CN202669223U - In-mold transfer film element and shell comprising same - Google Patents
In-mold transfer film element and shell comprising same Download PDFInfo
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- CN202669223U CN202669223U CN 201220143370 CN201220143370U CN202669223U CN 202669223 U CN202669223 U CN 202669223U CN 201220143370 CN201220143370 CN 201220143370 CN 201220143370 U CN201220143370 U CN 201220143370U CN 202669223 U CN202669223 U CN 202669223U
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- layer
- heat
- mold transfer
- transfer printing
- membrane component
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- Expired - Fee Related
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- 239000012528 membrane Substances 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims description 138
- 238000010023 transfer printing Methods 0.000 claims description 53
- 229920005989 resin Polymers 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- 239000012790 adhesive layer Substances 0.000 claims description 42
- 238000001227 electron beam curing Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 208000034189 Sclerosis Diseases 0.000 abstract 1
- 230000000903 blocking effect Effects 0.000 abstract 1
- 210000000438 stratum basale Anatomy 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 4
- 238000005034 decoration Methods 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229920006359 Fluoroplast Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
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- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
An in-mold transfer film element and a housing containing the same. The utility model discloses an in-film transfer membrane element contains the stratum basale, from type layer, sclerosis layer, printing ink layer, heat blocking layer and the layer of being stuck with. The release layer is formed on the inner surface of the substrate layer, the hardening layer is formed on the release layer, the ink layer is formed on the hardening layer, the heat resisting layer is formed on the ink layer, and the adhesion layer is formed on the heat resisting layer.
Description
Technical field
The utility model relates to a kind of in-mold transfer printing membrane component (in-mold film component) and a kind of housing (casing) that comprises this in-mold transfer printing membrane component.More particularly, the utility model relates to the in-mold transfer printing technology that is applicable to (in-mold roller, IMR) and the harsh in-mold transfer printing membrane component of housing condition of molding.
Background technology
In-mold decoration (in-mold decoration, IMD) has become in the existing surface decoration tech, and one of technology that tool is expansionary also generally is used in the consumption electronic products.In-mold transfer printing technology (IMR) in the middle of the decoration technique inside mold because possess the advantage of automation, and can have the characteristics such as surperficial texture variation and abrasion performance, is fit to very much be used to a large amount of manufacturings.Most important element reaches and is the in-mold transfer printing membrane component in the in-mold transfer printing technology.
Seeing also Fig. 1, is the structural representation of a traditional in-mold transfer printing membrane component 1.
As shown in Figure 1, traditional in-mold transfer printing membrane component 1 comprises a basalis 10, a release layer 12, a hardened layer 14, an ink lay 16 and a following layer 18.Basalis 10 has an inner surface 102.Release layer 12 is formed on the inner surface 102 of basalis 10.Hardened layer 14 is formed on the release layer 12.Ink lay 16 is formed on the hardened layer 14.Following layer 18 is formed on the ink lay 16.
In actual applications, the inner surface 102 of basalis 10 can be a patterned surface.Patterned surface is the pattern that correspondence is used for decorating the subsequent forming housing.
The housing that utilizes traditional in-mold transfer printing membrane component 1 to make is the inwall that first in-mold transfer printing membrane component 1 is attached to mould.The main body of recycling injection molding manufacture procedure molded housing is taken out housing, and hardened layer 14, ink lay 16 and following layer 18 can be bonded on the main body of housing, namely finish the housing with in-mold transfer printing.
Along with various portable electronic product towards frivolous, short and small trend development.For the casing design of these portable electronic products, more easily reach sufficient intensity and frivolous requirement with carbon fiber and metal material at present.Molding plastic part often need be through after adding glass fibre or other high strength materials and plastics formation composite, so that its rigidity of reinforcement and intensity because rigidity own is not enough.But because the reinforcement material that adds, the high-temperature molding that usually can hinder plastic cement is mobile, penetrates the more harsh molding parameters such as pressure, firing rate, material temperature or mould temperature, could produce smoothly and force condition of molding need borrow to promote.For example, glass fiber-reinforced polymer composite, its ejection formation condition is comparatively harsh, and the material temperature of ejection formation must be more than 270 ℃.
Traditional in-mold transfer printing membrane component 1 its basalis 10 is formed by polyethylene terephthalate (Polyethylene Terephthalate, PET) resin.If traditional in-mold transfer printing membrane component 1 is applied in the above molding manufacture procedure of 270 ℃ of material temperatures, can causes moulding to penetrate injecting glue and advance a position basalis 10 meltdowns, and then cause the moulding failure.
The utility model content
Therefore, the technical problem that the utility model solves is to provide a kind of in-mold transfer printing membrane component and a kind of housing that comprises this in-mold transfer printing membrane component, and in-mold transfer printing membrane component of the present utility model is applicable to in-mold transfer printing technology and the harsh processing procedure of housing condition of molding.
A kind of in-mold transfer printing membrane component of a preferred embodiment of the present utility model comprises a basalis, a release layer, a hardened layer, an ink lay, one first heat and keeps out layer and a following layer.Basalis has an inner surface.Release layer is formed on the inner surface of basalis.Hardened layer is formed on the release layer.Ink lay is formed on the hardened layer.The first heat is kept out layer and is formed on the ink lay.Following layer is formed at the first heat and keeps out on the layer.
Further, in-mold transfer printing membrane component of the present utility model comprises one second heat and keeps out layer.The second heat is kept out layer and is formed between basalis and the release layer.
Further, in-mold transfer printing membrane component of the present utility model comprises one first adhesive layer, one second adhesive layer and one the 3rd adhesive layer.The first adhesive layer is formed between hardened layer and the ink lay.The second adhesive layer is formed on ink lay and the first heat is kept out between the layer.The 3rd adhesive layer is formed on the first heat and keeps out between layer and the following layer.
In one embodiment, the inner surface of basalis can be a patterned surface.
In one embodiment, the first heat keep out the layer can be formed by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins.
In one embodiment, the first heat is kept out the fusing point of layer greater than about 250 ℃.
In one embodiment, the first heat keep out the layer thickness be about 3 μ m～50 μ m.
In one embodiment, the second heat keep out the layer can by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins formed form.
In one embodiment, the second heat is kept out the fusing point of layer greater than about 250 ℃.
In one embodiment, the second heat keep out the layer thickness be about 0.5 μ m～15 μ m.
A kind of housing of a preferred embodiment of the present utility model comprises a main body, a following layer, one first heat and keeps out layer, an ink lay and a hardened layer.Main body has an outer surface, and is to be made of a macromolecular material.Following layer is formed on the outer surface.The first heat is kept out layer and is formed on the following layer.Ink lay is formed at the first heat and keeps out on the layer.Hardened layer is formed on the ink lay.
Further, housing of the present utility model comprises one first adhesive layer, one second adhesive layer and one the 3rd adhesive layer.The first adhesive layer is formed between hardened layer and the ink lay.The second adhesive layer is formed on ink lay and the first heat is kept out between the layer.The 3rd adhesive layer is formed on the first heat and keeps out between layer and the following layer.
In one embodiment, an outer surface of hardened layer can be a patterned surface.
In one embodiment, the first heat keep out the layer can by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins formed form.
In one embodiment, the first heat is kept out the fusing point of layer greater than about 250 ℃.
In one embodiment, the first heat keep out the layer thickness be about 3 μ m～50 μ m.
Compare with prior art, in-mold transfer printing membrane component of the present utility model is applicable to in-mold transfer printing technology and the harsh processing procedure of housing condition of molding.
Can be further understood by following embodiment and institute's accompanying drawing about advantage of the present utility model and spirit.
Description of drawings
Fig. 1 is the structural representation of traditional in-mold transfer printing membrane component.
Fig. 2 is the structural representation of a preferred embodiment of in-mold transfer printing membrane component of the present utility model.
