CN202655751U - Semi-automatic assembling device of thermoelectric cooling module - Google Patents
Semi-automatic assembling device of thermoelectric cooling module Download PDFInfo
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- CN202655751U CN202655751U CN 201220307670 CN201220307670U CN202655751U CN 202655751 U CN202655751 U CN 202655751U CN 201220307670 CN201220307670 CN 201220307670 CN 201220307670 U CN201220307670 U CN 201220307670U CN 202655751 U CN202655751 U CN 202655751U
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- thermoelectric cooling
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Abstract
The utility model discloses a semi-automatic assembling device of a thermoelectric cooling module, comprising a bracket, a moving bed, a machine body and an electronic control system, wherein the bracket comprises uprights and a beam; the moving bed is arranged between the uprights; the moving bed comprises a bed body, a horizontal guide rail arranged on the bed body and a working platform which is arranged on the horizontal guide rail and is capable of sliding along the horizontal guide rail; the working platform is provided with a plurality of working areas; the machine body comprising a vertical plate, a lifting guide rail, a lifting cylinder and a fixed seat is arranged on the beam; the fixed seat is provided with a rotary cylinder; and a rotating shaft of the rotary cylinder is provided with a vacuum mechanical arm. According to the semi-automatic assembling device of the thermoelectric cooling module provided by the utility model, the vacuum mechanical arm is used for replacing the manual operation in the assembling process, and the moving bed is used for transferring assembly parts, so that the work efficiency is increased, and the assembling precision is improved; and in addition, reciprocation and rotation are realized by using pneumatic elements, so that the structure is simplified, and the production cost is lowered.
Description
Technical field
The utility model relates to a kind of manufacturing field of electronic product, refers more particularly to the semi-automatic assembling apparatus of thermoelectric cooling assembly that a kind of operating efficiency is higher and assembly quality is good.
Background technology
In present thermoelectric refrigerating module manufacturing, the multilayer module infrastructure product all is to be formed by manual assembly, adopt manual operations, labour intensity is large, production efficiency is low, comprise the manufacturing of thermoelectric refrigerating module, because dog-eat-dog, and the continuous growth along with the labor wage level, enterprise profit is reduced even loss, therefore, manufacturing enterprise urgently wishes to have the multilayer module infrastructure product semi-automatic/automatic assembling device replacement manual assembly, but owing to have one deck component count spy many in the multilayer module infrastructure product, full-automatic packaging efficiency also is not so good as manual assembly, therefore still replace hand assembled without fully automated assembly line both at home and abroad so far, China Patent No. is CN201120196793.0's, name is called a kind of utility model patent of solar panel assembling line, a kind of solar cell board assembly line is disclosed, comprise plate feeding device, unloading equipment and control device, be connected by belt wheel transmission between described plate feeding device and the unloading equipment, and be provided with successively the frame installation module between the two, clean installation module, described frame installation module comprises the frame load module that is connected with described plate feeding device, frame fixing pressing device, described plate feeding device, unloading equipment, belt wheel, the frame installation module, cleaning installation module is electrically connected with control device respectively; Although this production line adopts continuous-flow type to substitute the pure hand assembled of original part, but fixing, assemble and welding of the upper and lower substrate of the solar cell of crucial quality point and semiconductor grain all do not related to, can't satisfy the production of thermoelectric cooling assembly, assembly precision and welding quality also can't be improved.
The utility model content
The utility model solves mainly that thermoelectric cooling sheet pure manual production labour intensity of when welding assembling is large, assembly precision and welding quality can't guarantee, and the technical problems such as common Pipeline control scope is little, the assembling that can't satisfy the thermoelectric cooling assembly, welding; Provide the thermoelectric cooling assembly that a kind of operating efficiency is higher and assembly quality is good semi-automatic assembling apparatus.
In order to solve the technical problem of above-mentioned existence, the utility model mainly is to adopt following technical proposals:
The semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly of the present utility model is used for the vertical and welding of group of thermoelectric cooling assembly, and described thermoelectric cooling assembly comprises upper substrate, infrabasal plate and be located at semiconductor grain between the upper and lower base plate that assembling apparatus comprises:
Support comprises column and crossbeam, is used for the fixedly fuselage of assembling apparatus;
Moving bed is located between the column, and the direction of motion of moving bed is vertical with the support plane, and moving bed comprises lathe bed, being located at the horizontal guide rail on the lathe bed and being located at also can be along the workbench of horizontal guide rail slip on the horizontal guide rail, and described workbench is provided with some workspaces;
Fuselage, be arranged on the crossbeam, comprise riser, be located at riser guide, lift cylinder and holder on the riser, described holder is located on the riser guide and can slides up and down along lifting sliding rail, the piston rod of described lift cylinder is connected with holder, holder is provided with rotary cylinder, is connected with vacuum mechanical-arm in the rotating shaft of described rotary cylinder;
Electric-control system, control workbench, lift cylinder, rotary cylinder and the action of welding fixture and the switching of each vacuum cup;
Organize the manually-operated of vertical process by adopting vacuum mechanical-arm to replace, and transmit each by moving bed
The vertical part of group has improved the vertical precision of operating efficiency and group, has reduced production cost, and has adopted pneumatic element to realize moving back and forth and rotating, and then simplifies the structure, and is convenient to control, and installation and maintenance are convenient.
As preferably, described workbench is provided with three workspaces, comprise that semiconductor grain deposits the workspace, the vertical workspace of group and welding job district, described semiconductor grain is deposited the workspace and is placed with the semiconductor grain location-plate, be provided with the semiconductor grain of marshalling on the described semiconductor grain location-plate, described group of vertical workspace is placed with the infrabasal plate location-plate, infrabasal plate is positioned in the infrabasal plate location-plate, described welding job district is placed with welding fixture, adopt the vertical position welding of three groups to connect station, improve assembly precision and the uniformity of assembly, simplified the structure, be convenient to control.
As preferably, described vacuum mechanical-arm comprises C shape support, the middle part of described C shape support is connected with the rotating shaft of described rotary cylinder, the both ends of the surface of C shape support are parallel to each other and are equidistant with the axis of described rotary cylinder rotating shaft, C shape support is rotation take the rotating shaft of rotary cylinder as axis, the outer surface of one side end face of C shape support is provided with the upper substrate location-plate of placing upper substrate, the outer surface of opposite side end face is provided with the cover plate location-plate of placing the welding fixture cover plate, vacuum mechanical-arm can provide the transmission of upper substrate and cover plate and superimposed, simple in structure, reliable in action repeats high conformity.
As preferably, the piston stroke of described lift cylinder and described C shape support go to a side end face of below and the distance of described table surface matches, guarantee that vacuum machine upper substrate or cover plate on hand accurately is superimposed on the vertical part of group, can not cause contact excessive or too small and affect the vertical quality of group.
As preferably, semiconductor grain on the described workbench is deposited the workspace and is provided with alignment pin, described semiconductor grain location-plate is provided with the locating hole that matches with alignment pin, alignment pin inserts in the semiconductor grain location-plate, the semiconductor grain location-plate is placed accurately, and can not be offset at work, make semiconductor grain position on upper substrate and infrabasal plate accurate, the quality of the vertical product of raising group.
As preferably, group on the described workbench is provided with the infrabasal plate alignment pin in the vertical workspace, described infrabasal plate location-plate is provided with the locating hole that matches with the infrabasal plate alignment pin, alignment pin accurately inserts in the infrabasal plate location-plate, make infrabasal plate place accurately and can not be offset at work, the raising group is found quality.
As preferably, be equipped with vacuum cup on the upper substrate location-plate of described C shape support and the cover plate location-plate,
As preferably, described riser is provided with the stopping means of holder, prevents from that vacuum mechanical-arm from pressing down excessively the vertical part of the group on the workbench is caused the bump infringement.
Described lathe bed is provided with position limiter for working table, prevents that workbench from going out horizontal guide rail and causing accident.
The beneficial effects of the utility model are: the employing vacuum mechanical-arm replaces organizing the manually-operated of vertical process,
And transmit each group by moving bed and found part, improved the vertical precision of operating efficiency and group, reduce production cost, and adopted the pneumatic element realization to move back and forth and rotate, then simplify the structure, be convenient to control, installation and maintenance are convenient, good product quality.
Description of drawings
Fig. 1 is a kind of structural representation of the present utility model
Fig. 2 is the schematic top plan view of Fig. 1
Fig. 3 is that schematic diagram is looked on the left side of Fig. 1.
