CN202394972U - 肖特基整流桥 - Google Patents

肖特基整流桥 Download PDF

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Publication number
CN202394972U
CN202394972U CN2011205412669U CN201120541266U CN202394972U CN 202394972 U CN202394972 U CN 202394972U CN 2011205412669 U CN2011205412669 U CN 2011205412669U CN 201120541266 U CN201120541266 U CN 201120541266U CN 202394972 U CN202394972 U CN 202394972U
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China
Prior art keywords
schottky
rectifier bridge
utility
material sheet
model
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Expired - Lifetime
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CN2011205412669U
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English (en)
Inventor
吴慧国
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Changzhou Xinghai Electronic Limited by Share Ltd
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CHANGZHOU STAR SEA Technology CO LTD
CHANGZHOU STAR SEA ELECTRONICS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)

Abstract

本实用新型属于电子分立器件领域，特别涉及一种采用肖特基芯粒的整流桥。肖特基整流桥，其包括对称设置的第一框架料片和第二框架料片，其特征在于：还包括连接在第一框架料片和第二框架料片之间的肖特基芯粒，以及对肖特基芯粒进行保护的封装本体。本实用新型提供一种采用肖特基芯粒的肖特基整流桥，本实用新型具有反向恢复时间短，性能好，可靠性更好的优点。

Description

肖特基整流桥
技术领域
本实用新型属于电子分立器件领域，特别涉及一种采用肖特基芯粒的整流桥。
背景技术
在我们日常使用的家用电器中开关电源的使用频率非常的高，而整流桥是开关电源中必不可少的电子元器件之一。全球能源价格的不断上涨使得各行各业不得不认真考虑节能的问题。在各种节能方法中，提高开关电源的效率是一个重要的手段。
随着开关频率越来越高，开关损耗已经是不可忽视的因素，而普通的整流桥反向恢复时间达到1000ns以上，不能满足高效率开关电源的需要。而肖特基的反向恢复时间只是肖特基势垒电容的充、放电时间，完全不同于PN结的反向恢复时间。由于肖特基的反向恢复电荷非常少，故开关速度非常快，开关损耗也特别小，尤其适合于高频应用。
发明内容
针对上述技术问题，本实用新型提供一种采用肖特基芯粒的肖特基整流桥，本实用新型具有反向恢复时间短，性能好，可靠性更好的优点。
本实用新型通过以下技术方案实现：
肖特基整流桥，其包括对称设置的第一框架料片和第二框架料片，其特征在于：还包括连接在第一框架料片和第二框架料片之间的肖特基芯粒，以及对肖特基芯粒进行保护的封装本体。
所述的封装本体的材料为环氧塑封料。
综上所述，本实用新型通过运用肖特基芯粒替换了传统的普整管芯和开关管管芯，采用肖特基芯粒的整流桥具有反向恢复时间小，且肖特基整流桥的正向电压值和反向电压值都比较小，故本实用新型所述的肖特基整流桥相比与传统的整流桥性能更好，可靠性更好。
附图说明
图1为本实用新型的结构示意图；
图2为本实用新型的局部剖视图；
图中，1为第一框架料片，2为封装本体，3为第二框架料片，4为肖特基芯粒。
具体实施方式
下面结合附图和具体实施例对本实用新型进一步说明。
如图1和图2所示的肖特基整流桥，其包括对称设置的第一框架料片1和第二框架料片2，还包括连接在第一框架料片1和第二框架料片2之间的肖特基芯粒，以及对肖特基芯粒进行保护的封装本体2。
所述的封装本体2的材料为环氧塑封料。
本实用新型的生产工艺如下：先将第二框架料片放置于焊接舟内，然后置点胶机点胶；将肖特基芯粒用铝制硬化处理的预焊筛盘分好向(P面全部都翻转成同一个方向)放置于预焊舟内；散上相应的焊片，放到隧道炉内进行预焊；将预焊好的肖特基芯粒(预焊面完全呈现在同一个方向)用吸笔转移到点胶好的第二框架料片上完成装架；接着将焊接舟的上模小心地与下模重叠，水平端放，等待入炉焊接；焊接好之后进行模压成型；最后将成型好的管子电镀形成肖特基整流桥的成品。
综上所述，本实用新型通过运用肖特基芯粒替换了传统的普整管芯和开关管管芯，采用肖特基芯粒的整流桥具有反向恢复时间小，且肖特基整流桥的正向电压值和反向电压值都比较小，故本实用新型所述的肖特基整流桥相比与传统的整流桥性能更好，可靠性更好。

Claims (2)

1.肖特基整流桥，其包括对称设置的第一框架料片和第二框架料片，其特征在于：还包括连接在第一框架料片和第二框架料片之间的肖特基芯粒，以及对肖特基芯粒进行保护的封装本体。
2.根据权利要求1所述的肖特基整流桥，其特征在于：所述的封装本体的材料为环氧塑封料。
CN2011205412669U 2011-12-22 2011-12-22 肖特基整流桥 Expired - Lifetime CN202394972U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011205412669U CN202394972U (zh) 2011-12-22 2011-12-22 肖特基整流桥

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011205412669U CN202394972U (zh) 2011-12-22 2011-12-22 肖特基整流桥

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CN202394972U true CN202394972U (zh) 2012-08-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108109983A (zh) * 2017-12-14 2018-06-01 常州星海电子股份有限公司 一种汽车专用整流二极管结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108109983A (zh) * 2017-12-14 2018-06-01 常州星海电子股份有限公司 一种汽车专用整流二极管结构
CN108109983B (zh) * 2017-12-14 2024-05-10 常州星海电子股份有限公司 一种汽车专用整流二极管结构

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Effective date of registration: 20161227

Address after: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou

Patentee after: Changzhou Star Sea Electronics Co., Ltd.

Address before: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1

Patentee before: Changzhou Star Sea Electronics Co., Ltd.

Patentee before: Changzhou Star Sea Technolgy Co.,Ltd.

CP03 Change of name, title or address

Address after: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1

Patentee after: Changzhou Xinghai Electronic Limited by Share Ltd

Address before: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou

Patentee before: Changzhou Star Sea Electronics Co., Ltd.

CP03 Change of name, title or address
CX01 Expiry of patent term

Granted publication date: 20120822

CX01 Expiry of patent term