Fig. 3 is the structural representation of another preferred embodiment of in-mold transfer printing membrane component of the present utility model.
Fig. 4 is the structural representation of a preferred embodiment of housing of the present utility model.
Fig. 5 is the structural representation of another preferred embodiment of housing of the present utility model.
[main element symbol description]
1: in-mold transfer printing membrane component 10: basalis
102: inner surface 12: release layer
14: hardened layer 16: ink lay
18: following layer 2: the in-mold transfer printing membrane component
20: basalis 202: inner surface
Heat was kept out layer 22 in 21: the second: release layer
23: 24: the first adhesive layers of hardened layer
25: 26: the second adhesive layers of ink lay
Heat was kept out 28: the three adhesive layer of layer in 27: the first
29: following layer 3: housing
30: main body 302: outer surface
232: outer surface
The specific embodiment
See also Fig. 2, be the structural representation of the in-mold transfer printing membrane component 2 of a preferred embodiment of the present utility model.
As shown in Figure 2, in-mold transfer printing membrane component 2 of the present utility model comprises a basalis 20, a release layer 22, a hardened layer 23, an ink lay 25, one first heat and keeps out layer 27 and one following layer 29.Basalis 20 has an inner surface 202.Release layer 22 is formed on the inner surface 202 of basalis 20.Hardened layer 23 is formed on the release layer 22.Ink lay 25 is formed on the hardened layer 23.The first heat is kept out layer 27 and is formed on the ink lay 25.Following layer 29 is formed at the first heat and keeps out on the layer 27.Keep out layer 27 by the first heat, if in-mold transfer printing membrane component 2 of the present utility model is applied in the molding manufacture procedure of harsh condition of molding, can prevents from penetrating injecting glue and advance a position basalis 20 meltdowns, avoid causing the moulding failure.
In one embodiment, the first heat is kept out layer and 27 can be formed by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins.
In one embodiment, the first heat is kept out the fusing point of layer 27 greater than about 250 ℃, and by this, in-mold transfer printing membrane component 2 of the present utility model can be applied in the above molding manufacture procedure of 270 ℃ of material temperatures.
In one embodiment, the first heat is kept out layer 27 thickness and is about 3 μ m～50 μ m.
In one embodiment, basalis 20 can be by PET resin, PEN (PEN (Polyethylene Naphthalate)) resin, (polyimides (Polyimide) resin or other commercial similar resins are formed PI.
In one embodiment, release layer 22 can be formed by silica gel, fluoroplast, melamine or other commercial similar resins.
In one embodiment, hardened layer 23 can be formed by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins.
In one embodiment, ink lay 25 can be formed by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins.
In one embodiment, following layer 29 can be formed by a thermoplastic resin.
Be shown in equally Fig. 2, further, in-mold transfer printing membrane component 2 of the present utility model comprises one second heat and keeps out layer 21.The second heat is kept out layer 21 and is formed between basalis 20 and the release layer 22, by this, promotes in-mold transfer printing membrane component 2 of the present utility model is resisted processing procedure high temperature in injection molding manufacture procedure ability.
See also Fig. 3, according to another preferred embodiment of the present utility model, in-mold transfer printing membrane component 2 of the present utility model comprises one first adhesive layer 24, one second adhesive layer 26 and one the 3rd adhesive layer 28 further.The first adhesive layer 24 is formed between hardened layer 23 and the ink lay 25.The second adhesive layer 26 is formed on ink lay 25 and the first heat is kept out between the layer 27.The 3rd adhesive layer 28 is formed on the first heat and keeps out between layer 27 and the following layer 29.By this, promote engaging force between each layer of in-mold transfer printing membrane component 2 of the present utility model.Note that the first adhesive layer 24, the second adhesive layer 26 and the 3rd adhesive layer 28 are nonessential.
In actual applications, the inner surface 202 of basalis 20 can be a patterned surface.Patterned surface is the pattern that correspondence is used for decorating the subsequent forming housing.
In one embodiment, the second heat keep out the layer 21 can by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins formed form.
In one embodiment, the second heat is kept out the fusing point of layer 21 greater than about 250 ℃, and by this, in-mold transfer printing membrane component 2 of the present utility model can be applied in the above molding manufacture procedure of 270 ℃ of material temperatures.
In one embodiment, the second heat is kept out layer 21 thickness and is about 0.5 μ m～15 μ m.
In one embodiment, the first adhesive layer 24, the second adhesive layer 26 and the 3rd adhesive layer 28 are formed by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins.
See also Fig. 4, be the structural representation of the housing 3 of a preferred embodiment of the present utility model.Housing 3 is by as shown in Figure 2 in-mold transfer printing membrane component 2 moulding and get.
As shown in Figure 4, the housing 3 of the present utility model following layer 29, the first heat that comprise a main body 30, in-mold transfer printing membrane component 2 is kept out layer 27, ink lay 25 and hardened layer 23.Main body 30 has an outer surface 302, and is to be made of a macromolecular material.For example, main body 30 can be formed by polystyrene (PS), acrylonitrile (ABS), Merlon (PC), polymethyl methacrylate (PMMA), nylon (Nylon), glass fibre (G F) or commercial common macromolecular material as housing.Main body 30 also can be formed by the composite that above-mentioned material forms, for example, acrylonitrile (ABS) and the composite of composite, nylon (Nylon) and glass fibre (GF) composition of Merlon (PC) composition or the composite that acrylonitrile (ABS), Merlon (PC) and glass fibre (GF) form.
Following layer 29 is formed on the outer surface 302 of main body 30.The first heat is kept out layer 27 and is formed on the following layer 29.Ink lay 25 is formed at the first heat and keeps out on the layer 27.Hardened layer 23 is formed on the ink lay 25.The basalis 20 of in-mold transfer printing membrane component 2 and release layer 22 break away from housing 3 by release layer 22 behind housing 3 shaping and demouldings.Keep out layer 27 by the first heat, advance a position basalis 20 meltdowns if housing of the present utility model 3 at harsh condition of molding compacted under, can prevent from penetrating injecting glue, avoid causing housing 3 moulding failure.
See also Fig. 5, according to another good specific embodiment of the present utility model, housing 3 of the present utility model comprises the first adhesive layer 24, the second adhesive layer 26 and the 3rd adhesive layer 28 of in-mold transfer printing membrane component 2 further.The first adhesive layer 24 is formed between hardened layer 23 and the ink lay 25.The second adhesive layer 26 is formed on ink lay 25 and the first heat is kept out between the layer 27.The 3rd adhesive layer 28 is formed on the first heat and keeps out between layer 27 and the following layer 29.Note that the first adhesive layer 24, the second adhesive layer 26 and the 3rd adhesive layer 28 are nonessential.
In one embodiment, the outer surface 232 of hardened layer 23 can be a patterned surface.Patterned surface is that correspondence is used for the pattern of decorated molded housing 3.
In one embodiment, the first heat keep out the layer 27 can by a thermosetting resin, a ultraviolet curable resin, an electron beam curing resin or other commercial similar resins formed form.
In one embodiment, the first heat is kept out the fusing point of layer 27 greater than about 250 ℃.
In one embodiment, the first heat is kept out layer 27 thickness and is about 3 μ m～50 μ m.
By the above detailed description of preferred embodiments, be to wish more to know to describe feature of the present utility model and spirit, and be not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the wish application of the utility model institute of various changes and tool equality.Therefore, the category of the claim that the utility model is applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (16)
1. in-mold transfer printing membrane component is characterized in that: comprise:
One basalis has an inner surface;
One release layer is formed on the described inner surface;
One hardened layer is formed on the described release layer;
One ink lay is formed on the described hardened layer;
One first heat is kept out layer, is formed on the described ink lay; And
One following layer is formed at described the first heat and keeps out on the layer.
