electro-Static discharge, static release) tolerance is effectively promoted, thereby guarantees the performance of bluetooth earphone product.
In order to realize above-mentioned and relevant purpose, one or more aspects of the present utility model comprise the feature that the back will describe in detail and particularly point out in the claims.Following explanation and accompanying drawing describe some illustrative aspects of the present utility model in detail.Yet, the indication of these aspects only be some modes that can use in the variety of way of principle of the present utility model.In addition, the utility model is intended to comprise all these aspects and their equivalent.
Description of drawings
By the content of reference below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present utility model, other purpose of the present utility model and result will understand and easy to understand more.In the accompanying drawings:
Fig. 1 is existing Bluetooth earphone circuit layer structure schematic diagram;
Fig. 2 is the top floor plan view that connects according to Bluetooth earphone circuit plate of the present utility model;
Fig. 3 is the ground floor plan that connects according to Bluetooth earphone circuit plate of the present utility model.
Identical label is indicated similar or corresponding feature or function in institute's drawings attached.
Embodiment
Below with reference to accompanying drawing specific embodiment of the utility model is described in detail.
For each layer of giving the Bluetooth earphone circuit plate provides a grounding path the shortest, overcome electrostatic pulse to the damage of part, the utility model has increased the grounding shell of a metal in the design of Bluetooth earphone circuit plate, this metal grounding shell is connected with every one deck earth terminal of Bluetooth earphone circuit plate, to guarantee that static can conduct to rapidly each stratum on the PCB (printed circuit board (PCB)), weaken the energy of static, properties of product are guaranteed.
In the utility model, the Bluetooth earphone circuit plate comprises top layer, signals layer S1, ground plane G, bus plane P, signals layer S2 and bottom from top to bottom successively, in addition, also comprise the side bound edge, wherein, top layer, bottom and side bound edge three parts are all selected the good metal material of electric conductivity, and the side bound edge is electrically connected top layer and bottom.
Fig. 2 shows the top floor plan view that connects according to Bluetooth earphone circuit plate of the present utility model.
As shown in Figure 2, top layer 1 whole floor file of metal shell, side bound edge 2 adopts metal hemming edge, and this side bound edge 2 is connected with the ground of top layer, bottom.In Fig. 2, dash area be top layer 1 floor file part and with side bound edge 2,1 and 2 that the top layer floor file partly links to each other be attribute.
In addition, in a preferred implementation of the present utility model, and in the side bound edge, also be provided with over the ground via hole, with near the increase shortest cycle side bound edge of metal, to shorten air line distance over the ground, the conduction on increase ground, leap up into the other places probability that generation damages to part thereby reduce static.
Above-mentioned contrast via hole can be through hole, also can be to bury the hole.
Fig. 3 shows the ground floor plan according to Bluetooth earphone circuit plate of the present utility model.
In Fig. 3, dash area be shown as bottom 3 floor file parts with side bound edge 2,3 that the bottom floor file partly links to each other also be attribute, beat via hole in the connection of side bound edge 2 and top layer 1, bottom 3.
The side bound edge is same position among Fig. 2 and Fig. 3, is positioned at when mounted the place, slit of the structural housing side of bluetooth earphone product, and this position is the preferred location that ESD enters the Bluetooth earphone circuit plate.Bluetooth earphone circuit plate in this position is done metal hemming edge, allow ESD enter housing after, discharge over the ground in the beeline place, the portion of energy of the ESD that in advance decays.After dump energy enters the Bluetooth earphone circuit plate from here; by top layer and bottom over the ground via hole enter on the ground level of Bluetooth earphone circuit inner cord; the further energy of decay ESD reaching the purpose of protection part, thereby has effectively solved the damage of this type of static to individual earphones.Be a kind of conscientiously, effectively, solution cheaply.
As above describe according to Bluetooth earphone circuit plate of the present utility model in the mode of example with reference to accompanying drawing.But, it will be appreciated by those skilled in the art that the Bluetooth earphone circuit plate that proposes for above-mentioned the utility model, can also make various improvement on the basis that does not break away from the utility model content.Therefore, protection range of the present utility model should be determined by the content of appending claims.
Claims (5)
1. a Bluetooth earphone circuit plate comprises signals layer S1, ground plane G, bus plane P and signals layer S2, it is characterized in that, also comprises top layer, bottom and side bound edge; Wherein,
Described top layer and bottom floor file, described side bound edge adopts metal hemming edge, and described side bound edge is electrically connected with the ground of described top layer, bottom.
2. Bluetooth earphone circuit plate as claimed in claim 1 is characterized in that,
Spare bits in the junction that described side bound edge is electrically connected with the ground of described top layer, bottom installs and is equipped with over the ground via hole.
3. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Described over the ground via hole is through-hole type via hole or buried type via hole.
4. Bluetooth earphone circuit plate as claimed in claim 2 is characterized in that,
Described over the ground via hole is electrically connected with described ground plane G.
5. Bluetooth earphone circuit plate as claimed in claim 1 is characterized in that,
In the application process of described Bluetooth earphone circuit plate, described side bound edge is located at the gap position of described bluetooth earphone shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220191822 CN202696842U (en) | 2012-04-28 | 2012-04-28 | Circuit board of bluetooth headset |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220191822 CN202696842U (en) | 2012-04-28 | 2012-04-28 | Circuit board of bluetooth headset |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202696842U true CN202696842U (en) | 2013-01-23 |
Family
ID=47552391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220191822 Expired - Fee Related CN202696842U (en) | 2012-04-28 | 2012-04-28 | Circuit board of bluetooth headset |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202696842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102665155A (en) * | 2012-04-28 | 2012-09-12 | 歌尔声学股份有限公司 | Printed circuit board (PCB) of Bluetooth earphone |
-
2012
- 2012-04-28 CN CN 201220191822 patent/CN202696842U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102665155A (en) * | 2012-04-28 | 2012-09-12 | 歌尔声学股份有限公司 | Printed circuit board (PCB) of Bluetooth earphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20200428 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |