CN202463041U - Aluminum-based copper-clad plate - Google Patents
Aluminum-based copper-clad plate Download PDFInfo
- Publication number
- CN202463041U CN202463041U CN2012200555868U CN201220055586U CN202463041U CN 202463041 U CN202463041 U CN 202463041U CN 2012200555868 U CN2012200555868 U CN 2012200555868U CN 201220055586 U CN201220055586 U CN 201220055586U CN 202463041 U CN202463041 U CN 202463041U
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- aluminium base
- clad plate
- copper
- layer
- insulating layer
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model relates to an aluminum-based copper-clad plate which comprises an aluminum-based plate layer, a heat conduction insulating layer, a copper foil layer and a release transparent film layer, wherein the aluminum-based plate layer is provided with a first press-fit surface and a second press-fit surface; the bottom surface of the heat conduction insulating layer is attached to the first press-fit surface of the aluminum-based plate layer; the copper foil layer is attached to the second press-fit surface of the aluminum-based plate layer; and the release transparent film layer is attached to the top surface of the heat conduction insulating layer.
Description
Technical field
The utility model relates to a kind of aluminium base copper-clad plate, is meant a kind of aluminium base copper-clad plate that utilizes the roll extrusion mode to produce especially.
Background technology
As everyone knows; Aluminium base copper-clad plate is the raw-material a kind of of aluminium base; It is that a kind of electronics glass cloth or other reinforcing material soak with resin; One side or two-sided covering with Copper Foil and a kind of board-like material of processing through hot pressing are called as copper-clad laminate, abbreviate aluminium base copper-clad plate as; Baseplate material during aluminium base copper-clad plate is made as printed circuit board; Printed circuit board is mainly played interconnection, insulation and support, transmission speed, energy loss and the characteristic impedance etc. of signal in the circuit are had very big influence, the processability in the performance of printed circuit board, quality, the manufacturing, manufacture level, manufacturing cost and long-term reliability and stability depend on aluminium base copper-clad plate to a great extent.
Aluminium base copper-clad plate manufacturing is a rising industry, and it follows the development of electronic information, communications industry, has vast potential for future development, the new and high technology that its manufacturing technology is a multidisciplinary mutual intersection, interpenetrate, mutually promote.It and electronics and information industry are particularly with printed circuit industry synchronized development, indivisible.Its progress and development, the innovation that always receives electronic system product, semiconductor fabrication, electronic mounting technology and printed circuit board manufacturing technology drives with development.
Development along with courage new industries such as LED illuminations; Especially LED illumination market scale promotes fast; Grow with each passing day as the demand of the aluminium base copper-clad plate of indispensable raw material in electron trade in the electron trade production; Especially the development of LED technology makes the brightness of led chip increasingly high; Specification requirements such as thermal conductivity factor to aluminium base copper-clad plate are increasingly high, and traditional semifastening sheet aluminium base copper-clad plate of producing now has been difficult to satisfy the requirement that its technology improves constantly, and the manufacture technology production capacity of traditional aluminium base copper-clad plate is low in addition, power consumption is big, equipment has high input and many shortcomings such as cost of equipment maintenance height; Be difficult to satisfy the great demand amount and the technological requirement that improves constantly in market in the future, and this is the major defect for prior art.
The utility model content
The utility model provides a kind of aluminium base copper-clad plate; The utility model adopts roller to press bonding mode to produce its small investment; Production technology is simple; Easy to operate, the end properties of producing can substitute the quality requirement that the traditional glass cloth is made aluminium base entirely, and this is the main purpose for the utility model.
The technical scheme that the utility model adopted is: a kind of aluminium base copper-clad plate; Comprise aluminium base flaggy, heat conductive insulating layer, copper foil layer and release transparent film layer; Wherein, this aluminium base flaggy has first stitching surface and second stitching surface, and the bottom surface of this heat conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy; This copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this heat conductive insulating layer.