2. in-mold transfer printing membrane component as claimed in claim 1 is characterized in that: also comprise:
One second heat is kept out layer, is formed between described basalis and the described release layer.
3. in-mold transfer printing membrane component as claimed in claim 1 is characterized in that: also comprise:
One first adhesive layer is formed between described hardened layer and the described ink lay;
One second adhesive layer is formed on described ink lay and described the first heat is kept out between the layer; And
One the 3rd adhesive layer is formed on described the first heat and keeps out between layer and the described following layer.
4. in-mold transfer printing membrane component as claimed in claim 1, it is characterized in that: described inner surface is a patterned surface.
5. in-mold transfer printing membrane component as claimed in claim 1 is characterized in that: described the first heat is kept out layer and is formed by a thermosetting resin, a ultraviolet curable resin or an electron beam curing resin.
6. in-mold transfer printing membrane component as claimed in claim 5 is characterized in that: described the first heat is kept out the fusing point of layer greater than 250 ℃.
7. in-mold transfer printing membrane component as claimed in claim 5 is characterized in that: the thickness that described the first heat is kept out layer is 3 μ m～50 μ m.
8. in-mold transfer printing membrane component as claimed in claim 2 is characterized in that: described the second heat is kept out layer and is formed by a thermosetting resin, a ultraviolet curable resin or an electron beam curing resin.
9. in-mold transfer printing membrane component as claimed in claim 8 is characterized in that: described the second heat is kept out the fusing point of layer greater than 250 ℃.
10. in-mold transfer printing membrane component as claimed in claim 8 is characterized in that: the thickness that described the second heat is kept out layer is 0.5 μ m～15 μ m.
11. a housing is characterized in that: comprise:
One main body has an outer surface and is to be made of a macromolecular material;
One following layer is formed on the described outer surface;
One first heat is kept out layer, is formed on the described following layer;
One ink lay is formed at the first heat and keeps out on the layer; And
One hardened layer is formed on the described ink lay.
12. housing as claimed in claim 11 is characterized in that: also comprise:
One first adhesive layer is formed between described hardened layer and the described ink lay;
One second adhesive layer is formed on described ink lay and described the first heat is kept out between the layer; And
One the 3rd adhesive layer is formed on described the first heat and keeps out between layer and the described following layer.
13. housing as claimed in claim 11 is characterized in that: an outer surface of described hardened layer is a patterned surface.
14. housing as claimed in claim 11 is characterized in that: described the first heat is kept out layer and is formed by a thermosetting resin, a ultraviolet curable resin or an electron beam curing resin.
15. housing as claimed in claim 15 is characterized in that: described the first heat is kept out the fusing point of layer greater than 250 ℃.
16. it is 3 μ m～50 μ m that housing as claimed in claim 15, wherein said the first heat are kept out the thickness of layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101202315 | 2012-02-09 | ||
| TW101202315U TWM432526U (en) | 2012-02-09 | 2012-02-09 | In-mold film component and casing including such in-mold film component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202669223U true CN202669223U (en) | 2013-01-16 |
Family
ID=47490153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220143370 Expired - Fee Related CN202669223U (en) | 2012-02-09 | 2012-04-06 | In-mold transfer film element and shell comprising same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202669223U (en) |
| TW (1) | TWM432526U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891595A (en) * | 2017-02-23 | 2017-06-27 | 广州优瑞塑料有限公司 | A kind of polyurethane moulding in-mold transfer printing film |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201504064A (en) * | 2013-07-16 | 2015-02-01 | Fong Shin Technology Co Ltd | Membrane and use method thereof |
-
2012
- 2012-02-09 TW TW101202315U patent/TWM432526U/en not_active IP Right Cessation
- 2012-04-06 CN CN 201220143370 patent/CN202669223U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891595A (en) * | 2017-02-23 | 2017-06-27 | 广州优瑞塑料有限公司 | A kind of polyurethane moulding in-mold transfer printing film |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM432526U (en) | 2012-07-01 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130116 Termination date: 20190406 |