CN100493322C - Groove-type flat-plate heat pipe soaking device - Google Patents
Groove-type flat-plate heat pipe soaking device Download PDFInfo
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- CN100493322C CN100493322C CNB2007100646983A CN200710064698A CN100493322C CN 100493322 C CN100493322 C CN 100493322C CN B2007100646983 A CNB2007100646983 A CN B2007100646983A CN 200710064698 A CN200710064698 A CN 200710064698A CN 100493322 C CN100493322 C CN 100493322C
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- heat pipe
- conduit
- groove
- soaking device
- plate heat
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Abstract
A heat equalizer of flat plate heat tube with groove-channel is prepared as designing multiple groove-channel structure and heat tube bottom base plate to be an integral unit, using groove-channel end being set in saw tooth form and being used to connect with boiling pool as well as boiling intensification action of groove-channel to greatly raise boiling heat exchange efficiency, contacting convex platform with top cover bottom surface to intensify axial heat conduction of said heat tube and welding bottom base plate of heat equalizing plate with top cover plate.
Description
Technical field
The present invention relates to a kind of groove-type flat-plate heat pipe soaking device, can be applied in the dissipation from electronic devices device.
Background technology
The trend of electronic chip miniaturization and golf calorific value, make the heat radiation of electronic equipment show out following distinguishing feature especially: (1) local heat flux density is very big, and heat is assembled in the part easily, causes local temperature too high.(2) density of heat flow rate skewness, high heat flux mostly just is confined in the very little spatial dimension.(3) in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.(4) it is not very big needing lost total heat flow.So the key that solves the electronic equipment cooling is how to reduce too high local heat flux density, prevents focus and cause equipment fault.In order to strengthen radiating effect, generally all can on electronic chip, install one additional than much bigger heat sink of chip volume.Be easy to like this produce focus at chip surface.And make the heat sink bigger diffusion thermal resistance that has, and the density of heat flow rate on the inner section distributes very inhomogeneous, and heat sink radiating effect has been subjected to certain influence.
Now in order to prevent that electronic chip inside is owing to the basic means that heat accumulation produces focus is still the solid fine copper plate soaking device that has high thermal conductivity coefficient in the chip surface attaching, the inner heat that produces of electronic chip is drawn out on the heat radiator fin in heat conducting mode, and the convection action that relends fin and its surrounding air is imported heat in the air-flow into and is taken away (as shown in Figure 1).Solid fine copper plate soaking device can play to a certain extent heat flow is evenly distributed, and eliminates the effect of focus.But because the conductive coefficient of copper is limited, its equal thermal effect is not very obvious.If adopt the superconduction hot material of diamond and so on to make soaking device, its expensive price will make it be difficult to spread in the practical application.Therefore the flat plate heat pipe type soaking device has been proposed.
The flat plate heat pipe type soaking device can make density of heat flow rate be tending towards evenly to greatest extent, and this is because it has utilized the principle of heat pipe high-efficiency heat conduction.Heat pipe is known one of the most effective heat transfer element, and it can transmit a large amount of heats at a distance by very little sectional area and need not additionaling power.One end of heat pipe is an evaporation section, and the other end is a condensation segment.The vaporization of liquid evaporation when an end of heat pipe is heated in the capillary wick, steam flow to the other end and emit heat and condense into liquid under small pressure reduction, liquid flows back to evaporation section along porous material by the effect of capillary force again.So move in circles, heat reaches the other end by an end of heat pipe.Traditional heat pipe can be divided into according to the difference of inside heat pipe capillary structure: silk screen heat pipe, conduit heat pipe and sintered heat pipe in a tubular form.Flat-plate heat pipe soaking device is a kind of special-shaped heat pipe, and its condensation segment and evaporation section are replaced by two planes (evaporating surface and cryosurface), are called flat hot pipe again.In this heat pipe,, but be parallel to small-sized on the direction of heat flow bigger perpendicular to the size on the direction of heat flow.Distance between evaporating surface and the cryosurface generally has only several millimeters.Just because of this special shape of flat-plate heat pipe, brought difficulty for the fabrication and processing of flat-plate heat pipe and the layout in inner capillary loop: the area of (1) evaporating surface and cryosurface is bigger, vacuumizing, producing distortion in sintering and the welding process easily, must keep the shape of heat pipe by increase wall thickness and inner support.(2) in order to reduce the volume and weight of radiator, general soaking device integral thickness is 4mm.The internal cavity height has only 1 to 2mm.So narrow space has brought difficulty for the layout in traditional capillary structure loop, does not have enough capillary pressures that flat-plate heat pipe was lost efficacy under the antigravity condition.(3) red copper itself has stronger capacity of heat transmission.When flat-plate heat pipe thickness is 4mm, compare with unidimensional copper plate, heat of transformation conduction axis has not been fairly obvious to the advantage of the capacity of heat transmission.It is advantageous that radially heat conduction, just have well all thermal effects.
Summary of the invention
The present invention is intended to solve in the flat-plate heat pipe soaking device course of processing wall and easily produces shortcomings such as distortion, capillary structure are difficult to form the loop and axially thermal resistance is bigger.A kind of groove-type flat-plate heat pipe soaking device is proposed.The present invention can make soaking device have the stronger axially and radially capacity of heat transmission, and can work under the antigravity condition.
The technical solution adopted in the present invention is referring to Fig. 2.Groove-type flat-plate heat pipe soaking device is welded by upper cover plate 4 and lower shoe 9.Topping up hole 5 is left in upper cover plate 4 sides.On the protrusion platform of lower shoe 9, process many radial rectangular ducts 8.The degree of depth of conduit 8 is identical with the height that protrudes platform, and width is less than 0.5mm.The protrusion table top of lower shoe 9 and upper cover plate 4 bottom connections touch, and leave between the side of protrusion platform and the flat-plate heat pipe sidewall and hold the liquid path 10.The boiling pool 7 that conduit 8 is interior with protruding platform and the liquid path 10 that holds of side communicate.The position of boiling pool 7 should be corresponding with the contact position of electronic chip and soaking plate.In heat pipe when work,, working medium is seethed with excitement in the nearer conduit 8 in boiling pool 7 with apart from thermal source.The steam that produces moves to the bottom of upper cover plate 4 along conduit, and condenses, and emits heat.The liquid that freeze-outs returns near the boiling once more boiling pool 7 under the effect of conduit capillary force, finish the phase transformation cyclic process of working medium.If the working medium that charges into is more, unnecessary working medium can be entered by the motive force of steam to be held in the liquid path 10, and more than liquid just can not produce the shuttling movement of working medium and hinder like this.When the heat radiation power of thermal source strengthened, heat pipe needed more working medium to keep circulation time, and the effect meeting of capillary force sucks back working medium in the conduit from holding the liquid path 10 again.End that is sawtooth pattern that conduit 8 is connected with boiling pool 7 and conduit itself all tool are strengthened the effect of boiling, so can greatly improve boiling heat transfer efficient.The design of radial multi-channel will be bigger the heat pipe vapor chamber with a large amount of conduit replacements, strengthened the effect of capillary force, make the phase transformation shuttling movement of working medium more smooth and easy, thereby flat-plate heat pipe can be worked under the antigravity condition.The stability of flat-plate heat pipe shape has been strengthened in the integrated design of capillary structure and heat pipe lower shoe, makes thinner that flat-plate heat pipe can do.Protrude platform and contact, not only played supporting role, also strengthened the axial thermal conductivity of flat-plate heat pipe with the upper cover plate bottom surface.This soaking plate directly is welded by lower shoe and upper cover plate, has saved the loaded down with trivial details courses of processing such as sintering, layout silk screen, helps the implementation that abrasive tool moulding is produced in batches, has broad application prospects.
Beneficial effect of the present invention:
1. the stability of flat-plate heat pipe shape has been strengthened in the integrated design of capillary structure and heat pipe lower shoe, makes thinner that flat-plate heat pipe can do.
2. radial multi-channel design has strengthened the effect of capillary force, makes the phase transformation shuttling movement of working medium more smooth and easy, thereby flat-plate heat pipe can be worked under the antigravity condition.
3. protrude platform and contact, not only played supporting role, also strengthened the axial thermal conductivity of flat-plate heat pipe with the upper cover plate bottom surface.
4. end that is sawtooth pattern that conduit is connected with boiling pool and conduit itself all tool are strengthened the effect of boiling, so can greatly improve the performance of soaking device.
5. holding the liquid passage can store unnecessary working medium, makes it can not produce the shuttling movement of working medium to hinder.
Description of drawings
Fig. 1: the application mode of soaking device;
Fig. 2: collar plate shape groove-type flat-plate heat pipe soaking device internal structure schematic diagram;
Fig. 3: the conduit with stronger heat exchange effect is arranged schematic diagram;
Fig. 4: thermal source is positioned at the square type groove-type flat-plate heat pipe soaking device conduit at center and arranges schematic diagram;
Fig. 5: thermal source is not positioned at the square type groove-type flat-plate heat pipe soaking device conduit at center and arranges schematic diagram;
Label is among Fig. 1～Fig. 5: 1. fin is heat sink, 2. soaking device, and 3. electronic chip, 4. upper cover plate, 5. topping up hole, 6. weld seam, 7. boiling pool, 8, conduit, 9. lower shoe 10. holds the liquid passage, 11. annular channels, 12. main body conduits, 13. outer ring conduits.
Embodiment
In actual applications, the profile of upper cover plate 4 of the present invention and lower shoe 9 is identical with the bottom surface shape of fin heat sink 1, and promptly the concrete shape of groove-type flat-plate heat pipe soaking device should be identical with the bottom surface shape of fin heat sink 1.Specifically can be divided into two kinds in disc and rectangle.The position in flat-plate heat pipe soaking device inner ebullition pond 7 also should be corresponding with the installation site of electronic chip 3.The size dimension of boiling pool 7 should be less than the size of electronic chip 3.
Specify embodiments of the invention below in conjunction with accompanying drawing:
Equivalent diameter is the electronic chip of 20mm when being positioned at the soaking device center, and the concrete structure of disc groove-type flat-plate heat pipe soaking device can be referring to Fig. 2.The wall thickness of groove-type flat-plate heat pipe soaking device is 1mm, and the protrusion platform height on the lower shoe 9 is 2mm, and therefore the thickness of whole groove-type flat-plate heat pipe soaking device has only 4mm.The diameter of section of soaking device is identical with heat sink 1 bottom surface of fin.Leave width between protrusion platform side on the lower shoe 9 and the heat pipe wall and be the annular of 1.5mm and hold the liquid path 10.It is boiling 7 ponds of 10mm that there is diameter at protrusion platform center.Conduit 8 wide 0.2mm, symmetric arrays radially, the angle between the adjacent conduit is 3 °.For the conduit spread pattern strengthening the heat exchange effect, can adopt having stronger heat exchange effect as shown in Figure 3.This design is encrypted the conduit that protrudes the platform outer ring, and by an annular channel 11 outer ring conduit 13 and main body conduit 12 is coupled together, and makes flat-plate heat pipe have better all thermal effects.
The conduit arrangement of rectangular duct formula flat-plate heat pipe soaking device as shown in Figure 4 and Figure 5.Be respectively that electronic chip is positioned at the soaking device central point and in two kinds of situations of non-central point.
Claims (6)
1, groove-type flat-plate heat pipe soaking device comprises upper cover plate (4), lower shoe (9), topping up hole (5); Wherein, upper cover plate (4) is connected with lower shoe (9), topping up hole (5) is positioned at the side of upper cover plate (4), it is characterized in that: described lower shoe (9) is provided with the lower shoe all-in-one-piece and protrudes platform, protrude on the platform and be furnished with many radial conduits (8), be connected by the boiling pool of protruding in the platform (7) between the conduit (8), the bottom connection that protrudes table top and upper cover plate (4) touches.
2, groove-type flat-plate heat pipe soaking device according to claim 1 is characterized in that: leave between the sidewall of the side of described protrusion platform and upper cover plate (4) communicate with conduit (8) hold liquid passage (10).
3, groove-type flat-plate heat pipe soaking device according to claim 2 is characterized in that: the cross section of described conduit (8) is a rectangle, and the degree of depth of conduit (8) is identical with the height that protrudes platform, and width is less than 0.5mm.
