CN202514230U - Vapor chamber with inner-sintered structured support columns - Google Patents
Vapor chamber with inner-sintered structured support columns Download PDFInfo
- Publication number
- CN202514230U CN202514230U CN2012200907392U CN201220090739U CN202514230U CN 202514230 U CN202514230 U CN 202514230U CN 2012200907392 U CN2012200907392 U CN 2012200907392U CN 201220090739 U CN201220090739 U CN 201220090739U CN 202514230 U CN202514230 U CN 202514230U
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- lower cover
- cover plate
- support column
- sintering
- upper cover
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Abstract
The utility model discloses a vapor chamber with inner-sintered structured support columns. An upper cover plate sintered capillary core and a lower cover plate sintered capillary core are arranged in a cavity between an upper cover plate and a lower cover plate; a plurality of support columns and a plurality of concave structured stress absorption rings are arranged on an inner bottom surface of the lower cover plate; the upper cover plate sintered capillary core and the lower cover plate sintered capillary core are provided with a plurality of support column installation holes penetrated by the support columns; convex stages which are formed naturally in sintering and are correspondingly matched with recesses of the stress absorption rings are distributed on a lower surface of the lower cover plate sintered capillary core. The stress absorption rings of the vapor chamber can effectively absorb deformation; regionalized distribution of the support columns can assist in eliminating effect thereof on an enforced boiling structure of the lower cover plate; capillary liquid absorbing cores inside the support columns can reduce a reflux path of a liquid working medium in a condensing section and enable rising steam produced from internal enforced boiling of the vapor chamber to be separated from the liquid working medium in reflux descending, thereby avoiding an shear effect produced from the contact between the steam and an interface of the liquid working medium and improving heat transfer capacity.
Description
Technical field
The utility model relates to cooling electronic component and uses soaking plate, relates in particular to a kind of soaking plate with interior sintering structure support column.
Background technology
Along with the degree of circuit integration is increasingly high; Packaging density and operating frequency improve constantly; Make the electronic component caloric value of unit volume and the energy consumption of single chip strengthen; The facility compact structure Design makes heat radiation difficult more again, thereby presses for solution high efficiency and heat radiation technical barrier.The types of cooling such as traditional natural convection air, Forced Air Convection, liquid free convection have been difficult to satisfy the demand that electronic applications further develops; The liquid forced convertion is gentle/extraordinary radiating modes such as liquid phase change, become the selection of electronic applications radiating mode in current and expected future a period of time.The heat pipe-type heat dissipation technology has high heat-transfer performance, and good isothermal need not advantages such as extra power driving, so be widely used in the heat radiation of electronic and electrical equipment.But its heat exchange pattern is an one dimension, is subject to less heat transfer area and bigger contact heat resistance in some applied field credit union, makes heat-transfer capability limited.Soaking plate is compared general heat pipe; Heat conducting mode is inequality, and its heat exchange pattern is two-dimentional, is the heat exchange pattern of face; The big plane that is uniformly distributed with of isothermal can be rapidly the high heat flux of one or more centrostigma thermals source be close to, thereby its density of heat flow rate can be reduced rapidly; The structure on plane can directly directly contact with most at present electronic applications thermals source (chip), has reduced the overall thermal resistance of system.Therefore, soaking plate is widely applied to the electronic radiation field.Flat-plate heat pipe heat dissipation technology progress (Chen Jinjian, chemical industry and progress, 2009 12 phases) has been introduced traditional soaking plate, and it is long to there is condensation segment working medium backflow distance, causes the evaporation section liquid refrigerant dry easily; Unbraced structure in the vacuum chamber, cover plate subsides easily, thereby causes problems such as the contact heat resistance change of thermal source and soaking plate is big.
At present, prior art increases the copper post that is used for water conservancy diversion through every between the upper and lower cover plate of soaking plate at a distance from 0.6-1.2cm, with the intensity between the upper and lower cover plate that increases soaking plate.Yet increased after the support copper post with the mode of array, the reinforcement boiling structure of lower cover has received destruction, has influenced the heat transfer property of soaking plate to a certain extent.
