CN102665155A

CN102665155A - Printed circuit board (PCB) of Bluetooth earphone

Info

Publication number: CN102665155A
Application number: CN2012101319246A
Authority: CN
Inventors: 薛林
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2012-04-28
Filing date: 2012-04-28
Publication date: 2012-09-12

Abstract

The invention provides a printed circuit board (PCB) of a Bluetooth earphone. The PCB comprises a signal layer S1, ground layers G, a power layer P, a signal layer S2, a top layer, a bottom layer and a side edge, wherein the top layer and the bottom layer are grounded; the side edge is made of metal; the side edge is connected with the ground of the top layer and the bottom layer; and a grounded via is formed in the spare position of a connection position at which the side edge is connected with the ground of the top layer and the bottom layer. By the PCB of the Bluetooth earphone, the shortest path can be provided, so that static electricity can be rapidly conducted to each ground layer on the PCB, the energy of the static electricity can be weakened, and the tolerance of the Bluetooth earphone to electro-static discharge (ESD) can be effectively improved.

Description

Bluetooth earphone circuit board

Technical Field

The invention relates to the technical field of Bluetooth headsets, in particular to a method for enhancing the electrostatic tolerance of a Bluetooth headset and a Bluetooth headset circuit board applying the method.

Background

Bluetooth is a low-cost, low-power-consumption short-range wireless communication technology. With the popularization of bluetooth products and wireless technology applications in recent years, bluetooth headsets are the most widely used bluetooth technology in daily life, and a mobile phone user can realize a wireless hands-free function through the bluetooth headset without hanging a wire from a head to the mobile phone like the prior art.

Because the static noise can influence the tone quality of the bluetooth headset, the antistatic capability of the bluetooth headset is one of the important factors for guaranteeing the tone quality of the bluetooth headset.

Fig. 1 is a schematic diagram of an internal circuit board of a conventional bluetooth headset. As shown in fig. 1, a conventional bluetooth headset circuit board (PCB) generally includes four layers, a first layer is a signal layer S1, a second layer is a ground layer G, a third layer is a power layer P, and a fourth layer is a signal layer S2. In order to improve the overall operation performance of the system, the impedance of the element power supply path is made as low as possible to prevent excessive drops in the system voltage, the element voltage, and the voltage between elements, and each layer is generally laid as a ground.

Because the circuit board of the bluetooth headset is small, the electrostatic pulse energy is large, if the electrostatic pulse energy cannot be absorbed as soon as possible through the shortest path, the original components in the circuit board of the bluetooth headset can be damaged, and the bluetooth headset product is damaged.

Although each layer of the existing Bluetooth headset circuit board is ground, the top layer and the bottom layer of the PCB are covered by solder mask, and are insulating layers, static electricity cannot directly discharge to the ground after entering the inside of a product through a gap of a structural shell, and then discharge to parts is selected, so that damage to the parts can be caused, and the Bluetooth headset product loses functions.

Disclosure of Invention

In view of the above problems, it is an object of the present invention to provide a bluetooth headset circuit board including a signal layer S1, a ground layer G, a power layer P, and a signal layer S2, wherein,

the circuit board also comprises a top layer, a bottom layer and side edge wrapping edges;

the top layer and the bottom layer are paved, the side edge covering adopts metal edge covering, and the side edge covering is electrically connected with the ground of the top layer and the bottom layer.

In addition, the preferable structure is that the side edge cover is provided with a ground via hole at a vacant position of a connection part of the side edge cover and the ground connection of the top layer and the bottom layer.

In addition, the ground via is preferably a through hole via or a buried via.

In addition, it is preferable that the ground via is electrically connected to the ground layer G.

In addition, the preferable structure is that, in the application process of the bluetooth headset circuit board, the side edge cover is located at the gap position of the bluetooth headset shell.

The Bluetooth headset circuit board can provide a shortest path, ensures that Static electricity can be rapidly conducted to each stratum on a PCB (printed circuit board), weakens the energy of the Static electricity, effectively improves the tolerance of a product to ESD (Electro-Static discharge), and ensures the performance of the Bluetooth headset product.