4, groove-type flat-plate heat pipe soaking device according to claim 3 is characterized in that: the position of described boiling pool (7) is corresponding with the installation site of electronic chip, and the size of boiling pool (7) is less than the size of electronic chip (3).
5, according to each described groove-type flat-plate heat pipe soaking device in the claim 1 to 4, it is characterized in that:
The outer ring conduit (13) of described radial conduit (8) is the encryption conduit, and by an annular channel (11) outer ring conduit (13) and main body conduit (12) is coupled together.
6, groove-type flat-plate heat pipe soaking device according to claim 1 and 2 is characterized in that: the bottom surface shape of the profile heat sink with fin (1) of described upper cover plate (4) and lower shoe (9) is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100646983A CN100493322C (en) | 2007-03-23 | 2007-03-23 | Groove-type flat-plate heat pipe soaking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100646983A CN100493322C (en) | 2007-03-23 | 2007-03-23 | Groove-type flat-plate heat pipe soaking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101022718A CN101022718A (en) | 2007-08-22 |
| CN100493322C true CN100493322C (en) | 2009-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007100646983A Expired - Fee Related CN100493322C (en) | 2007-03-23 | 2007-03-23 | Groove-type flat-plate heat pipe soaking device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706193A (en) * | 2012-06-28 | 2012-10-03 | 华南理工大学 | Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof |
| CN110473847A (en) * | 2019-07-15 | 2019-11-19 | 广东合一新材料研究院有限公司 | A kind of flatwise chip radiator suitable for spraying liquid cooled server |
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| CN101466231B (en) * | 2007-12-21 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Radiating device |
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| CN102263151B (en) * | 2011-06-20 | 2013-07-17 | 于奎明 | Solar photovoltaic and optothermal integrated module |
| CN102967163A (en) * | 2012-11-29 | 2013-03-13 | 南京卡立得热能科技有限公司 | Thermal expansion board |
| CN103200803B (en) * | 2013-03-20 | 2015-12-02 | 西安交通大学 | A kind of heat radiation device for loop heat pipe having pool boiling |
| CN103542749B (en) * | 2013-10-15 | 2015-10-28 | 华南理工大学 | A kind of bionical soaking plate liquid-sucking core |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
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| CN104964374A (en) * | 2015-07-28 | 2015-10-07 | 珠海格力电器股份有限公司 | Radiation heat exchange board assembly |
| KR101983108B1 (en) * | 2015-12-18 | 2019-09-10 | 가부시키가이샤후지쿠라 | Vapor chamber |
| CN105890415B (en) * | 2016-05-26 | 2018-01-05 | 西安交通大学 | A kind of integral type heat radiation device for loop heat pipe with boiling pool |
| CN106152846B (en) * | 2016-07-09 | 2017-04-05 | 南京艾科美热能科技有限公司 | A kind of circulating gas-liquid two-phase flow phase change heat exchanger |
| CN110621953B (en) * | 2017-05-08 | 2022-04-01 | 开文热工科技公司 | Thermal management plane |
| CN107497505A (en) * | 2017-08-01 | 2017-12-22 | 中山大学 | Realize drop from the chip structure for transporting positioning using geometry wellability gradient |
| US10859323B2 (en) * | 2018-06-08 | 2020-12-08 | Cooler Master Co., Ltd. | Vapor chamber and manufacturing method for the same |
| CN109219326A (en) * | 2018-11-16 | 2019-01-15 | 广东工业大学 | A kind of spraying radiator |
| US20230292466A1 (en) | 2020-06-19 | 2023-09-14 | Kelvin Thermal Technologies, Inc. | Folding Thermal Ground Plane |
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2007
- 2007-03-23 CN CNB2007100646983A patent/CN100493322C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706193A (en) * | 2012-06-28 | 2012-10-03 | 华南理工大学 | Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof |
| CN102706193B (en) * | 2012-06-28 | 2014-07-02 | 华南理工大学 | Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof |
| CN110473847A (en) * | 2019-07-15 | 2019-11-19 | 广东合一新材料研究院有限公司 | A kind of flatwise chip radiator suitable for spraying liquid cooled server |
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| Publication number | Publication date |
|---|---|
| CN101022718A (en) | 2007-08-22 |
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Granted publication date: 20090527 Termination date: 20110323 |