CN202463054U - Copper-clad plate with function of absorbing electromagnetic waves - Google Patents
Copper-clad plate with function of absorbing electromagnetic waves Download PDFInfo
- Publication number
- CN202463054U CN202463054U CN2012200983023U CN201220098302U CN202463054U CN 202463054 U CN202463054 U CN 202463054U CN 2012200983023 U CN2012200983023 U CN 2012200983023U CN 201220098302 U CN201220098302 U CN 201220098302U CN 202463054 U CN202463054 U CN 202463054U
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- Prior art keywords
- copper
- clad plate
- electromagnetic wave
- electromagnetic
- layer
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Abstract
The utility model discloses a copper-clad plate with the function of absorbing electromagnetic waves. The copper-clad plate adopts a layered structure and comprises an electromagnetic wave absorbing material layer and a copper foil layer. The copper-clad plate has the benefits as follows: the anti-electromagnetic interference manner in the design of a circuit board is changed, electromagnetic shielding is changed into electromagnetic absorption, the structure is simple, and the anti-interference capability is high.
Description
Technical field
The utility model relates to the structure for covering copper plate that a kind of circuit board manufacturing is used.
Background technology
In electronic equipment, the electromagnetic interference that ubiquity is a large amount of, this use to equipment brings very big influence.At present in electronic equipment and electronic product to the inhibition method of electromagnetic interference, be that conductibility coupling electromagnetic interference is adopted filtering technique, promptly adopt electromagnetic interface filter spare to suppress; Radiativity coupling electromagnetic interference is then adopted shield technology.
Make the field at wiring board at present, to radiativity coupling electromagnetic interference, the main inhibition method that adopts is to use the copper-clad plate with electromagnetic wave shielding function.
Electromagnetic shielding is through shields such as the shell that is made of metal, box, plates, and electromagnetic wave is confined to a kind of method in a certain zone.In the electromagnetic shielding scheme; A large amount of leakages (particularly when the size in slit is suitable with the electromagnetic wave half-wavelength) of electromagnetic energy all may be caused in very little slit; So no matter be electric field shielding or magnetic field shielding, all need set up the Faradic electricity cage, promptly adopt full-closed structure; And in order to prevent secondary radiation, also need be with shielding construction ground connection.
The utility model content
The purpose of the utility model is, overcomes the complex structure that copper-clad plate employing electromangnetic spectrum causes in the prior art, the deficiency of anti-interference weak effect, and a kind of copper-clad plate with electromagnetic wave absorption function is provided.
The technical scheme that the utility model adopts is following:
Copper-clad plate with electromagnetic wave absorption function is layer structure, comprises electromagnetic wave absorbent material layer and copper foil layer.
Preferably, said copper foil layer is one deck.
Preferably, said copper foil layer is two-layer, is located at the upper and lower surfaces of electromagnetic wave absorbent material layer respectively.
Preferably, said electromagnetic wave absorbent material layer comprises glass fiber paper layer, and its surfaces coated is covered with the electro-magnetic wave absorption glue-line.
The beneficial effect of the utility model is, has changed the mode of anti-electromagnetic interference in the board design, changes electromagnetic absorption into by electromagnetic shielding, and is simple in structure, and antijamming capability is strong.
Description of drawings
Fig. 1 is the structural representation of an embodiment copper-clad plate of the utility model.
Fig. 2 is the structural representation of another embodiment copper-clad plate.
Fig. 3 is the manufacture craft schematic flow sheet of copper-clad plate.
The specific embodiment
Referring to Fig. 1, in an embodiment of the utility model, employing be the copper-clad plate that single face has the electromagnetic absorption function, constitute by one deck electromagnetic wave absorbent material layer 1 and one deck copper foil layer 2.
In another embodiment of Fig. 2, employing be two-sided copper-clad plate with electromagnetic absorption function, constitute by one deck electromagnetic wave absorbent material layer 1 and two-layer copper foil layer 2, two-layer copper foil layer 2 is located at the upper and lower surfaces of electromagnetic wave absorbent material layer 1 respectively.
Wherein, the structure of electromagnetic wave absorbent material layer 1, preferred, comprise glass fiber paper layer, its surfaces coated is covered with the electro-magnetic wave absorption glue-line.
Referring to Fig. 3, the utility model copper-clad plate preferred manufacturing procedure is:
(1) glue: according to the electromagnetic wave frequency range that will absorb different; Design the prescription of electromagnetic wave absorbent material layer 1 glue; Add resin, radio-radar absorber powder, curing agent, coupling agent, promoter etc. in the de-airing mixer according to a certain order according to prescription; Process the electro-magnetic wave absorption glue through fully mixing, treat next step use;
(2) gluing prepares the electromagnetic wave absorbent material layer: select all-glass paper according to designing requirement; Then through the gluing machine glue that coating step (1) prepares on all-glass paper; The process far infrared drying is processed the electromagnetic wave absorbent material layer of semi-solid preparation, treats next step use;
(3) folded material: when the manufacture order mask has the copper-clad plate of electromagnetic wave absorption function; On the semi-solid preparation electromagnetic wave absorbent material layer that step (2) is prepared; The folded copper foil layer of selecting according to designing requirement of going up, the semi-solid preparation electromagnetic wave absorbent material layer high temperature resistant polyvinyl fluoride of held one deck (PVF) film of preparing in step (2) (demoulding with); When producing two-sided copper-clad plate with electromagnetic wave absorption function,, treat next step use at the folded respectively copper foil layer of selecting according to designing requirement of going up of semi-solid preparation electromagnetic wave absorbent material layer upper and lower surfaces that step (2) is prepared;
(4) pressing finished product: the material that step (3) is folded places in the vacuum hotpressing machine, according to the thermograde and the barometric gradient that design, warming and pressurizing.Through above-mentioned steps (1), (2), (3), (4) step, process copper-clad plate at last with electromagnetic wave absorption function.
Through just realizing " having the copper-clad plate of electromagnetic wave absorption function " with above-mentioned four steps.Compare with present wiring board with electromagnetic wave shielding function; The wiring board that the copper-clad plate of electromagnetic wave absorption function is made is " absorption " owing to what electromagnetic inhibition was adopted, does not exist in the electromagnetic shielding scheme; The phenomenon of a large amount of leakages (particularly when the size in slit is suitable with the electromagnetic wave half-wavelength) of electromagnetic energy all may be caused in very little slit; No matter also do not need is electric field shielding or magnetic field shielding, all need set up the Faradic electricity cage, promptly adopts full-closed structure; Need be in order not prevent secondary radiation yet, also need be with shielding construction ground connection.
To one skilled in the art, can make other various corresponding changes and deformation, and these all changes and deformation should belong within the protection domain of the utility model claim all according to the technical scheme and the design of above description.
Claims (4)
1. have the copper-clad plate of electromagnetic wave absorption function, it is characterized in that, be layer structure, comprise electromagnetic wave absorbent material layer and copper foil layer.
2. the copper-clad plate with electromagnetic wave absorption function as claimed in claim 1 is characterized in that, said copper foil layer is one deck.
3. the copper-clad plate with electromagnetic wave absorption function as claimed in claim 1 is characterized in that, said copper foil layer is two-layer, is located at the upper and lower surfaces of electromagnetic wave absorbent material layer respectively.
4. like each described copper-clad plate with electromagnetic wave absorption function in the claim 1 to 3, it is characterized in that said electromagnetic wave absorbent material layer comprises glass fiber paper layer, its surfaces coated is covered with the electro-magnetic wave absorption glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200983023U CN202463054U (en) | 2012-03-15 | 2012-03-15 | Copper-clad plate with function of absorbing electromagnetic waves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200983023U CN202463054U (en) | 2012-03-15 | 2012-03-15 | Copper-clad plate with function of absorbing electromagnetic waves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202463054U true CN202463054U (en) | 2012-10-03 |
Family
ID=46911246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200983023U Expired - Lifetime CN202463054U (en) | 2012-03-15 | 2012-03-15 | Copper-clad plate with function of absorbing electromagnetic waves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202463054U (en) |
-
2012
- 2012-03-15 CN CN2012200983023U patent/CN202463054U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee after: Shenzhen hi tech materials Limited by Share Ltd Address before: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee before: Shenzhen Kerui Electronic Industrial Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121003 |