Summary of the invention
In order to overcome the shortcoming and defect of prior art; The utility model provides the soaking plate of sintering structure support column in the band that structure is a kind of simply, heat-transfer effect is good; Shortened condensation segment liquid refrigerant return flow path; Entrainment limit occurs when avoiding soaking plate work, keep the evenness of upper and lower cover plate, and be applicable to the occasion of single thermal source and many thermals source.
The utility model technical scheme is following:
A kind of soaking plate with interior sintering structure support column; Comprise upper cover plate, lower cover; Constitute cavity between upper cover plate and the lower cover; Sealing constitutes soaking plate around it, is filled with heat transfer liquids working medium in soaking plate inside, and characteristics are to be provided with upper cover plate sintering capillary wick and lower cover sintering capillary wick in the cavity between upper cover plate and lower cover; Said lower cover inner bottom surface is distributed with the stress absorption ring of a plurality of support columns and a plurality of sunk structures, offers a plurality of support column installing holes that supply support column to pass on said upper cover plate sintering capillary wick and the lower cover sintering capillary wick; The lower surface of said lower cover sintering capillary wick is distributed with the boss of the recess corresponding matching of a plurality of and stress absorption ring.This boss is in sintering process, to form naturally.
Support column is the hollow cylinder structure, is filled with capillary wick in it.
This stress absorption ring space is between each support column that the five rings shape is distributed in the lower cover upper surface.The five rings shape distributes and is specially, and four on every side, one at middle part.
Offer the liquid injection pipe connector at the edge of upper cover plate or lower cover.Be connected with liquid injection pipe at the liquid injection pipe connector, liquid injection pipe adopts the mode of soldering to be connected with the liquid injection pipe connector.
Said upper cover plate sintering capillary wick and lower cover sintering capillary wick make for the copper powder sintering, and the copper powder kenel is a dendroid, a kind of or two kinds of mixing in spherical.
Between said upper cover plate and the lower cover be connected and support column and upper cover plate and lower cover between be connected, all adopt the mode of sintering diffusion welding (DW) to connect.
Said heat transfer liquids working medium is ionized water, ethanol or methyl alcohol.
For heat conduction better, said upper cover plate, lower cover are copper.Also can adopt other metals.
The beneficial effect of the utility model is:
1, the layout of support column and stress absorption ring; Form the compartmentalization layout; Make the gap location between support column can contact thermal source as far as possible; Avoid traditional soaking plate to increase supporting construction lower cover has been strengthened the boiling structural damage, also made soaking plate under the application scenario of many thermals source, have good uniform temperature.
2, the inner capillary wick of support column; The gas phase working medium that its outside is produced by evaporation section abrim during work; Gas phase working medium touches colder upper cover plate zone, and release heat is condensed into the capillary force that is produced by the inner capillary wick of support column again behind the liquid working substance and gets back to evaporation section.Therefore, gas phase working medium and liquid working substance are shunted in vacuum chamber inside, can avoid the shear action between liquid gas interface, increase the heat-transfer capability of soaking plate.
3, the stress absorption ring of the gap location between the support column on the lower cover can reduce the stress that the soaking plate expanded by heating produces, and the inside of stress absorption ring need not to add support column, promptly can keep the planarization of upper cover plate, lower cover.
4, the utility model technological means is simple and easy to do, and is easy to utilize.
Description of drawings
Fig. 1 is the utility model assembly structure sketch map.
Fig. 2 is the utility model upper cover plate structural representation.
Fig. 3 is the utility model lower cover bottom surface structural representation.
Fig. 3 a is the sectional structure sketch map of lower cover bottom surface when not having support column.
Fig. 4 is the structural representation of the utility model support column.
Fig. 5 is the boss 3b sketch map when (for ease of more clear embodiment structure) up on the utility model lower cover sintering capillary wick.In sintering process, boss 3b is corresponding with stress absorption ring 5.The forming process of boss 3b can be by the copper powder that is scattered in the stress absorption ring 5, forms naturally through oversintering.
