CN202488885U - Printed circuit board (PCB) welded by surface mounting technology (SMT) - Google Patents
Printed circuit board (PCB) welded by surface mounting technology (SMT) Download PDFInfo
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- CN202488885U CN202488885U CN2012200793315U CN201220079331U CN202488885U CN 202488885 U CN202488885 U CN 202488885U CN 2012200793315 U CN2012200793315 U CN 2012200793315U CN 201220079331 U CN201220079331 U CN 201220079331U CN 202488885 U CN202488885 U CN 202488885U
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- smd
- pcb
- smt
- mount device
- surface mount
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Abstract
The utility model discloses a printed circuit board (PCB) welded by surface mounting technology (SMT). The PCB comprises a board body and a surface mounted device (SMD), two strip-type SMD adhesive layers are printed between the two pads of the SMD, and the SMD is adhered to the board body through the SMD adhesive layers. The SMD adhesive is coated on the PCB body by printing, so the SMD adhesive layer is thin and uniform; due to the two strip-type SMD adhesive layers, the adhered SMD is flat and firm and does not bear stress, so that quality problems such as tilting of the SMD, and suspending, breaking off, insufficient solder and even falling off of welding legs during welding, packaging, transportation and use.
Description
Technical field
The utility model belongs to printed substrate field and SMT welding technology field, relates in particular to a kind of pcb board of SMT welding.
Background technology
SMT is surface installation technique (surface mounting technology), is most popular a kind of technology and technology in the present electronics assembling industry.SMT comprises two kinds of diverse technologies, a kind of use solder(ing) paste; The another kind of glue that uses is normally defined Heraeus, and the SMT Heraeus is the special adhesive that is applied to surface-assembled, is called surface-assembled again with binding agent, Heraeus, red glue.Before a kind of technology be solder(ing) paste to be coated on the PCB through half tone, after surface mount device (SMD) installation, accomplish to connect with Reflow Soldering.Second kind of technology is used in existing SMD usually, has again on the mixed type PCB of connector.Connector is connected with PCB through wave-soldering, and hot melt scolding tin is filled out between component pin and insert hole fixing to be connected in wave-soldering.The also available identical wave-soldering technology of SMD, but element must be bonded in pcb board bottom is fallen sheet when preventing wave-soldering, and this bonding process is a committed step.
Heraeus is used for SMD is bonded on the PCB, adopts the method for syringe-type point glue to accomplish the coating of binding agent on pcb board usually.Adopt some glue coated structure such as Fig. 4, shown in Figure 5; Surface mount device 4 is bonded on the pcb board body 1 through paster glue-line 22; Paster glue-line 22 is between two pads 21 of surface mount device 4; But its paster glue-line 22 is generally point-like and thickness thicker and inhomogeneous (thick middle around thin), like this when bonding, welding and packed and transported, causes easily that surface mount device 4 tilts, leg is unsettled, fractures, rosin joint even come off.
Summary of the invention
In order to solve above-mentioned technical problem; The purpose of the utility model provides a kind of pcb board of SMT welding; Employing steel mesh mode of printing coating Heraeus and gluing of surfaces mount device and carry out the crest welding and process; Surface mount device is bonding firmly smooth, can not occur that surface mount device tilts, leg is unsettled, fractures, rosin joint even quality problems such as come off.
In order to reach above-mentioned purpose, the technical scheme below the utility model has adopted:
A kind of pcb board of SMT welding comprises plate body and surface mount device, between two pads of surface mount device, is printed with the paster glue-line of two strips on the said plate body, and said surface mount device is bonded on the plate body through this paster glue-line.
As preferably, described two paster glue-lines are positioned at the both sides of said surface mount device.
The utility model is owing to adopted above technical scheme; Heraeus adopts mode of printing to be coated on the pcb board body; The Heraeus layer thickness is thin and even like this; Adopt the paster glue-line of two strips can make that bonding surface mount device is firmly smooth and do not meet with stresses, thus can not occur in welding, packed and transported and use that surface mount device tilts, leg is unsettled, fracture, rosin joint even quality problems such as come off.
Description of drawings
Fig. 1 is the structural representation of embodiment 1.
Fig. 2 is the bonded structure sketch map (side-looking) of embodiment 1 surface patch device.
Fig. 3 is the bonded structure sketch map (overlooking) of embodiment 1 surface patch device.
Fig. 4 is the gluing structural representation that connects of prior art mid point (side-looking).
