CN202394972U - 肖特基整流桥 - Google Patents
肖特基整流桥 Download PDFInfo
- Publication number
- CN202394972U CN202394972U CN2011205412669U CN201120541266U CN202394972U CN 202394972 U CN202394972 U CN 202394972U CN 2011205412669 U CN2011205412669 U CN 2011205412669U CN 201120541266 U CN201120541266 U CN 201120541266U CN 202394972 U CN202394972 U CN 202394972U
- Authority
- CN
- China
- Prior art keywords
- schottky
- rectifier bridge
- utility
- material sheet
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205412669U CN202394972U (zh) | 2011-12-22 | 2011-12-22 | 肖特基整流桥 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205412669U CN202394972U (zh) | 2011-12-22 | 2011-12-22 | 肖特基整流桥 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202394972U true CN202394972U (zh) | 2012-08-22 |
Family
ID=46669877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011205412669U Expired - Lifetime CN202394972U (zh) | 2011-12-22 | 2011-12-22 | 肖特基整流桥 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202394972U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108109983A (zh) * | 2017-12-14 | 2018-06-01 | 常州星海电子股份有限公司 | 一种汽车专用整流二极管结构 |
-
2011
- 2011-12-22 CN CN2011205412669U patent/CN202394972U/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108109983A (zh) * | 2017-12-14 | 2018-06-01 | 常州星海电子股份有限公司 | 一种汽车专用整流二极管结构 |
CN108109983B (zh) * | 2017-12-14 | 2024-05-10 | 常州星海电子股份有限公司 | 一种汽车专用整流二极管结构 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161227 Address after: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou Patentee after: Changzhou Star Sea Electronics Co., Ltd. Address before: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee before: Changzhou Star Sea Electronics Co., Ltd. Patentee before: Changzhou Star Sea Technolgy Co.,Ltd. |
|
CP03 | Change of name, title or address |
Address after: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee after: Changzhou Xinghai Electronic Limited by Share Ltd Address before: 1, Tianmu Lake Road, Xinbei District, Jiangsu, Changzhou Patentee before: Changzhou Star Sea Electronics Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CX01 | Expiry of patent term |
Granted publication date: 20120822 |
|
CX01 | Expiry of patent term |