Embodiment
Do further detailed explanation in the face of the embodiment of the utility model down, but the execution mode of the utility model is not limited thereto.
As shown in Figure 1; The soaking plate of sintering structure support column in the utility model band; Comprise upper cover plate 1, lower cover 4, constitute cavity between upper cover plate 1 and the lower cover 4, sealing constitutes soaking plate around it; Be filled with heat transfer liquids working medium in soaking plate inside; Be provided with upper cover plate sintering capillary wick 2 and lower cover sintering capillary wick 3 in the cavity between upper cover plate 1 and lower cover 4, said lower cover 4 inner bottom surfaces are distributed with the stress absorption ring 5 of a plurality of support columns 6 and a plurality of sunk structures, offer a plurality of support column installing hole 3a that supply support column 6 to pass on said upper cover plate sintering capillary wick 2 and the lower cover sintering capillary wick 3;
The lower surface of said lower cover sintering capillary wick 3 is distributed with the boss 3b of the recess corresponding matching of a plurality of and stress absorption ring 5.This boss 3b forms in sintering process naturally.
As shown in Figure 5.Support column 6 is the hollow cylinder structure, is filled with capillary wick 6a in it.
Like Fig. 1, Fig. 3, shown in Figure 5.These stress absorption ring 5 spaces are between each support column 6 that the five rings shape is distributed in lower cover 4 upper surfaces.
As shown in Figure 3.The five rings shape of stress absorption ring 5 distributes and is specially, and four on every side, one at middle part.Certainly can also adopt other distribution of shapes.Stress absorption ring 5 can adopt the method for punching press to form.
As shown in Figure 2.There is a liquid injection pipe connector 1a in edge at upper cover plate 1; Certainly, this liquid injection pipe connector 1a also can be arranged on the edge of lower cover 4.
Said upper cover plate sintering capillary wick 2 and lower cover sintering capillary wick 3 be for the copper powder sintering makes, and the copper powder kenel is a dendroid, a kind of mixed sintering in spherical, also can be that two kinds of mixed sinterings form.This upper cover plate sintering capillary wick 2 also can adopt the metallic particles sintering of other shapes to form with lower cover sintering capillary wick 3.
Between said upper cover plate 1 and the lower cover 4 be connected and support column 6 and upper cover plate 1 and lower cover 4 between be connected, all adopt the mode of sintering diffusion welding (DW) to connect; Said liquid injection pipe connector 1a is connected with liquid injection pipe, and liquid injection pipe adopts the mode of soldering to be connected with liquid injection pipe connector 1a.Liquid injection pipe is used for soaking plate inside is vacuumized and pour into worker quality liquid.
Said upper cover plate 1, lower cover 4 also can adopt other metal materials for can adopt copper material.
As shown in Figure 2, upper cover plate 1 is the cavity shape, can be through drawing.
As shown in Figure 4, support column 6 inner capillary wick 6a make gas phase working medium separate with heat transfer liquids working medium.This capillary wick 6a can adopt dendroid, a kind of mixed sintering in spherical, and perhaps two kinds of mixed sinterings form, and also can adopt the metallic particles sintering of other shapes to form.
Said capillary wick 6a, and upper cover plate sintering capillary wick 2 is 100～300 orders with lower cover sintering capillary wick 3 selected copper powder order numbers;
Just can realize the utility model preferably as stated.The above is merely the utility model preferred embodiment; Can not limit the scope that the utility model is implemented with this; The equivalence of promptly doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (5)
1. the soaking plate of sintering structure support column in the band; Comprise upper cover plate, lower cover; Constitute cavity between upper cover plate and the lower cover; Sealing constitutes soaking plate around it, is filled with heat transfer liquids working medium in soaking plate inside, it is characterized in that: be provided with upper cover plate sintering capillary wick and lower cover sintering capillary wick in the cavity between upper cover plate and lower cover; Said lower cover inner bottom surface is distributed with the stress absorption ring of a plurality of support columns and a plurality of sunk structures, offers a plurality of support column installing holes that supply support column to pass on said upper cover plate sintering capillary wick and the lower cover sintering capillary wick; The lower surface of said lower cover sintering capillary wick is distributed with the boss of the recess corresponding matching of a plurality of and stress absorption ring.