To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.

Drawings

Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description and appended claims, taken in conjunction with the accompanying drawings. In the drawings:

fig. 1 is a schematic structural diagram of a circuit board layer of a conventional bluetooth headset;

FIG. 2 is a top plan view of a circuit board of a Bluetooth headset according to the present invention;

fig. 3 is a bottom plan view of a circuit board of a bluetooth headset according to the present invention.

The same reference numbers in all figures indicate similar or corresponding features or functions.

Detailed Description

Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In order to provide a shortest grounding path for each layer of the Bluetooth headset circuit board and overcome the damage of electrostatic pulses to parts, the invention adds a metal grounding shell in the design of the Bluetooth headset circuit board, and the metal grounding shell is connected with the grounding end of each layer of the Bluetooth headset circuit board so as to ensure that static electricity can be rapidly conducted to each stratum on a PCB (printed circuit board), weaken the energy of the static electricity and ensure the product performance.

The Bluetooth headset circuit board comprises a top layer, a signal layer S1, a ground layer G, a power layer P, a signal layer S2, a bottom layer and side wrapping edges from top to bottom, wherein the top layer, the bottom layer and the side wrapping edges are made of metal materials with good electric conductivity, and the side wrapping edges electrically connect the top layer and the bottom layer.

Fig. 2 shows a top-level plan view of a circuit board for a bluetooth headset according to the present invention.

As shown in figure 2, the top layer 1 of the metal shell is completely paved, the side edge 2 adopts metal edge, and the side edge 2 is connected with the ground of the top layer and the ground of the bottom layer. In fig. 2, the hatched area is the ground attribute for both the top layer 1 floor section and the

side margins

2, 1 and 2 associated with the top layer floor section.

In addition, in a preferred embodiment of the present invention, a ground via is further provided in the side edge wrapping to increase the shortest loop near the side edge wrapping of the metal, so as to shorten the straight distance to the ground and increase the ground conductivity, thereby reducing the probability of damage to the part due to static electricity leaking elsewhere.

The contrast via hole can be a through hole or a buried hole.

Fig. 3 shows a bottom plan view of a circuit board of a bluetooth headset according to the present invention.

In fig. 3, the shaded areas are shown as the floor portion of the bottom layer 3 and the

side margins

2, 3 connected to the floor portion, also as a ground attribute, with holes being punched at the connection of the side margins 2 to the top and

bottom layers

1, 3.

The side edge wrapping in fig. 2 and 3 is the same position, and is located at the gap of the side edge of the structural shell of the bluetooth headset product when being installed, and the position is the preferred position for the ESD to enter the bluetooth headset circuit board. And metal wrapping is carried out on the Bluetooth headset circuit board at the position, so that the ESD is discharged to the ground at the shortest distance after entering the shell, and partial energy of the ESD is attenuated in advance. After the residual energy enters the Bluetooth headset circuit board from the position, the residual energy enters the ground plane of the inner layer of the Bluetooth headset circuit board through the ground through holes of the top layer and the bottom layer, the energy of ESD is further attenuated, the purpose of protecting parts is achieved, and therefore the problem that the earphone monomers are damaged by static electricity is effectively solved. Is a practical, effective and low-cost solution.

The bluetooth headset circuit board according to the present invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the circuit board of the bluetooth headset of the present invention without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.

Claims

1. A circuit board of a Bluetooth headset comprises a signal layer S1, a ground layer G, a power layer P and a signal layer S2, and is characterized by further comprising a top layer, a bottom layer and side edge wrapping edges; wherein,

2. The Bluetooth headset circuit board of claim 1,

and ground through holes are formed in the vacant positions of the connection positions of the side edge covers and the ground connection positions of the top layer and the bottom layer.

3. The Bluetooth headset circuit board of claim 2,

the ground through hole is a through hole type through hole or a buried through hole.

4. The Bluetooth headset circuit board of claim 2,

the ground via is electrically connected with the ground layer G.

5. The Bluetooth headset circuit board of claim 1,

in the application process of the Bluetooth headset circuit board, the side edge wrapping is positioned in the gap position of the shell of the Bluetooth headset.