1. semiconductor grains among the figure, 2. column, 3. crossbeam, 4. lathe bed, 5. workbench, 6. riser, 7. riser guide, 8. lift cylinder, 9. holder, 10. rotary cylinder, 11. vacuum mechanical-arm, 12. semiconductor grains are deposited the workspace, 13. groups of vertical workspaces, 14. the welding job district, 15. semiconductor grain location-plates, 16. infrabasal plate location-plates, 17. welding fixture, 18. upper substrate location-plates, 19. cover plate location-plates.
The specific embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly of present embodiment, be used for the vertical and welding of group of thermoelectric cooling assembly, the thermoelectric cooling assembly comprises upper substrate, infrabasal plate and is arranged on semiconductor grain 1 between the upper and lower base plate that assembling apparatus such as Fig. 1, Fig. 2 and shown in Figure 3 comprise:
Support comprises column 2 and crossbeam 3, is used for the fixedly fuselage of assembling apparatus;
Moving bed, be installed between the column, the direction of motion of moving bed is vertical with the support plane, moving bed comprises lathe bed 4, being fixed on the horizontal guide rail on the lathe bed and being installed in also can be along the workbench 5 of horizontal guide rail slip on the horizontal guide rail, be designed with three workspaces on the workbench, at lathe bed position limiter for working table be installed;
Fuselage, be installed on the crossbeam, comprise riser 6, be installed in riser guide 7, lift cylinder 8 and holder 9 on the riser, holder is installed on the riser guide and can slides up and down along lifting sliding rail, the piston rod of lift cylinder is connected with holder, the piston stroke of lift cylinder and C shape support go to a side end face of below and the spacing of table surface matches, rotary cylinder 10 is installed on the holder, be connected with vacuum mechanical-arm 11 in the rotating shaft of rotary cylinder, the stopping means of rotary cylinder also is installed on holder;
Electric-control system, control and co-ordination platform, lift cylinder, rotary cylinder and the action of welding fixture and the switching of each vacuum cup.
Three workspaces on the workbench, comprise that semiconductor grain deposits workspace 12, the vertical workspace 13 of group and welding job district 14, semiconductor grain is deposited the workspace and is placed with semiconductor grain location-plate 15, be provided with the semiconductor grain of marshalling at the semiconductor grain location-plate, deposit the workspace at semiconductor grain alignment pin is installed, have the locating hole that matches with alignment pin at the semiconductor grain location-plate, the vertical workspace of group is placed with infrabasal plate location-plate 16, infrabasal plate is arranged in the infrabasal plate location-plate, in the vertical workspace of group, the infrabasal plate alignment pin is installed, have the locating hole that matches with the infrabasal plate alignment pin at the infrabasal plate location-plate, in the welding job district, be placed with welding fixture 17; Vacuum mechanical-arm comprises C shape support, the middle part of C shape support is connected with the rotating shaft of rotary cylinder, the both ends of the surface of C shape support are parallel to each other and are equidistant with the axis of rotary cylinder rotating shaft, the outer surface of one side end face of C shape support is equipped with the upper substrate location-plate 18 of placing upper substrate, the outer surface of opposite side end face is equipped with the cover plate location-plate 19 of placing the welding fixture cover plate, on upper substrate location-plate and the cover plate location-plate vacuum cup is installed all.