2. the soaking plate of sintering structure support column in the band according to claim 1, it is characterized in that: support column is the hollow cylinder structure, is filled with capillary wick in it.
3. the soaking plate of sintering structure support column in the band according to claim 2 is characterized in that: this stress absorption ring space is between each support column that the five rings shape is distributed in the lower cover upper surface.
4. the soaking plate of sintering structure support column in the band according to claim 3 is characterized in that: the five rings shape of said stress absorption ring distributes and is specially, and four on every side, one at middle part.
5. according to the soaking plate of sintering structure support column in each described band in the claim 1～4, it is characterized in that: offer the liquid injection pipe connector at the edge of upper cover plate or lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200907392U CN202514230U (en) | 2012-03-12 | 2012-03-12 | Vapor chamber with inner-sintered structured support columns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200907392U CN202514230U (en) | 2012-03-12 | 2012-03-12 | Vapor chamber with inner-sintered structured support columns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514230U true CN202514230U (en) | 2012-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200907392U Withdrawn - After Issue CN202514230U (en) | 2012-03-12 | 2012-03-12 | Vapor chamber with inner-sintered structured support columns |
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| Country | Link |
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| CN (1) | CN202514230U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595861A (en) * | 2012-03-12 | 2012-07-18 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
| WO2019056506A1 (en) * | 2017-09-19 | 2019-03-28 | 华为技术有限公司 | Thin type heat uniformizing plate formed by stamping process |
| WO2021046827A1 (en) * | 2019-09-12 | 2021-03-18 | 华为技术有限公司 | Heat-homogenizing plate, heat sink and terminal |
| CN113340138A (en) * | 2021-07-02 | 2021-09-03 | 珠海德标光电科技有限公司 | Vapor chamber based on evaporation-boiling conversion and preparation method |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN114719645A (en) * | 2022-04-18 | 2022-07-08 | 广东英维克技术有限公司 | Vapor chamber and forming process thereof |
-
2012
- 2012-03-12 CN CN2012200907392U patent/CN202514230U/en not_active Withdrawn - After Issue
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595861A (en) * | 2012-03-12 | 2012-07-18 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
| CN102595861B (en) * | 2012-03-12 | 2014-12-31 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
| CN107421364B (en) * | 2017-06-09 | 2020-08-25 | 陈翠敏 | Temperature equalizing plate structure and manufacturing method thereof |
| WO2019056506A1 (en) * | 2017-09-19 | 2019-03-28 | 华为技术有限公司 | Thin type heat uniformizing plate formed by stamping process |
| CN112868275A (en) * | 2019-09-12 | 2021-05-28 | 华为技术有限公司 | Vapor chamber, heat sink, and terminal |
| WO2021046827A1 (en) * | 2019-09-12 | 2021-03-18 | 华为技术有限公司 | Heat-homogenizing plate, heat sink and terminal |
| EP3836766A4 (en) * | 2019-09-12 | 2021-10-27 | Huawei Technologies Co., Ltd. | Heat-homogenizing plate, heat sink and terminal |
| CN112868275B (en) * | 2019-09-12 | 2022-09-16 | 华为技术有限公司 | Vapor chamber, heat sink, and terminal |
| CN113357953A (en) * | 2021-04-28 | 2021-09-07 | 西安交通大学 | Immersed liquid-cooled sintered porous capillary core coupling microchannel heat dissipation device |
| CN113340138A (en) * | 2021-07-02 | 2021-09-03 | 珠海德标光电科技有限公司 | Vapor chamber based on evaporation-boiling conversion and preparation method |
| CN114719645A (en) * | 2022-04-18 | 2022-07-08 | 广东英维克技术有限公司 | Vapor chamber and forming process thereof |
| CN114719645B (en) * | 2022-04-18 | 2024-05-17 | 广东英维克技术有限公司 | Vapor chamber and molding process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20121031 Effective date of abandoning: 20141231 |
|
| RGAV | Abandon patent right to avoid regrant |