This aluminium base flaggy is an alumina plate.This aluminium base flaggy also can be the aluminium nitride plate.In practical implementation, this heat conductive insulating layer is made up of the several layers insulating barrier.
The beneficial effect of the utility model is: it is thin to utilize the product of the utility model to have a glue-line; Reactance voltage is strong; Can make the heat of Copper Foil arrive aluminium sheet rapidly and play the heat conduction at a high speed and the effect of heat radiation, its production technology makes things convenient for, and use should technology can realize the high-speed production of not stopping; Broken away from the use semifastening sheet and supporting large laminator production equipment has high input/inefficient puzzlement.Advantages such as it is fast in the aluminium base copper-clad plate process speed of production to have solved this product, and operation is simple, and stability is good.
Description of drawings
Fig. 1 is the section of structure of the product in the utility model production process.
Fig. 2 is the section of structure of the aluminium base copper-clad plate of the utility model.
The specific embodiment
As shown in Figure 1; Section of structure for the product in the utility model production process; This production method adopt roller pressing and synchronously bonding mode with glue-line and copper film layer attached to producing on the aluminium base; Produce according to the method for the utility model and to have small investment, production technology is simple, convenience operation.
It specifically comprises following production stage:
The first step, adopt the mode pressing heat conductive insulating layers 20 of roll extrusion on aluminium base 10 surface.
This aluminium base 10 is that cold bundle or heat are pricked aluminium sheet, and this aluminium base 10 does not pass through the sealing of hole anodized.
Utilize laminating machine that this heat conductive insulating layer 20 is pressed together on these aluminium base 10 surfaces, obtain first step semi-finished product, the nip roll temperature of this laminating machine of control is between the 110-130 degree in the process of pressing, and the control pressing speed is at per minute 0.5-1.5 rice.
Need in the process of the pressing of the first step to guarantee that this heat conductive insulating layer 20 fits with this aluminium base 10 fully, the bubble Zhe that perhaps wrinkles can not occur.
The process of accomplishing pressing leaves standstill cool to room temperature with these first step semi-finished product afterwards, afterwards the release transparent film layer 21 on this heat conductive insulating layer 20 is peeled off.
Second the step, these first step semi-finished product in the first step are carried out exhaust and typing.
These first step semi-finished product that peel off release transparent film layer 21 in the first step are inserted in the heater, and control heater internal temperature is between the 140-150 degree, and the time of inserting is 9-10 minute, and these first step semi-finished product are incubated typing.
The 3rd step, press copper to handle to these first step semi-finished product in second step through after the typing.
At first, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine that Copper Foil 40 is pressed together on this aluminium base 10, obtain the 3rd step semi-finished product.
This Copper Foil 40 is pressed together on the other one side of this aluminium base 10 with respect to this heat conductive insulating layer 20.
The bowl temperature of this roller Copper Foil pressing machine of control is between the 130-150 degree in the pressing process in the 3rd step, and the pressure force of controlling this roller Copper Foil pressing machine is in the 5-10 kg/cm.
Then, the 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute.
Afterwards, the 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
In practical implementation, in the 3rd step, also can adopt the mode of concora crush to utilize spreader bar that Copper Foil 40 is pressed together on this aluminium base 10.
At first, adopt the mode of concora crush to utilize spreader bar that Copper Foil 40 is pressed together on this aluminium base 10, obtain the 3rd step semi-finished product.
The other one side that this Copper Foil 40 is laid on this aluminium base 10 with respect to this heat conductive insulating layer 20 is sent into spreader bar and is carried out pressing.
In the pressing process, pressing is partly vacuumized disposable the exerting pressure in back, the control pressure force is in the 35-45 kg/cm.
Then, the 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute.
Afterwards, the 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
Heater in second step and the 3rd step is baking box or continuous tunnel furnace.
In practical implementation, in the first step, can adopt this heat conductive insulating layer 20 of mode pressing several layers of roll extrusion on aluminium base 10 surfaces.