During use, job step is as follows:
The semiconductor grain location-plate that a) will be equipped with semiconductor grain is positioned over the semiconductor grain of workbench and deposits the workspace, the alignment pin that semiconductor grain is deposited the workspace inserts in the locating hole on the semiconductor grain location-plate, make the accurate positioning of semiconductor grain location-plate, lay firmly;
The infrabasal plate that is coated with special scolding tin is installed on the infrabasal plate location-plate, then the infrabasal plate location-plate is positioned in the vertical workspace of group of workbench, the alignment pin of the vertical workspace of group inserts in the locating hole of infrabasal plate location-plate, makes the accurate positioning of infrabasal plate location-plate, lays firmly;
Be positioned over welding job district on the workbench with being welded and fixed tool;
C shape support makes the upper substrate location-plate go to the top under the effect of rotary cylinder, the upper substrate that is coated with special scolding tin is placed on the upper substrate location-plate, and by sucker that the upper substrate adhesive is firm;
B) open rotary cylinder, vacuum mechanical-arm rotates 180 ° under the drive of rotary cylinder, makes upper substrate go to the below, upper substrate scribbles facing down of special scolding tin, and simultaneously, corresponding cover plate location-plate goes to the top, cover plate is placed on the cover plate location-plate, and sucker is firm with the cover plate adhesive;
C) workbench slides along horizontal guide rail, make semiconductor grain deposit the below that the workspace moves to vacuum mechanical-arm, start lift cylinder, piston rod stretches out the drive holder and moves downward, vacuum machine upper substrate on hand presses on the semiconductor grain location-plate, and the upper substrate that is coated with special scolding tin clings semiconductor grain;
D) close lift cylinder, the piston rod retraction drives holder and moves upward, and vacuum machine upper substrate is on hand mentioned, and the semiconductor grain in the semiconductor grain location-plate is all pasted and is transferred on the upper substrate;
E) workbench slides along horizontal guide rail, and the vertical workspace of group moves to the vacuum mechanical-arm below; Again start lift cylinder, holder moves downward, and the upper substrate that is pasted with semiconductor grain presses down again, and is superimposed with the infrabasal plate symmetry in the vertical workspace of group, the other end that is coated with the infrabasal plate of special scolding tin and semiconductor grain is bonding, forms the vertical product of group to be welded;
F) close lift cylinder, holder moves upward, and carries on the vertical product of group to be welded;
G) workbench slides along horizontal guide rail, is welded and fixed tool and moves to the vacuum mechanical-arm below, again starts lift cylinder, holder moves downward, the vertical product of vacuum machine group on hand drops on the fixed jig, closes sucker, and the vertical product of group drops on the fixed jig;
H) close lift cylinder, holder moves upward, and simultaneously, rotary cylinder rotates 180 °, makes the cover plate rotation to the below;
I) start lift cylinder, holder descends again, makes the vertical product of cover plate aligning group and closes sucker, and cover plate accurately is superimposed on the vertical product of group;
J) close lift cylinder, holder is mentioned to initial position, closes to be welded and fixed the clamp mechanism of tool, and welding fixture energising is carried out two-sided weld job to organizing vertical product, finishes the assembling of the vertical product of group and is welded and fixed;
K) simultaneously, workbench is retracted into initial position along horizontal guide rail, repeats above step, carries out the process in next cycle.
More than explanation is not that the utility model has been done restriction; the utility model also is not limited only to giving an example of above-mentioned explanation; the variation that those skilled in the art make in essential scope of the present utility model, retrofit, increase or replace, all should be considered as protection domain of the present utility model.
Claims (9)
1. semi-automatic assembling apparatus of thermoelectric cooling assembly is used for the vertical and welding of group of thermoelectric cooling assembly, and described thermoelectric cooling assembly comprises upper substrate, infrabasal plate and be located at semiconductor grain (1) between the upper and lower base plate that it is characterized in that: assembling apparatus comprises
Support comprises column (2) and crossbeam (3), is used for the fixedly fuselage of assembling apparatus;
Moving bed, be located between the column, the direction of motion of moving bed is vertical with the support plane, and moving bed comprises lathe bed (4), being located at the horizontal guide rail on the lathe bed and being located at also can be along the workbench (5) of horizontal guide rail slip on the horizontal guide rail, and described workbench is provided with some workspaces;
Fuselage, be arranged on the crossbeam, comprise riser (6), be located at riser guide (7), lift cylinder (8) and holder (9) on the riser, described holder is located on the riser guide and can slides up and down along lifting sliding rail, the piston rod of described lift cylinder is connected with holder, holder is provided with rotary cylinder (10), is connected with vacuum mechanical-arm (11) in the rotating shaft of described rotary cylinder;
Electric-control system, control workbench, lift cylinder, rotary cylinder and the action of welding fixture and the switching of each vacuum cup.
2. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 1, it is characterized in that: described workbench is provided with three workspaces, comprise that semiconductor grain deposits workspace (12), the vertical workspace (13) of group and welding job district (14), described semiconductor grain is deposited the workspace and is placed with semiconductor grain location-plate (15), be provided with the semiconductor grain of marshalling on the described semiconductor grain location-plate, described group of vertical workspace is placed with infrabasal plate location-plate (16), infrabasal plate is placed in the infrabasal plate location-plate, and described welding job district is placed with welding fixture (17).
3. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 1, it is characterized in that: described vacuum mechanical-arm (11) comprises C shape support, the middle part of described C shape support is connected with the rotating shaft of described rotary cylinder (10), the both ends of the surface of C shape support are parallel to each other and are equidistant with the axis of described rotary cylinder rotating shaft, the outer surface of one side end face of C shape support is provided with the upper substrate location-plate (18) of placing upper substrate, and the outer surface of opposite side end face is provided with the cover plate location-plate (19) of placing the welding fixture cover plate.
4. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 1 is characterized in that: the piston stroke of described lift cylinder (10) and described C shape support go to a side end face of below and the distance of described table surface matches.
5. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 2, it is characterized in that: the semiconductor grain on the described workbench (5) is deposited workspace (12) and is provided with the alignment pin I, and described semiconductor grain location-plate (15) is provided with the locating hole I that matches with alignment pin.
6. according to claim 2 or the semi-automatic assembling apparatus of 5 described a kind of thermoelectric cooling assemblies, it is characterized in that: the vertical workspace (13) of the group on the described workbench (5) is provided with the alignment pin II, and described infrabasal plate location-plate (16) is provided with the locating hole II that matches with alignment pin.
7. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 3 is characterized in that: be equipped with vacuum cup on the upper substrate location-plate (18) of described C shape support and the cover plate location-plate (19).
8. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 1, it is characterized in that: described riser (6) is provided with the holder stopping means.
9. the semi-automatic assembling apparatus of a kind of thermoelectric cooling assembly according to claim 1, it is characterized in that: described lathe bed (4) is provided with position limiter for working table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220307670 CN202655751U (en) | 2012-06-28 | 2012-06-28 | Semi-automatic assembling device of thermoelectric cooling module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220307670 CN202655751U (en) | 2012-06-28 | 2012-06-28 | Semi-automatic assembling device of thermoelectric cooling module |
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| CN202655751U true CN202655751U (en) | 2013-01-09 |
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| CN 201220307670 Expired - Lifetime CN202655751U (en) | 2012-06-28 | 2012-06-28 | Semi-automatic assembling device of thermoelectric cooling module |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104669241A (en) * | 2013-12-02 | 2015-06-03 | 苏州市吴中区临湖俊峰机械厂 | Work process of rotation type up and down clamping mechanical arm |
| CN105710872A (en) * | 2016-04-20 | 2016-06-29 | 苏州鸿普精密模具有限公司 | Bundling transposition manipulator for power strip cable bundling machine |
| CN107555352A (en) * | 2017-10-23 | 2018-01-09 | 惠州市齐力建筑工程有限公司 | It is a kind of to be used to build fixed fixed panel lifting transfer device |
| CN107718031A (en) * | 2017-11-10 | 2018-02-23 | 深圳市创世纪机械有限公司 | Loading and unloading manipulator and glass carving machine |
| CN109686691A (en) * | 2019-03-08 | 2019-04-26 | 重庆市洲金电子科技有限公司 | A kind of dedicated positioning process platform of semiconductor chip processing |
| CN110666489A (en) * | 2019-10-16 | 2020-01-10 | 杭州高品自动化设备有限公司 | Pin preassembling structure for positioning pin assembling mechanism and working method thereof |
-
2012
- 2012-06-28 CN CN 201220307670 patent/CN202655751U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104669241A (en) * | 2013-12-02 | 2015-06-03 | 苏州市吴中区临湖俊峰机械厂 | Work process of rotation type up and down clamping mechanical arm |
| CN105710872A (en) * | 2016-04-20 | 2016-06-29 | 苏州鸿普精密模具有限公司 | Bundling transposition manipulator for power strip cable bundling machine |
| CN107555352A (en) * | 2017-10-23 | 2018-01-09 | 惠州市齐力建筑工程有限公司 | It is a kind of to be used to build fixed fixed panel lifting transfer device |
| CN107718031A (en) * | 2017-11-10 | 2018-02-23 | 深圳市创世纪机械有限公司 | Loading and unloading manipulator and glass carving machine |
| CN109686691A (en) * | 2019-03-08 | 2019-04-26 | 重庆市洲金电子科技有限公司 | A kind of dedicated positioning process platform of semiconductor chip processing |
| CN109686691B (en) * | 2019-03-08 | 2021-01-01 | 枣庄市大河工业机械有限公司 | Special positioning processing platform for processing semiconductor wafer |
| CN110666489A (en) * | 2019-10-16 | 2020-01-10 | 杭州高品自动化设备有限公司 | Pin preassembling structure for positioning pin assembling mechanism and working method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130109 |
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| CX01 | Expiry of patent term |