Fig. 5 is the gluing structural representation that connects of prior art mid point (overlooking).
Embodiment
Below in conjunction with accompanying drawing the embodiment of the utility model is done a detailed explanation.
Embodiment 1: like the pcb board of Fig. 1, Fig. 2, a kind of SMT welding shown in Figure 3; Comprise plate body 1 and surface mount device 4; Between two pads 21 of surface mount device 4, be printed with the paster glue-line 22 of two strips on the said plate body 1, said surface mount device 4 is bonded on the plate body 1 through this paster glue-line 22.Described two paster glue-lines 22 are positioned at the both sides of said surface mount device 4.Also be provided with a plurality of via holes 3 (through hole) on the said plate body 1.
Claims (2)
1. the pcb board of SMT welding; Comprise plate body (1) and surface mount device (4); It is characterized in that; Said plate body (1) is gone up the paster glue-line (22) that between two pads (21) of surface mount device (4), is printed with two strips, and said surface mount device (4) is bonded on the plate body (1) through this paster glue-line (22).
2. the pcb board of a kind of SMT welding according to claim 1 is characterized in that described two paster glue-lines (22) are positioned at the both sides of said surface mount device (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200793315U CN202488885U (en) | 2012-03-05 | 2012-03-05 | Printed circuit board (PCB) welded by surface mounting technology (SMT) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200793315U CN202488885U (en) | 2012-03-05 | 2012-03-05 | Printed circuit board (PCB) welded by surface mounting technology (SMT) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202488885U true CN202488885U (en) | 2012-10-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200793315U Expired - Fee Related CN202488885U (en) | 2012-03-05 | 2012-03-05 | Printed circuit board (PCB) welded by surface mounting technology (SMT) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202488885U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029506A (en) * | 2014-05-20 | 2014-09-10 | 海门市曼博莱电子发展有限公司 | SMT chip-mounting technology |
| CN105451458A (en) * | 2014-08-19 | 2016-03-30 | 宁波舜宇光电信息有限公司 | Method for controlling trace deformation of rigid-flex board and PCB substrate semi-finished product |
| CN106163131A (en) * | 2015-04-14 | 2016-11-23 | 艾默生网络能源有限公司 | The hybrid process technique of surface mount elements and pcb board |
| CN107592734A (en) * | 2017-08-28 | 2018-01-16 | 广东欧珀移动通信有限公司 | Circuit board assemblies, housing unit and electronic equipment |
| CN108260297A (en) * | 2017-12-29 | 2018-07-06 | 深圳市兴森快捷电路科技股份有限公司 | A kind of method and system for improving point glue surface Chip patch yields |
| CN108901144A (en) * | 2018-07-17 | 2018-11-27 | 天津瑞爱恩科技有限公司 | Enhance the method for printed wiring board rigid-flex combined strength |
| CN114641150A (en) * | 2022-03-25 | 2022-06-17 | 深圳市兆兴博拓科技股份有限公司 | Circuit board mounting method based on dispensing optimization |
-
2012
- 2012-03-05 CN CN2012200793315U patent/CN202488885U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029506A (en) * | 2014-05-20 | 2014-09-10 | 海门市曼博莱电子发展有限公司 | SMT chip-mounting technology |
| CN105451458A (en) * | 2014-08-19 | 2016-03-30 | 宁波舜宇光电信息有限公司 | Method for controlling trace deformation of rigid-flex board and PCB substrate semi-finished product |
| CN106163131A (en) * | 2015-04-14 | 2016-11-23 | 艾默生网络能源有限公司 | The hybrid process technique of surface mount elements and pcb board |
| CN107592734A (en) * | 2017-08-28 | 2018-01-16 | 广东欧珀移动通信有限公司 | Circuit board assemblies, housing unit and electronic equipment |
| CN108260297A (en) * | 2017-12-29 | 2018-07-06 | 深圳市兴森快捷电路科技股份有限公司 | A kind of method and system for improving point glue surface Chip patch yields |
| CN108901144A (en) * | 2018-07-17 | 2018-11-27 | 天津瑞爱恩科技有限公司 | Enhance the method for printed wiring board rigid-flex combined strength |
| CN114641150A (en) * | 2022-03-25 | 2022-06-17 | 深圳市兆兴博拓科技股份有限公司 | Circuit board mounting method based on dispensing optimization |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 Termination date: 20150305 |
|
| EXPY | Termination of patent right or utility model |