Under the situation of two-layer this heat conductive insulating layer 20 of pressing, the thickness of two-layer this heat conductive insulating layer 20 is 50 microns.
At two-layer this heat conductive insulating layer 20 of pressing when the thickness of two-layer this heat conductive insulating layer 20 is 50 microns simultaneously, utilize aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces.
Peel strength is 1.90N/mm after thermal stress, and sheet resistance is 7.8 * 10^9M Ω in the acceptance attitude, and the volume resistor rate is 7.2 * 10^8M Ω .m in the acceptance attitude; Thermal resistance is 0.48 ℃/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021; Thermal conductivity factor is 2W/m. ℃; 180S under 260 ℃ condition is not stratified, non-foaming for the tin of anti-immersed solder, and breakdown voltage is 3KV, and arc resistance is 280S.
The number of plies that in addition can be through controlling this heat conductive insulating layer 20 and thickness confirm to utilize the performance of the aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces.
The number of plies at this heat conductive insulating layer 20 is two-layer, and when its thickness was 50 microns, the breakdown voltage of aluminium base copper-clad plate was DC 3KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 ℃/W.
The number of plies at this heat conductive insulating layer 20 is three layers, and when its thickness was 75 microns, the breakdown voltage of aluminium base copper-clad plate was DC 4KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 ℃/W.
The number of plies at this heat conductive insulating layer 20 is four layers, and when its thickness was 100 microns, the breakdown voltage of aluminium base copper-clad plate was DC 5KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 ℃/W.
In practical implementation, also be attached with diaphragm 41 on this Copper Foil 40.
As shown in Figure 2; A kind of aluminium base copper-clad plate, it comprises aluminium base flaggy 1, heat conductive insulating layer 2, copper foil layer 3 and release transparent film layer 4, wherein; This aluminium base flaggy 1 has first stitching surface 11 and second stitching surface 12; The bottom surface of this heat conductive insulating layer 2 is fitted on this first stitching surface 11 of this aluminium base flaggy 1, and this copper foil layer 3 is fitted on this second stitching surface 12 of this aluminium base flaggy 1, and this release transparent film layer 4 is fitted on the end face of this heat conductive insulating layer 2.
This aluminium base flaggy 1, this heat conductive insulating layer 2, this copper foil layer 3 and this release transparent film layer 4 orders fit together and form this aluminium base copper-clad plate of the utility model.
This aluminium base flaggy 1 is that cold bundle or heat are pricked aluminium sheet, and this heat conductive insulating layer 2 is made up of the several layers insulating barrier in practical implementation.
In practical implementation, also be attached with diaphragm 5 on this Copper Foil 3.
Claims (4)
1. aluminium base copper-clad plate; It is characterized in that: comprise aluminium base flaggy, heat conductive insulating layer, copper foil layer and release transparent film layer; Wherein, this aluminium base flaggy has first stitching surface and second stitching surface, and the bottom surface of this heat conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy; This copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this heat conductive insulating layer.
2. a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: aluminium base flaggy is an alumina plate.
3. a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: aluminium base flaggy is the nitrogenize aluminium sheet.
4. a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: this heat conductive insulating layer is made up of the several layers insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200555868U CN202463041U (en) | 2012-02-21 | 2012-02-21 | Aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200555868U CN202463041U (en) | 2012-02-21 | 2012-02-21 | Aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202463041U true CN202463041U (en) | 2012-10-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200555868U Expired - Fee Related CN202463041U (en) | 2012-02-21 | 2012-02-21 | Aluminum-based copper-clad plate |
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| CN (1) | CN202463041U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
-
2012
- 2012-02-21 CN CN2012200555868U patent/CN202463041U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
| CN102602111B (en) * | 2012-02-21 | 2016-01-20 | 甄凯军 | Production method of a kind of aluminum-based copper-clad plate and products thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20180221 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |